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Contents

README

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BAS321-QF

Nexperia · Diodes - General Purpose · SOD-323

BAS321-QF from Nexperia, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the diode; the marking bar on the SOD323 package indicates the cathode (Fig. 8 note 1).
2 A passive Anode of the diode; device limits apply, including a continuous forward current IF of max. 250 mA (Table 5).

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 250 V 3
Reverse voltage VR 200 V 3
Forward current IF 250 mA [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Non-repetitive peak forward current IFSM 1.7 A tp = 10 ms; square wave; Tj(init) = 25 °C 3
Non-repetitive peak forward current IFSM 9 A tp = 1 µs; square wave; Tj(init) = 25 °C 3
Non-repetitive peak forward current IFSM 3 A tp = 100 µs; square wave; Tj(init) = 25 °C 3
Repetitive peak forward current IFRM 625 mA tp ≤ 0.5 ms; δ ≤ 0.25 3
Total power dissipation Ptot 300 mW Tamb = 25 °C; [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Junction temperature Tj 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 366 K/W [1] Device mounted on FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Thermal resistance from junction to solder point Rth(j-sp) 130 K/W [2] Soldering point of cathode tab 3
Forward voltage VF 1 V IF = 100 mA; Tj = 25 °C 4
Forward voltage VF 1.25 V IF = 200 mA; Tj = 25 °C 4
Reverse current IR 100 nA VR = 200 V; Tj = 25 °C 4
Reverse current IR 100 µA VR = 200 V; Tj = 150 °C 4
Diode capacitance Cd 2 pF VR = 0 V; f = 1 MHz; Tj = 25 °C 4
Reverse recovery time trr 50 ns IF = 30 mA; IR = 30 mA; RL = 100 Ω; IR(meas) = 3 mA; Tj = 25 °C 4

CAD (KiCad official)

  • Symbol: BAS321-QF
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: bas321-qf-etched.step / bas321-qf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bas321-qf.step / bas321-qf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (10 pp, sha256 743313bc9e2e4d09, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF