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AUIRFS3206TRL
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Infineon Technologies MOSFETs, D2PAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AUIRFS3206TRL
Infineon Technologies · MOSFETs · D2PAK
AUIRFS3206TRL from Infineon Technologies, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the MOSFET with VGS rated ±20 V max and a gate threshold voltage of 2.0 V min to 4.0 V max at ID = 150µA. |
| 2 | D | passive | Drain (also the tab); rated VDSS 60 V, with 210 A silicon-limited and 120 A package-limited continuous current at TC = 25°C. |
| 3 | S | passive | Source; the body diode runs from source to drain, with continuous source current up to 210 A and VSD max 1.3 V at IS = 75 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | D2PAK |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 60 | V | VGS = 0V, ID = 250µA | 2 | ||
| Static Drain-to-Source On-Resistance | RDS(on) | 2.4 | 3 | mΩ | VGS = 10V, ID = 75A | 2 | |
| Gate Threshold Voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 150µA | 2 | |
| Forward Transconductance | gfs | 210 | S | VDS = 50V, ID = 75A | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 20 | µA | VDS = 60V, VGS = 0V | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 250 | µA | VDS = 48V, VGS = 0V, TJ = 125°C | 2 | ||
| Gate-to-Source Forward Leakage | IGSS | 100 | nA | VGS = 20V | 2 | ||
| Gate-to-Source Reverse Leakage | IGSS | -100 | nA | VGS = -20V | 2 | ||
| Total Gate Charge | Qg | 120 | 170 | nC | ID = 75A, VDS = 30V, VGS = 10V | 2 | |
| Continuous Source Current (Body Diode) | IS | 210 | A | MOSFET symbol showing integral reverse p-n junction diode | 2 | ||
| Pulsed Source Current (Body Diode) | ISM | 840 | A | 2 | |||
| Diode Forward Voltage | VSD | 1.3 | V | TJ = 25°C, IS = 75A, VGS = 0V | 2 | ||
| Reverse Recovery Time | trr | 33 | 50 | ns | TJ = 25°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 | |
| Reverse Recovery Time | trr | 37 | 56 | ns | TJ = 125°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 | |
| Reverse Recovery Charge | Qrr | 41 | 62 | nC | TJ = 25°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 | |
| Reverse Recovery Charge | Qrr | 53 | 80 | nC | TJ = 125°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 | |
| Continuous Drain Current, Silicon Limited | ID | 210 | A | TC = 25°C, VGS @ 10V (Silicon Limited) | 1 | ||
| Continuous Drain Current, Silicon Limited | ID | 150 | A | TC = 100°C, VGS @ 10V (Silicon Limited) | 1 | ||
| Continuous Drain Current, Package Limited | ID | 120 | A | TC = 25°C, VGS @ 10V (Package Limited) | 1 | ||
| Pulsed Drain Current | IDM | 840 | A | 1 | |||
| Maximum Power Dissipation | PD | 300 | W | TC = 25°C | 1 | ||
| Linear Derating Factor | 2 | W/°C | 1 | ||||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Single Pulse Avalanche Energy | EAS | 170 | mJ | Thermally Limited | 1 | ||
| Peak Diode Recovery | dv/dt | 5 | V/ns | 1 | |||
| Operating Junction Temperature | TJ | -55 | 175 | °C | Operating Junction | 1 | |
| Soldering Temperature | 300 | °C | 10 seconds, 1.6mm from case | 1 | |||
| Junction-to-Case Thermal Resistance | RθJC | 0.5 | °C/W | 1 | |||
| Junction-to-Ambient Thermal Resistance (PCB Mount), D2-Pak | RθJA | 40 | °C/W | PCB mount, D2-Pak | 1 |
CAD (KiCad official)
- Symbol:
AUIRFS3206TRL - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: D2PAK (KiCad packages3D, STEP)
- 3D model files:
auirfs3206trl-etched.step/auirfs3206trl-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);auirfs3206trl.step/auirfs3206trl.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (11 pp, sha256
6746c8ad7d5d6ddf, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AUIRFS3206TRL
**Infineon Technologies** · MOSFETs · D2PAK
AUIRFS3206TRL from Infineon Technologies, in a D2PAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the MOSFET with VGS rated ±20 V max and a gate threshold voltage of 2.0 V min to 4.0 V max at ID = 150µA. |
| 2 | D | passive | Drain (also the tab); rated VDSS 60 V, with 210 A silicon-limited and 120 A package-limited continuous current at TC = 25°C. |
| 3 | S | passive | Source; the body diode runs from source to drain, with continuous source current up to 210 A and VSD max 1.3 V at IS = 75 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | D2PAK |
| Category | Transistors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 60 | | | V | VGS = 0V, ID = 250µA | 2 |
| Static Drain-to-Source On-Resistance | RDS(on) | | 2.4 | 3 | mΩ | VGS = 10V, ID = 75A | 2 |
| Gate Threshold Voltage | VGS(th) | 2 | | 4 | V | VDS = VGS, ID = 150µA | 2 |
| Forward Transconductance | gfs | 210 | | | S | VDS = 50V, ID = 75A | 2 |
| Drain-to-Source Leakage Current | IDSS | | | 20 | µA | VDS = 60V, VGS = 0V | 2 |
| Drain-to-Source Leakage Current | IDSS | | | 250 | µA | VDS = 48V, VGS = 0V, TJ = 125°C | 2 |
| Gate-to-Source Forward Leakage | IGSS | | | 100 | nA | VGS = 20V | 2 |
| Gate-to-Source Reverse Leakage | IGSS | | | -100 | nA | VGS = -20V | 2 |
| Total Gate Charge | Qg | | 120 | 170 | nC | ID = 75A, VDS = 30V, VGS = 10V | 2 |
| Continuous Source Current (Body Diode) | IS | | | 210 | A | MOSFET symbol showing integral reverse p-n junction diode | 2 |
| Pulsed Source Current (Body Diode) | ISM | | | 840 | A | | 2 |
| Diode Forward Voltage | VSD | | | 1.3 | V | TJ = 25°C, IS = 75A, VGS = 0V | 2 |
| Reverse Recovery Time | trr | | 33 | 50 | ns | TJ = 25°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 |
| Reverse Recovery Time | trr | | 37 | 56 | ns | TJ = 125°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 |
| Reverse Recovery Charge | Qrr | | 41 | 62 | nC | TJ = 25°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 |
| Reverse Recovery Charge | Qrr | | 53 | 80 | nC | TJ = 125°C, VDD = 51V, IF = 75A, di/dt = 100A/µs | 2 |
| Continuous Drain Current, Silicon Limited | ID | | | 210 | A | TC = 25°C, VGS @ 10V (Silicon Limited) | 1 |
| Continuous Drain Current, Silicon Limited | ID | | | 150 | A | TC = 100°C, VGS @ 10V (Silicon Limited) | 1 |
| Continuous Drain Current, Package Limited | ID | | | 120 | A | TC = 25°C, VGS @ 10V (Package Limited) | 1 |
| Pulsed Drain Current | IDM | | | 840 | A | | 1 |
| Maximum Power Dissipation | PD | | | 300 | W | TC = 25°C | 1 |
| Linear Derating Factor | | | | 2 | W/°C | | 1 |
| Gate-to-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 170 | mJ | Thermally Limited | 1 |
| Peak Diode Recovery | dv/dt | | | 5 | V/ns | | 1 |
| Operating Junction Temperature | TJ | -55 | | 175 | °C | Operating Junction | 1 |
| Soldering Temperature | | | | 300 | °C | 10 seconds, 1.6mm from case | 1 |
| Junction-to-Case Thermal Resistance | RθJC | | | 0.5 | °C/W | | 1 |
| Junction-to-Ambient Thermal Resistance (PCB Mount), D2-Pak | RθJA | | | 40 | °C/W | PCB mount, D2-Pak | 1 |
## CAD (KiCad official)
- Symbol: `AUIRFS3206TRL`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: D2PAK (KiCad packages3D, STEP)
- 3D model files: `auirfs3206trl-etched.step` / `auirfs3206trl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `auirfs3206trl.step` / `auirfs3206trl.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Infineon Technologies datasheet](docs/auirfs3206trl-datasheet.pdf) (11 pp, sha256 `6746c8ad7d5d6ddf`, retrieved 2026-10-30, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/auirfs3206trl-datasheet.pdf)