# AT24C08CMM

**HGSEMI** · EEPROM · MSOP-8

AT24C08CMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connect. Leave floating or tie to any convenient net; no internal connection on the DIP-8/SOP-8/MSOP-8/TSSOP-8 variants. |
| 2 | NC | unconnected | No connect. Leave floating or tie to any convenient net; no internal connection on the DIP-8/SOP-8/MSOP-8/TSSOP-8 variants. |
| 3 | E2 | input | Device address input (A11 slave address bit). Tie to VCC or GND to select one of two device addresses on a shared 2-wire bus (used for compatibility with legacy 2-wire EEPROMs). Internally pulled down to GND if left floating. |
| 4 | GND | power_in | Ground reference for the power supply. Connect to the system ground. |
| 5 | SDA | bidirectional | I2C serial data. Open-drain bidirectional I/O; requires an external pull-up resistor to VCC. Data is latched into the device on the rising edge of SCL and driven out on the falling edge of SCL. |
| 6 | SCL | input | I2C serial clock input. Master-driven clock used to synchronize data transfers on SDA; supports up to 400 kHz standard-mode and 1 MHz high-speed operation. |
| 7 | WP | input | Hardware write-protect input. Tie to VCC to write-protect the entire memory array and Identification Page (device becomes read-only); tie to GND to enable writes. Internally pulled down to GND if left floating. |
| 8 | VCC | power_in | Device power supply, 1.7 V to 5.5 V. Bypass to GND with a decoupling capacitor close to the pin. Operating current is 0.5 mA (write) / 0.2 mA (read); standby is 1 μA maximum. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Memory |
| Pins | 8 |

## Ordering variants

- `AT24C08CMM`
- `AT24C08CMM/TR`
- `AT24C08CMMN`
- `AT24C08CMMM/TR`
- `AT24C08CMMMT/TR`
- `AT24C08CMMDQ/TR`
- `AT24C08CMMM5/TR`

## CAD (KiCad official)

- Symbol: `AT24C08CMM`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `at24c08cmm-etched.step` / `at24c08cmm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `at24c08cmm.step` / `at24c08cmm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](docs/at24c08cmm-datasheet.pdf) (25 pp, sha256 `e1c182cb482476f4`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/at24c08cmm-datasheet.pdf)