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AT25DF021A-SSHN-T
Public Made by Adomby adom
Adesto Technologies NOR FLASH, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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AT25DF021A-SSHN-T
Adesto Technologies · NOR FLASH · SOIC-8
AT25DF021A-SSHN-T from Adesto Technologies, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Chip select, active low: asserting CS selects the device, deasserting it deselects the device into standby (not Deep Power-Down) with SO high-impedance, and a high-to-low transition starts an operation. |
| 2 | SO (I/O1) | bidirectional | Serial output clocked out on the falling edge of SCK, becoming I/O1 during Dual-Output Read, and held in high-impedance whenever CS is deasserted. |
| 3 | WP | input | Write protect input controlling the hardware locking feature; internally pulled high and recommended to be externally connected to VCC whenever possible. |
| 4 | GND | power_in | Ground reference for the power supply; should be connected to the system ground. |
| 5 | SI (I/O0) | bidirectional | Serial input for all data, command and address input, latched on the rising edge of SCK, becoming I/O0 during Dual-Output Read and ignored when the device is deselected. |
| 6 | SCK | input | Serial clock: SI is latched on the rising edge of SCK and SO is clocked out on the falling edge of SCK. |
| 7 | HOLD | input | Pauses serial communication while asserted (CS asserted and SCK low to start); SCK and SI transitions are ignored and SO is high-impedance; internally pulled high. |
| 8 | VCC | power_in | Device power supply; operations at invalid VCC voltages may produce spurious results and should not be attempted (supply range 1.65V to 3.6V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Adesto Technologies |
| Package | SOIC-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Ultra-Deep Power-Down Current | IUDPD | 0.2 | 0.6 | µA | CS = VCC. All other inputs at 0V or VCC | 38 | |
| Deep Power-Down Current | IDPD | 4.5 | 15 | µA | CS = VCC. All other inputs at 0V or VCC | 38 | |
| Standby Current | ISB | 25 | 40 | µA | CS = VCC. All other inputs at 0V or VCC | 38 | |
| Active Current, Low Power Read (03h, 0Bh) | ICC1 | 4.5 | 6 | mA | f = 1MHz; IOUT = 0mA | 38 | |
| Active Current, Low Power Read (03h, 0Bh) | ICC1 | 5 | 7 | mA | f = 20MHz; IOUT = 0mA | 38 | |
| Active Current, Read Operation | ICC2 | 5 | 7 | mA | f = 50MHz; IOUT = 0mA | 38 | |
| Active Current, Program Operation | ICC3 | 11 | 14 | mA | CS = VCC | 38 | |
| Active Current, Erase Operation | ICC4 | 11 | 14 | mA | CS = VCC | 38 | |
| Input Load Current | ILI | 1 | µA | All inputs at CMOS levels | 38 | ||
| Output Leakage Current | ILO | 1 | µA | All inputs at CMOS levels | 38 | ||
| Output Low Voltage | VOL | 0.2 | 0.4 | V | IOL = 100µA | 38 | |
| Maximum Clock Frequency for All Operations (including 0Bh opcode) | fCLK | 104 | MHz | 39 | |||
| Maximum Clock Frequency for 03h Opcode (Read Array, Low Frequency) | fRDLF | 25 | MHz | 39 | |||
| Maximum Clock Frequency for 3B Opcode | fRDDO | 50 | MHz | 39 | |||
| Clock High Time | tCLKH | 4.5 | ns | 39 | |||
| Clock Low Time | tCLKL | 4 | ns | 39 | |||
| Chip Select High Time | tCSH | 35 | ns | 39 | |||
| Chip Select Low Setup Time (relative to Clock) | tCSLS | 6 | ns | 39 | |||
| Chip Select Low Hold Time (relative to Clock) | tCSLH | 6 | ns | 39 | |||
| Chip Select High Setup Time (relative to Clock) | tCSHS | 6 | ns | 39 | |||
| Chip Select High Hold Time (relative to Clock) | tCSHH | 6 | ns | 39 | |||
| Data In Setup Time | tDS | 2 | ns | 39 | |||
| Data In Hold Time | tDH | 1 | ns | 39 | |||
| Output Disable Time | tDIS | 8 | ns | 39 | |||
| Output Valid Time | tV | 7.5 | ns | 39 | |||
| Output Hold Time | tOH | 0 | ns | 39 | |||
| HOLD Low Setup Time (relative to Clock) | tHLS | 6 | ns | 39 | |||
| HOLD Low Hold Time (relative to Clock) | tHLH | 6 | ns | 39 | |||
| HOLD High Setup Time (relative to Clock) | tHHS | 6 | ns | 39 | |||
| HOLD High Hold Time (relative to Clock) | tHHH | 6 | ns | 39 | |||
| HOLD Low to Output High-Z | tHLQZ | 7 | ns | 39 | |||
| HOLD High to Output Low-Z | tHHQX | 7 | ns | 39 | |||
| Write Protect Setup Time | tWPS | 20 | ns | 39 | |||
| Write Protect Hold Time | tWPH | 100 | ns | 39 | |||
| Chip Select High to Deep Power-Down | tEDPD | 3 | µs | 39 | |||
| Chip Select High to Ultra Deep Power-Down | tEUDPD | 3 | µs | 40 | |||
| Software Reset Time | tSWRST | 40 | µs | 40 | |||
| Minimum Chip Select Low to Exit Ultra Deep Power-Down | tCSLU | 20 | ns | 40 | |||
| Exit Ultra Deep Power-Down Time | tXUDPD | 70 | µs | 40 | |||
| Chip Select High to Standby Mode | tRDPD | 8 | µs | 40 | |||
| Page Program Time 256 Bytes | tPP | 1.25 | 2.5 | ms | 40 | ||
| Page Erase Time 256 Bytes | tPE | 6 | 20 | ms | 40 | ||
| Block Erase Time 4 Kbytes | tBLKE | 40 | 60 | ms | 40 | ||
| Block Erase Time 32 Kbytes | tBLKE | 250 | 500 | ms | 40 | ||
| Block Erase Time 64 Kbytes | tBLKE | 500 | 1000 | ms | 40 | ||
| Chip Erase Time | tCHPE | 2 | 4 | sec | 40 | ||
| OTP Security Register Program Time | tOTPP | 400 | 950 | µs | 40 | ||
| VCC for device initialization | VPWD | 1 | V | 41 | |||
| Minimum duration for device initialization | tPWD | 300 | µs | 41 | |||
| Minimum VCC to chip select low time for Read command | tVCSL | 70 | µs | 41 | |||
| VCC rise time | tVR | 1 | 500000 | µs/V | 41 | ||
| Power on reset voltage | VPOR | 1.45 | 1.6 | V | 41 | ||
| Power up delay time before Program or Erase is allowed | tPUW | 3 | ms | 41 | |||
| Temperature under Bias | -55 | 125 | °C | 37 | |||
| Storage Temperature | -65 | 150 | °C | 37 | |||
| All Input Voltages (including NC Pins) with Respect to Ground | -0.6 | 4.1 | V | 37 | |||
| Operating Temperature (Case) Industrial | -40 | 85 | °C | 37 | |||
| VCC Power Supply | VCC | 1.65 | 3.6 | V | 37 |
CAD (KiCad official)
- Symbol:
AT25DF021A-SSHN-T - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
at25df021a-sshn-t-etched.step/at25df021a-sshn-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);at25df021a-sshn-t.step/at25df021a-sshn-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Adesto Technologies datasheet (51 pp, sha256
02b96d961a99319b, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).