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AUIRF7343QTR
Public Made by Adomby adom
Infineon Technologies MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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AUIRF7343QTR
Infineon Technologies · MOSFETs · SO-8
AUIRF7343QTR from Infineon Technologies, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of the N-channel MOSFET (55V, 4.7A continuous at TA=25°C, RDS(on) 0.050 ohm max at VGS=10V). |
| 2 | G1 | input | Gate of the N-channel MOSFET with logic-level drive, rated for VGS of ±20V maximum. |
| 3 | S2 | passive | Source of the P-channel MOSFET (-55V, -3.4A continuous at TA=25°C, RDS(on) 0.105 ohm max at VGS=-10V). |
| 4 | G2 | input | Gate of the P-channel MOSFET with logic-level drive, rated for VGS of ±20V maximum. |
| 5 | D2 | passive | Drain of the P-channel MOSFET, rated for VDS of -55V and pulsed drain current of -27A. |
| 6 | D2 | passive | Drain of the P-channel MOSFET, rated for VDS of -55V and pulsed drain current of -27A. |
| 7 | D1 | passive | Drain of the N-channel MOSFET, rated for VDS of 55V and pulsed drain current of 38A. |
| 8 | D1 | passive | Drain of the N-channel MOSFET, rated for VDS of 55V and pulsed drain current of 38A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SO-8 |
| Category | Transistors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage N-Ch | VDS | 55 | V | N-Channel | 1 | ||
| Drain-Source Voltage P-Ch | VDS | -55 | V | P-Channel | 1 | ||
| Continuous Drain Current N-Ch | ID | 4.7 | A | TA = 25°C, VGS @ 10V | 1 | ||
| Continuous Drain Current P-Ch | ID | -3.4 | A | TA = 25°C, VGS @ 10V | 1 | ||
| Continuous Drain Current N-Ch | ID | 3.8 | A | TA = 70°C, VGS @ 10V | 1 | ||
| Continuous Drain Current P-Ch | ID | -2.7 | A | TA = 70°C, VGS @ 10V | 1 | ||
| Pulsed Drain Current N-Ch | IDM | 38 | A | 1 | |||
| Pulsed Drain Current P-Ch | IDM | -27 | A | 1 | |||
| Maximum Power Dissipation | PD | 2 | W | TA = 25°C | 1 | ||
| Maximum Power Dissipation | PD | 1.3 | W | TA = 70°C | 1 | ||
| Single Pulse Avalanche Energy N-Ch | EAS | 72 | mJ | Thermally limited, N-Channel | 1 | ||
| Single Pulse Avalanche Energy P-Ch | EAS | 114 | mJ | Thermally limited, P-Channel | 1 | ||
| Avalanche Current N-Ch | IAR | 4.7 | A | N-Channel | 1 | ||
| Avalanche Current P-Ch | IAR | -3.4 | A | P-Channel | 1 | ||
| Repetitive Avalanche Energy | EAR | 0.2 | mJ | 1 | |||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Peak Diode Recovery dv/dt N-Ch | dv/dt | 5 | V/ns | N-Channel | 1 | ||
| Peak Diode Recovery dv/dt P-Ch | dv/dt | -5 | V/ns | P-Channel | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 62.5 | °C/W | PCB Mount, steady state | 1 | ||
| Drain-to-Source Breakdown Voltage N-Ch | V(BR)DSS | 55 | V | VGS = 0V, ID = 250µA | 2 | ||
| Drain-to-Source Breakdown Voltage P-Ch | V(BR)DSS | -55 | V | VGS = 0V, ID = -250µA | 2 | ||
| Breakdown Voltage Temp. Coefficient N-Ch | ΔV(BR)DSS/ΔTJ | 0.059 | V/°C | Reference to 25°C, ID = 1mA | 2 | ||
| Breakdown Voltage Temp. Coefficient P-Ch | ΔV(BR)DSS/ΔTJ | 0.054 | V/°C | Reference to 25°C, ID = -1mA | 2 | ||
| Static On-Resistance N-Ch | RDS(on) | 0.043 | 0.05 | Ω | VGS = 10V, ID = 4.7A | 2 | |
| Static On-Resistance N-Ch | RDS(on) | 0.056 | 0.065 | Ω | VGS = 4.5V, ID = 3.8A | 2 | |
| Static On-Resistance P-Ch | RDS(on) | 0.095 | 0.105 | Ω | VGS = -10V, ID = -3.4A | 2 | |
| Static On-Resistance P-Ch | RDS(on) | 0.15 | 0.17 | Ω | VGS = -4.5V, ID = -2.7A | 2 | |
| Gate Threshold Voltage N-Ch | VGS(th) | 1 | V | VDS = VGS, ID = 250µA | 2 | ||
| Gate Threshold Voltage P-Ch | VGS(th) | -1 | V | VDS = VGS, ID = -250µA | 2 | ||
| Forward Transconductance N-Ch | gfs | 7.9 | S | VDS = 10V, ID = 4.5A | 2 | ||
| Forward Transconductance P-Ch | gfs | 3.3 | S | VDS = -10V, ID = -3.1A | 2 | ||
| Drain-to-Source Leakage Current N-Ch | IDSS | 2 | µA | VDS = 55V, VGS = 0V | 2 | ||
| Drain-to-Source Leakage Current P-Ch | IDSS | -2 | µA | VDS = -55V, VGS = 0V | 2 | ||
| Drain-to-Source Leakage Current N-Ch | IDSS | 25 | µA | VDS = 55V, VGS = 0V, TJ = 55°C | 2 | ||
| Drain-to-Source Leakage Current P-Ch | IDSS | -25 | µA | VDS = -55V, VGS = 0V, TJ = 55°C | 2 | ||
| Gate-to-Source Forward Leakage | IGSS | -100 | 100 | nA | VGS = ± 20V | 2 | |
| Gate-to-Source Reverse Leakage | IGSS | -100 | 100 | nA | VGS = ± 20V | 2 | |
| Total Gate Charge N-Ch | Qg | 24 | 36 | nC | ID = 4.5A, VDS = 44V, VGS = 10V | 2 | |
| Total Gate Charge P-Ch | Qg | 26 | 38 | nC | ID = -3.1A, VDS = -44V, VGS = -10V | 2 | |
| Gate-to-Source Charge N-Ch | Qgs | 2.3 | 3.4 | nC | ID = 4.5A, VDS = 44V, VGS = 10V | 2 | |
| Gate-to-Source Charge P-Ch | Qgs | 3 | 4.5 | nC | ID = -3.1A, VDS = -44V, VGS = -10V | 2 | |
| Gate-to-Drain Charge N-Ch | Qgd | 7 | 10 | nC | ID = 4.5A, VDS = 44V, VGS = 10V | 2 | |
| Gate-to-Drain Charge P-Ch | Qgd | 8.4 | 13 | nC | ID = -3.1A, VDS = -44V, VGS = -10V | 2 | |
| Turn-On Delay Time N-Ch | td(on) | 8.3 | 12 | ns | VDD = 28V, ID = 1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Turn-On Delay Time P-Ch | td(on) | 14 | 22 | ns | VDD = -28V, ID = -1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Rise Time N-Ch | tr | 3.2 | 4.8 | ns | VDD = 28V, ID = 1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Rise Time P-Ch | tr | 10 | 15 | ns | VDD = -28V, ID = -1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Turn-Off Delay Time N-Ch | td(off) | 32 | 48 | ns | VDD = 28V, ID = 1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Turn-Off Delay Time P-Ch | td(off) | 43 | 64 | ns | VDD = -28V, ID = -1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Fall Time N-Ch | tf | 13 | 20 | ns | VDD = 28V, ID = 1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Fall Time P-Ch | tf | 22 | 32 | ns | VDD = -28V, ID = -1.0A, RG = 6.0Ω, RD = 28Ω | 2 | |
| Continuous Source Current N-Ch (Body Diode) | IS | 2 | A | 2 | |||
| Continuous Source Current P-Ch (Body Diode) | IS | -2 | A | 2 | |||
| Pulsed Source Current N-Ch (Body Diode) | ISM | 38 | A | 2 | |||
| Pulsed Source Current P-Ch (Body Diode) | ISM | -27 | A | 2 | |||
| Diode Forward Voltage N-Ch | VSD | 0.7 | 1.2 | V | TJ = 25°C, IS = 2.0A, VGS = 0V | 2 | |
| Diode Forward Voltage P-Ch | VSD | -0.8 | -1.2 | V | TJ = 25°C, IS = -2.0A, VGS = 0V | 2 | |
| Reverse Recovery Time N-Ch | trr | 60 | 90 | ns | TJ = 25°C, IF = 2.0A, di/dt = 100A/µs | 2 | |
| Reverse Recovery Time P-Ch | trr | 54 | 80 | ns | TJ = 25°C, IF = -2.0A, di/dt = 100A/µs | 2 | |
| Reverse Recovery Charge N-Ch | Qrr | 120 | 170 | nC | TJ = 25°C, IF = 2.0A, di/dt = 100A/µs | 2 | |
| Reverse Recovery Charge P-Ch | Qrr | 85 | 130 | nC | TJ = 25°C, IF = -2.0A, di/dt = 100A/µs | 2 |
CAD (KiCad official)
- Symbol:
AUIRF7343QTR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
auirf7343qtr-etched.step/auirf7343qtr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);auirf7343qtr.step/auirf7343qtr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (11 pp, sha256
2bc094a8bfed7775, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).