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ASMD1812-300
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Shenzhen JDT Fuse Resettable Fuses, 1812. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ASMD1812-300
Shenzhen JDT Fuse · Resettable Fuses · 1812
ASMD1812-300 from Shenzhen JDT Fuse, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal of the resettable PTC fuse, a non-polarized tin-plated nickel-copper pad; ASMD1812-300 is rated Ihold 3.00 A and Itrip 5.00 A at 25°C, Vmax 8.00 V dc, Imax 100 A. |
| 2 | 2 | passive | Second terminal of the resettable PTC fuse, a non-polarized tin-plated nickel-copper pad interchangeable with the first; ASMD1812-300 is rated Ihold 3.00 A and Itrip 5.00 A at 25°C, Vmax 8.00 V dc, Imax 100 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JDT Fuse |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (V max) | Vmax | 8 | V dc | at rated current (Imax) | 3 | ||
| Maximum fault current (I max) | Imax | 100 | A | at rated voltage (Vmax) | 3 | ||
| Hold current (I hold) @25°C | Ihold | 3 | A | 25°C still air; maximum current device will not trip | 3 | ||
| Trip current (I trip) @25°C | Itrip | 5 | A | 25°C still air; minimum current at which device always trips | 3 | ||
| Device resistance prior to tripping (Ri min) | Ri min | 0.01 | Ω | 25°C, prior to tripping | 3 | ||
| Maximum device resistance (R1max) | R1max | 0.04 | Ω | measured one hour post reflow | 3 | ||
| Maximum time to trip | 4 | sec | at 100 A current | 3 | |||
| Resistance change, passive aging | -5 | 5 | % | +85°C, 1000 hrs; ±5% typical | 4 | ||
| Resistance change, humidity aging | -5 | 5 | % | +85°C, 85% R.H., 168 hours; ±5% typical | 4 | ||
| Resistance change, thermal shock | -33 | 33 | % | +85°C to -40°C, 20 times; ±33% typical | 4 | ||
| Ambient operating temperature | -40 | 85 | °C | 4 | |||
| Maximum surface temperature in tripped state | 125 | °C | device in tripped state | 4 | |||
| Storage temperature | 40 | °C | storage conditions | 7 | |||
| Storage relative humidity | 70 | % R.H. | storage conditions | 7 | |||
| Peak reflow temperature (Tp), Pb-free | Tp | 260 | °C | Pb-free reflow profile; devices may not meet performance if profile exceeded | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal pad materials：Tin-plated Nickel-Copper | 6 |
CAD (KiCad official)
- Symbol:
ASMD1812-300 - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
asmd1812-300-etched.step/asmd1812-300-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);asmd1812-300.step/asmd1812-300.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen JDT Fuse datasheet (10 pp, sha256
9a262a458868b11e, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ASMD1812-300
**Shenzhen JDT Fuse** · Resettable Fuses · 1812
ASMD1812-300 from Shenzhen JDT Fuse, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal of the resettable PTC fuse, a non-polarized tin-plated nickel-copper pad; ASMD1812-300 is rated Ihold 3.00 A and Itrip 5.00 A at 25°C, Vmax 8.00 V dc, Imax 100 A. |
| 2 | 2 | passive | Second terminal of the resettable PTC fuse, a non-polarized tin-plated nickel-copper pad interchangeable with the first; ASMD1812-300 is rated Ihold 3.00 A and Itrip 5.00 A at 25°C, Vmax 8.00 V dc, Imax 100 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JDT Fuse |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (V max) | Vmax | | | 8 | V dc | at rated current (Imax) | 3 |
| Maximum fault current (I max) | Imax | | | 100 | A | at rated voltage (Vmax) | 3 |
| Hold current (I hold) @25°C | Ihold | | | 3 | A | 25°C still air; maximum current device will not trip | 3 |
| Trip current (I trip) @25°C | Itrip | 5 | | | A | 25°C still air; minimum current at which device always trips | 3 |
| Device resistance prior to tripping (Ri min) | Ri min | 0.01 | | | Ω | 25°C, prior to tripping | 3 |
| Maximum device resistance (R1max) | R1max | | | 0.04 | Ω | measured one hour post reflow | 3 |
| Maximum time to trip | | | | 4 | sec | at 100 A current | 3 |
| Resistance change, passive aging | | -5 | | 5 | % | +85°C, 1000 hrs; ±5% typical | 4 |
| Resistance change, humidity aging | | -5 | | 5 | % | +85°C, 85% R.H., 168 hours; ±5% typical | 4 |
| Resistance change, thermal shock | | -33 | | 33 | % | +85°C to -40°C, 20 times; ±33% typical | 4 |
| Ambient operating temperature | | -40 | | 85 | °C | | 4 |
| Maximum surface temperature in tripped state | | | | 125 | °C | device in tripped state | 4 |
| Storage temperature | | | | 40 | °C | storage conditions | 7 |
| Storage relative humidity | | | | 70 | % R.H. | storage conditions | 7 |
| Peak reflow temperature (Tp), Pb-free | Tp | | | 260 | °C | Pb-free reflow profile; devices may not meet performance if profile exceeded | 6 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal pad materials：Tin-plated Nickel-Copper | 6 |
## CAD (KiCad official)
- Symbol: `ASMD1812-300`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `asmd1812-300-etched.step` / `asmd1812-300-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `asmd1812-300.step` / `asmd1812-300.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Shenzhen JDT Fuse datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588883624896290816) (10 pp, sha256 `9a262a458868b11e`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/asmd1812-300-datasheet.pdf)