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ATF1502ASL-25AU44

Microchip Tech · CPLD/FPGA · TQFP-44(10x10)

ATF1502ASL-25AU44 from Microchip Tech, in a TQFP-44(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O/TDI bidirectional I/O pin (macrocell 4) that serves as JTAG TDI for boundary-scan/ISP when JTAG is enabled, with optional pull-up.
2 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 5) with programmable pin-keeper and slew rate.
3 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 6) with programmable pin-keeper and slew rate.
4 GND power_in Ground pin.
5 PD1/I/O bidirectional I/O pin that can act as power-down pin PD1; when high with power-down enabled, supply current drops below 5mA and the pin cannot be used as logic input or output.
6 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 8) with programmable pin-keeper and slew rate.
7 I/O/TMS bidirectional I/O pin (macrocell 9) that serves as JTAG TMS for boundary-scan/ISP when JTAG is enabled, with optional pull-up.
8 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 10) with programmable pin-keeper and slew rate.
9 VCC power_in Device supply pin, +5V (5V ±5% commercial, ±10% industrial).
10 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 11) with programmable pin-keeper and slew rate.
11 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 12) with programmable pin-keeper and slew rate.
12 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 13) with programmable pin-keeper and slew rate.
13 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 14) with programmable pin-keeper and slew rate.
14 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 15) with programmable pin-keeper and slew rate.
15 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 16) with programmable pin-keeper and slew rate.
16 GND power_in Ground pin.
17 VCC power_in Device supply pin, +5V (5V ±5% commercial, ±10% industrial).
18 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 32) with programmable pin-keeper and slew rate.
19 PD2/I/O bidirectional I/O pin that can act as power-down pin PD2; when high with power-down enabled, supply current drops below 5mA and the pin cannot be used as logic input or output.
20 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 30) with programmable pin-keeper and slew rate.
21 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 29) with programmable pin-keeper and slew rate.
22 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 28) with programmable pin-keeper and slew rate.
23 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 27) with programmable pin-keeper and slew rate.
24 GND power_in Ground pin.
25 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 26) with programmable pin-keeper and slew rate.
26 I/O/TCK bidirectional I/O pin (macrocell 25) that serves as JTAG TCK for boundary-scan/ISP when JTAG is enabled.
27 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 24) with programmable pin-keeper and slew rate.
28 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 23) with programmable pin-keeper and slew rate.
29 VCC power_in Device supply pin, +5V (5V ±5% commercial, ±10% industrial).
30 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 22) with programmable pin-keeper and slew rate.
31 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 21) with programmable pin-keeper and slew rate.
32 I/O/TDO bidirectional I/O pin (macrocell 20) that serves as JTAG TDO for boundary-scan/ISP when JTAG is enabled.
33 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 19) with programmable pin-keeper and slew rate.
34 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 18) with programmable pin-keeper and slew rate.
35 GCLK3/I/O bidirectional I/O pin (macrocell 32 per block diagram) that can also serve as global clock input GCLK3.
36 GND power_in Ground pin.
37 GCLK1/I input Dedicated input that can serve as global clock GCLK1 or general logic input.
38 OE1/I input Dedicated input that can serve as global output enable OE1 or general logic input.
39 GCLR/I input Dedicated input that can serve as global clear (register reset) or general logic input.
40 GCLK2/OE2/I input Dedicated input that can serve as global clock GCLK2, global output enable OE2, or general logic input.
41 VCC power_in Device supply pin, +5V (5V ±5% commercial, ±10% industrial).
42 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 1) with programmable pin-keeper and slew rate.
43 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 2) with programmable pin-keeper and slew rate.
44 I/O bidirectional General-purpose bidirectional I/O pin (macrocell 3) with programmable pin-keeper and slew rate.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package TQFP-44(10x10)
Category Embedded Processors & Controllers
Pins 44

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC (5.0V) Power Supply VCC -10 10 % Industrial, 5.0V nominal 10
Operating Temperature (Ambient) -40 85 C Industrial 10
Temperature Under Bias -40 85 C 10
Storage Temperature -65 150 C 10
Voltage on Any Pin with Respect to Ground -2 7 V See note 1 10
Voltage on Input Pins with Respect to Ground During Programming -2 14 V See note 1 10
Programming Voltage with Respect to Ground -2 14 V See note 1 10
Input Pin Capacitance CIN 8 10 pF VIN = 0V; f = 1MHz 10
I/O Pin Capacitance CI/O 8 10 pF VOUT = 0V; f = 1MHz 10
Input or I/O Low Leakage Current IIL -2 -10 μA VIN = VCC 11
Input or I/O High Leakage Current IIH 2 10 μA 11
Tri-state Output Off-state Current IOZ -40 40 μA VO = VCC or GND 11
Power Supply Current, Standby (L mode) ICC1 10 μA VCC = Max; VIN = 0, VCC; L Mode; Ind. 11
Power Supply Current, Power-down Mode ICC2 1 5 mA VCC = Max; VIN = 0, VCC; PD Mode 11
Reduced-power Mode Supply Current, Standby ICC3 40 mA VCC = Max; VIN = 0, VCC; Std Mode; Ind. 11
Input Low Voltage VIL -0.3 0.8 V 11
Input High Voltage VIH 2 V 11
Output Low Voltage (TTL) VOL 0.45 V VIN = VIH or VIL; VCC = Min, IOL = 12mA; Ind. 11
Output Low Voltage (CMOS) VOL 0.2 V VIN = VIH or VIL; VCC = Min, IOL = 0.1mA; Ind. 11
Output High Voltage (TTL) VOH 2.4 V VIN = VIH or VIL; VCC = Min, IOH = -4.0mA 11
Input or Feedback to Non-registered Output tPD1 25 ns 12
I/O Input or Feedback to Non-registered Feedback tPD2 25 ns 12
Global Clock Setup Time tSU 20 ns 12
Global Clock Hold Time tH 0 ns 12
Global Clock Setup Time of Fast Input tFSU 5 ns 12
Global Clock Hold Time of Fast Input tFH 2 MHz 12
Global Clock to Output Delay tCOP 13 ns 12
Global Clock High Time tCH 7 ns 12
Global Clock Low Time tCL 7 ns 12
Array Clock Setup Time tASU 5 ns 12
Array Clock Hold Time tAH 6 ns 12
Array Clock Output Delay tACOP 25 ns 12
Array Clock High Time tACH 10 ns 12
Array Clock Low Time tACL 10 ns 12
Minimum Clock Global Period tCNT 22 ns 12
Maximum Internal Global Clock Frequency fCNT 50 MHz 12
Minimum Array Clock Period tACNT 22 ns 12
Maximum Internal Array Clock Frequency fACNT 50 MHz 12
Maximum Clock Frequency fMAX 60 MHz 12
Input Pad and Buffer Delay tIN 2 ns 12
I/O Input Pad and Buffer Delay tIO 2 ns 12
Fast Input Delay tFIN 2 ns 12
Foldback Term Delay tSEXP 12 ns 12
Cascade Logic Delay tPEXP 2 ns 12
Logic Array Delay tLAD 8 ns 12
Logic Control Delay tLAC 8 ns 12
Internal Output Enable Delay tIOE 4 ns 12
Output Buffer and Pad Delay tOD1 6 ns Slow slew rate = OFF; VCC = 5.0V; CL = 35pF 12
Output Buffer Enable Delay tZX1 10 ns Slow slew rate = OFF; VCCIO = 5.0V; CL = 35pF 13
Output Buffer Enable Delay tZX3 12 ns Slow slew rate = ON; VCCIO = 5.0V/3.3V; CL = 35pF 13
Output Buffer Disable Delay tXZ 8 ns CL = 5pF 13
Register Setup Time tSU 6 ns 13
Register Hold Time tH 6 ns 13
Register Setup Time of Fast Input tFSU 3 ns 13
Register Hold Time of Fast Input tFH 5 ns 13
Array Clock Delay tIC 8 ns 13
Register Enable Time tEN 8 ns 13
Register Clear Time tCLR 6 ns 13
Reduced-power Adder tRPA 15 ns 13

CAD (KiCad official)

  • Symbol: ATF1502ASL-25AU44
  • Footprint: Package_QFP:TQFP-44_10x10mm_P0.8mm
  • 3D model: TQFP-44(10x10) (KiCad packages3D, STEP)
  • 3D model files: atf1502asl-25au44-etched.step / atf1502asl-25au44-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); atf1502asl-25au44.step / atf1502asl-25au44.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (29 pp, sha256 1abab0d93d034ad0, retrieved 2026-11-07, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF