# ASL2507SHNY

**NXP Semicon** · LED Drivers · HVQFN-32(5x5)

ASL2507SHNY from NXP Semicon, in a HVQFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SNL1 | input | Phase 1 sense low input of the boost converter, used for the phase 1 current sense. |
| 2 | SNH1 | input | Phase 1 sense high input of the boost converter, used for the phase 1 current sense. |
| 3 | GND | power_in | Ground. |
| 4 | G1 | output | Phase 1 gate driver output for the external low-side N-channel MOSFET, driven from the internally regulated VGG supply. |
| 5 | VGG | power_out | Gate driver supply, internally regulated and adjustable, used to supply the external MOSFET gate drivers. |
| 6 | G2 | output | Phase 2 gate driver output for the external low-side N-channel MOSFET, driven from the internally regulated VGG supply. |
| 7 | GND | power_in | Ground. |
| 8 | SNH2 | input | Phase 2 sense high input of the boost converter, used for the phase 2 current sense. |
| 9 | SNL2 | input | Phase 2 sense low input of the boost converter, used for the phase 2 current sense. |
| 10 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 11 | FB1 | input | Feedback input for output 1 of the boost converter, used to regulate the output voltage 1. |
| 12 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 13 | VBAT | power_in | Battery supply input of the device. |
| 14 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 15 | FB2 | input | Feedback input for output 2 of the boost converter, used to regulate the output voltage 2. |
| 16 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 17 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 18 | i.c. | passive | Internally connected; the datasheet requires this pin to be connected to GND. |
| 19 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 20 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 21 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 22 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 23 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 24 | i.c. | passive | Internally connected; the datasheet requires this pin to be connected to GND. |
| 25 | n.c. | unconnected | Not connected internally; can be left floating or connected to any voltage level. |
| 26 | SDI | input | SPI data input from the external microcontroller. |
| 27 | SCLK | input | SPI clock input from the external microcontroller. |
| 28 | CSB | input | SPI chip select input (active low) from the external microcontroller. |
| 29 | EN | input | Enable input; the device is in reset mode when EN is LOW. |
| 30 | VCC | power_in | External 5 V supply input. |
| 31 | SDO | output | SPI data output to the external microcontroller. |
| 32 | GND | power_in | Chip ground; also the exposed center pad, which should be soldered to board ground. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | NXP Semicon |
| Package | HVQFN-32(5x5) |
| Category | Nixie Tube Driver/LED Driver |
| Pins | 33 |

## CAD (KiCad official)

- Symbol: `ASL2507SHNY`
- Footprint: `Package_DFN_QFN:HVQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm`
- 3D model: HVQFN-32(5x5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.85 mm tall, datasheet A, nominal). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files: `asl2507shny-etched.step` / `asl2507shny-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `asl2507shny.step` / `asl2507shny.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [NXP Semicon datasheet](https://www.nxp.com/docs/en/data-sheet/ASL2507SHNY.pdf) (56 pp, sha256 `76615a7763e70f5e`, retrieved 2026-11-12, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/asl2507shny-datasheet.pdf)