# AT24C08CM

**HGSEMI** · EEPROM · SOP-8

AT24C08CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection. Leave floating or tie to ground; do not use as a signal via. |
| 2 | NC | unconnected | No internal connection. Leave floating or tie to ground; do not use as a signal via. |
| 3 | E2 | input | Device Address Input. Selects one of two device address values so up to two AT24C08C devices can share a single 2-wire bus (E2 must match address bit E2 in the device address byte). Tie directly to VCC or GND; if left floating, an internal pull-down forces the pin to GND. |
| 4 | GND | power_in | Ground reference for the power supply. Connect to the system ground. |
| 5 | SDA | bidirectional | Serial Data. Open-drain bidirectional data line used to serially transfer address and data between the master and the EEPROM; requires an external pull-up resistor to VCC. Schmitt-trigger input with integrated spike-suppression filter. |
| 6 | SCL | input | Serial Clock. Clock input from the master; data on SDA is latched into the device on the rising edge and clocked out on the falling edge. Supports up to 400 kHz standard and 1 MHz high-speed operation. |
| 7 | WP | input | Write Protect. Tie to VCC to hardware write-protect the entire memory array (device becomes read-only); tie to GND to enable writes. Left floating, an internal pull-down forces the pin to GND. |
| 8 | VCC | power_in | Device power supply, 1.7 V to 5.5 V. Bypass locally with a 0.1 uF ceramic capacitor to GND. Operation outside the specified range may produce spurious results. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |

## Ordering variants

- `AT24C08CM/TR`
- `AT24C08CMAT24C08CN`
- `AT24C08CMM/TR`
- `AT24C08CMT/TR`
- `AT24C08CMAT24C08CDQ/TR`
- `AT24C08CM5/TR`

## CAD (KiCad official)

- Symbol: `AT24C08CM`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `at24c08cm-etched.step` / `at24c08cm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `at24c08cm.step` / `at24c08cm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](docs/at24c08cm-datasheet.pdf) (25 pp, sha256 `e1c182cb482476f4`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/at24c08cm-datasheet.pdf)