component
AT24C128AN
Public Made by Adomby adom
HGSEMI EEPROM, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| docs | 3d ago |
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| at24c128an-etched.step | 3d ago |
| at24c128an-hero.glb | 3d ago |
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AT24C128AN
HGSEMI · EEPROM · DIP-8
AT24C128AN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input, hard-wired; the A2/A1/A0 pins allow up to eight devices on one bus and float to logic low internally. |
| 2 | A1 | input | Device address input, hard-wired; the A2/A1/A0 pins allow up to eight devices on one bus and float to logic low internally. |
| 3 | A2 | input | Device address input, hard-wired; the A2/A1/A0 pins allow up to eight devices on one bus and float to logic low internally. |
| 4 | GND | power_in | Ground. |
| 5 | SDA | bidirectional | Bidirectional open-drain serial data pin that may be wire-ORed with other open-drain or open-collector devices and needs an external pull-up. |
| 6 | SCL | input | Serial clock input that clocks data in on the positive edge and out on the negative edge. |
| 7 | WP | input | Write protect: normal read/write when connected to GND, and the full 128K array is write-protected when connected to VCC. |
| 8 | VCC | power_in | Power supply, 1.7V to 5.5V operating range (absolute maximum -0.3V to +6.5V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC Supply Voltage | -0.3 | 6.5 | V | 9 | |||
| Operating Ambient Temperature | -40 | 85 | ℃ | 9 | |||
| Storage Temperature | -65 | 150 | ℃ | 9 | |||
| Lead Temperature (Soldering) | 245 | ℃ | 10 seconds | 9 | |||
| Supply Voltage | VCC1 | 1.7 | 5.5 | V | 9 | ||
| Supply Voltage | VCC2 | 2.5 | 5.5 | V | 9 | ||
| Supply Voltage | VCC3 | 2.7 | 5.5 | V | 9 | ||
| Supply Voltage | VCC4 | 4.5 | 5.5 | V | 9 | ||
| Supply Current (READ) | ICC1 | 0.4 | 1 | mA | VCC=5.0V; READ at 400KHZ | 9 | |
| Supply Current (WRITE) | ICC2 | 2 | 3 | mA | VCC=5.0V; WRITE at 400KHZ | 9 | |
| Supply Current (standby) | ISB | 0.6 | 1 | μA | VCC=1.7V; VIN=VCC or VSS | 9 | |
| Supply Current (standby) | ISB | 1 | 2 | μA | VCC=2.5V; VIN=VCC or VSS | 9 | |
| Supply Current (standby) | ISB | 2 | 5 | μA | VCC=5.0V; VIN=VCC or VSS | 9 | |
| Input Leakage Current | IL | 0.1 | 3 | μA | VIN=VCC or VSS | 9 | |
| Output Leakage Current | IL | 0.05 | 3 | μA | VOUT=VCC or VSS | 9 | |
| Input Low Level | VIL1 | -0.3 | V | VCC=1.8V to 5.5V | 9 | ||
| Output Low Level | VOL3 | 0.4 | V | VCC=5.0V; IOL=3.0mA | 9 | ||
| Output Low Level | VOL1 | 0.2 | V | VCC=1.7V; IOL=0.15mA | 9 | ||
| Input/Output Capacitance (SDA) | CI/O | 8 | pF | TA=25℃, f=1.0 MHz, VCC=+1.7V; VIO=0V | 10 | ||
| Input Capacitance (SCL) | CIN | 6 | pF | TA=25℃, f=1.0 MHz, VCC=+1.7V; VIN=0V | 10 | ||
| Clock Frequency, SCL | fSCL | 400 | KHZ | 1.7V≤VCC﹤2.5V | 10 | ||
| Clock Frequency, SCL | fSCL | 1000 | KHZ | 2.5V≤VCC﹤5.5V | 10 | ||
| Clock Pulse Width Low | tLOW | 1.2 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Clock Pulse Width Low | tLOW | 0.6 | μs | 2.5V≤VCC﹤5.5V | 10 | ||
| Clock Pulse Width High | tHIGH | 0.6 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Clock Pulse Width High | tHIGH | 0.4 | μs | 2.5V≤VCC﹤5.5V | 10 | ||
| Noise Suppression Time | tI | 50 | ns | 1.7V≤VCC﹤2.5V | 10 | ||
| Clock Low to Data Out Valid | tAA | 0.1 | 0.9 | μs | 1.7V≤VCC﹤2.5V | 10 | |
| Clock Low to Data Out Valid | tAA | 0.05 | 0.9 | μs | 2.5V≤VCC﹤5.5V | 10 | |
| Time the bus must be free before a new transmission can start | tBUF | 1.2 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Time the bus must be free before a new transmission can start | tBUF | 0.5 | μs | 2.5V≤VCC﹤5.5V | 10 | ||
| Start Hold Time | tHD:STA | 0.6 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Start Hold Time | tHD:STA | 0.25 | μs | 2.5V≤VCC﹤5.5V | 10 | ||
| Start Setup Time | tSU:DAT | 0.6 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Start Setup Time | tSU:DAT | 0.25 | μs | 2.5V≤VCC﹤5.5V | 10 | ||
| Data In Hold Time | tHD:DAT | 0 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Data in Setup Time | tSU:DAT | 100 | ns | 1.7V≤VCC﹤2.5V | 10 | ||
| Input Rise Time | tR | 0.3 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Input Fall Time | tF | 0.3 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Stop Setup Time | tSu:STO | 0.6 | μs | 1.7V≤VCC﹤2.5V | 10 | ||
| Stop Setup Time | tSu:STO | 0.25 | μs | 2.5V≤VCC﹤5.5V | 10 | ||
| Data Out Hold Time | tDH | 50 | ns | 1.7V≤VCC﹤2.5V | 10 | ||
| Write Cycle Time | twR | 3.3 | 5 | ms | 1.7V≤VCC﹤2.5V | 10 |
CAD (KiCad official)
- Symbol:
AT24C128AN - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
at24c128an-etched.step/at24c128an-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);at24c128an.step/at24c128an.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (15 pp, sha256
ed9771daf6536261, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).