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ASMD1812-300

Public Made by Adom

by adom

Shenzhen JDT Fuse Resettable Fuses, 1812. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ASMD1812-300

Shenzhen JDT Fuse · Resettable Fuses · 1812

ASMD1812-300 from Shenzhen JDT Fuse, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive First terminal of the resettable PTC fuse, a non-polarized tin-plated nickel-copper pad; ASMD1812-300 is rated Ihold 3.00 A and Itrip 5.00 A at 25°C, Vmax 8.00 V dc, Imax 100 A.
2 2 passive Second terminal of the resettable PTC fuse, a non-polarized tin-plated nickel-copper pad interchangeable with the first; ASMD1812-300 is rated Ihold 3.00 A and Itrip 5.00 A at 25°C, Vmax 8.00 V dc, Imax 100 A.

Key specifications

Parameter Value
Manufacturer Shenzhen JDT Fuse
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum operating voltage (V max) Vmax 8 V dc at rated current (Imax) 3
Maximum fault current (I max) Imax 100 A at rated voltage (Vmax) 3
Hold current (I hold) @25°C Ihold 3 A 25°C still air; maximum current device will not trip 3
Trip current (I trip) @25°C Itrip 5 A 25°C still air; minimum current at which device always trips 3
Device resistance prior to tripping (Ri min) Ri min 0.01 Ω 25°C, prior to tripping 3
Maximum device resistance (R1max) R1max 0.04 Ω measured one hour post reflow 3
Maximum time to trip 4 sec at 100 A current 3
Resistance change, passive aging -5 5 % +85°C, 1000 hrs; ±5% typical 4
Resistance change, humidity aging -5 5 % +85°C, 85% R.H., 168 hours; ±5% typical 4
Resistance change, thermal shock -33 33 % +85°C to -40°C, 20 times; ±33% typical 4
Ambient operating temperature -40 85 °C 4
Maximum surface temperature in tripped state 125 °C device in tripped state 4
Storage temperature 40 °C storage conditions 7
Storage relative humidity 70 % R.H. storage conditions 7
Peak reflow temperature (Tp), Pb-free Tp 260 °C Pb-free reflow profile; devices may not meet performance if profile exceeded 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin Terminal pad materials：Tin-plated Nickel-Copper 6

CAD (KiCad official)

  • Symbol: ASMD1812-300
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: asmd1812-300-etched.step / asmd1812-300-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); asmd1812-300.step / asmd1812-300.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JDT Fuse datasheet (10 pp, sha256 9a262a458868b11e, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF