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AT24C512N

Public Made by Adom

by adom

HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AT24C512N

HGSEMI · EEPROM · DIP-8

AT24C512N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input hardwired to GND or VCC to set the device address (up to eight devices per bus); internally pulled down to GND if left floating.
2 A1 input Device address input hardwired to GND or VCC to set the device address (up to eight devices per bus); internally pulled down to GND if left floating.
3 NC unconnected No connect pin.
4 GND power_in Ground.
5 SDA bidirectional Serial data pin, bidirectional and open-drain driven, may be wire-ORed with other open-drain or open-collector devices, normally pulled high externally.
6 SCL input Serial clock input that positive-edge clocks data into and negative-edge clocks data out of the EEPROM.
7 WP input Write protect input: connected to GND allows normal write operations, connected to VCC inhibits all writes to the memory; internally pulled down to GND if left floating.
8 VCC power_in Power supply, VCC = 1.8V to 5.5V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage 6.5 V 8
Input / Output Voltage -0.3 0.3 V 8
Operating Ambient Temperature -40 85 ℃ 8
Storage Temperature -65 150 ℃ 8
Lead Temperature 260 ℃ Soldering, 10 seconds 8
Operating Supply Voltage (recommended range) VCC 1.7 5.5 V TA = -40℃ to +85℃ 8
Supply Voltage VCC1 1.8 5.5 V 8
Supply Voltage VCC2 2.5 5.5 V 8
Supply Voltage VCC3 2.7 5.5 V 8
Supply Voltage VCC4 4.5 5.5 V 8
Supply Current ICC1 0.4 1 mA VCC = 5.0V, READ at 400 kHz 8
Supply Current ICC2 2 3 mA VCC = 5.0V, WRITE at 400 kHz 8
Standby Current ISB1 0.6 1 µA VCC = 1.7V, VIN = VCC or VSS 8
Standby Current ISB2 1 2 µA VCC = 2.5V, VIN = VCC or VSS 8
Standby Current ISB4 1 5 µA VCC = 5.0V, VIN = VCC or VSS 8
Input Leakage Current ILI 0.1 3 µA VIN = VCC or VSS 8
Output Leakage Current ILO 0.05 3 µA VOUT = VCC or VSS 8
Input Low Level VIL -0.3 V 8
Output Low Level VOL3 0.4 V VCC = 5.0V, IOL = 3.0 mA 8
Output Low Level VOL1 0.2 V VCC = 1.7V, IOL = 0.15 mA 8
Input/Output Capacitance (SDA) CI/O 8 pF VI/O = 0V 8
Input Capacitance (A0, A1, A2, SCL) CIN 6 pF VIN = 0V 8
Clock Frequency, SCL fSCL 400 kHz 1.7-volt column 9
Clock Frequency, SCL fSCL 1000 kHz 5.0-volt column 9
Clock Pulse Width Low tLOW 1.2 µs 1.7-volt column 9
Clock Pulse Width Low tLOW 0.6 µs 5.0-volt column 9
Clock Pulse Width High tHIGH 0.6 µs 1.7-volt column 9
Clock Pulse Width High tHIGH 0.4 µs 5.0-volt column 9
Noise Suppression Time tI 50 ns 1.7-volt column 9
Clock Low to Data Out Valid tAA 0.1 0.9 µs 1.7-volt column 9
Clock Low to Data Out Valid tAA 0.09 0.9 µs 5.0-volt column 9
Bus free time before a new transmission can start tBUF 1.2 µs 1.7-volt column 9
Bus free time before a new transmission can start tBUF 0.5 µs 5.0-volt column 9
Start Hold Time tHD.STA 0.6 µs 1.7-volt column 9
Start Hold Time tHD.STA 0.25 µs 5.0-volt column 9
Start Setup Time tSU.STA 0.6 µs 1.7-volt column 9
Start Setup Time tSU.STA 0.25 µs 5.0-volt column 9
Data In Hold Time tHD.DAT 0 0 µs 1.7-volt column 9
Data In Hold Time tHD.DAT 0 0 µs 5.0-volt column 9
Data In Setup Time tSU.DAT 100 0 ns 1.7-volt column 9
Data In Setup Time tSU.DAT 100 0 ns 5.0-volt column 9
Inputs Rise Time tR 0.3 µs 1.7-volt column 9
Inputs Fall Time tF 300 ns 1.7-volt column 9
Stop Setup Time tSU.STO 0.6 µs 1.7-volt column 9
Stop Setup Time tSU.STO 0.25 µs 5.0-volt column 9
Data Out Hold Time tDH 50 ns 1.7-volt column 9
Write Cycle Time tWR 5 5 ms 1.7-volt column 9
Write Cycle Time tWR 5 ms 5.0-volt column 9

CAD (KiCad official)

  • Symbol: AT24C512N
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c512n-etched.step / at24c512n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c512n.step / at24c512n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 39a46b933a720adf, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF