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Contents

README

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AT24C08CMM

HGSEMI · EEPROM · MSOP-8

AT24C08CMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connect. Leave floating or tie to any convenient net; no internal connection on the DIP-8/SOP-8/MSOP-8/TSSOP-8 variants.
2 NC unconnected No connect. Leave floating or tie to any convenient net; no internal connection on the DIP-8/SOP-8/MSOP-8/TSSOP-8 variants.
3 E2 input Device address input (A11 slave address bit). Tie to VCC or GND to select one of two device addresses on a shared 2-wire bus (used for compatibility with legacy 2-wire EEPROMs). Internally pulled down to GND if left floating.
4 GND power_in Ground reference for the power supply. Connect to the system ground.
5 SDA bidirectional I2C serial data. Open-drain bidirectional I/O; requires an external pull-up resistor to VCC. Data is latched into the device on the rising edge of SCL and driven out on the falling edge of SCL.
6 SCL input I2C serial clock input. Master-driven clock used to synchronize data transfers on SDA; supports up to 400 kHz standard-mode and 1 MHz high-speed operation.
7 WP input Hardware write-protect input. Tie to VCC to write-protect the entire memory array and Identification Page (device becomes read-only); tie to GND to enable writes. Internally pulled down to GND if left floating.
8 VCC power_in Device power supply, 1.7 V to 5.5 V. Bypass to GND with a decoupling capacitor close to the pin. Operating current is 0.5 mA (write) / 0.2 mA (read); standby is 1 μA maximum.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package MSOP-8
Category Memory
Pins 8

Ordering variants

  • AT24C08CMM
  • AT24C08CMM/TR
  • AT24C08CMMN
  • AT24C08CMMM/TR
  • AT24C08CMMMT/TR
  • AT24C08CMMDQ/TR
  • AT24C08CMMM5/TR

CAD (KiCad official)

  • Symbol: AT24C08CMM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: at24c08cmm-etched.step / at24c08cmm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); at24c08cmm.step / at24c08cmm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (25 pp, sha256 e1c182cb482476f4, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF