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ASL2507SHNY

NXP Semicon · LED Drivers · HVQFN-32(5x5)

ASL2507SHNY from NXP Semicon, in a HVQFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SNL1 input Phase 1 sense low input of the boost converter, used for the phase 1 current sense.
2 SNH1 input Phase 1 sense high input of the boost converter, used for the phase 1 current sense.
3 GND power_in Ground.
4 G1 output Phase 1 gate driver output for the external low-side N-channel MOSFET, driven from the internally regulated VGG supply.
5 VGG power_out Gate driver supply, internally regulated and adjustable, used to supply the external MOSFET gate drivers.
6 G2 output Phase 2 gate driver output for the external low-side N-channel MOSFET, driven from the internally regulated VGG supply.
7 GND power_in Ground.
8 SNH2 input Phase 2 sense high input of the boost converter, used for the phase 2 current sense.
9 SNL2 input Phase 2 sense low input of the boost converter, used for the phase 2 current sense.
10 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
11 FB1 input Feedback input for output 1 of the boost converter, used to regulate the output voltage 1.
12 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
13 VBAT power_in Battery supply input of the device.
14 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
15 FB2 input Feedback input for output 2 of the boost converter, used to regulate the output voltage 2.
16 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
17 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
18 i.c. passive Internally connected; the datasheet requires this pin to be connected to GND.
19 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
20 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
21 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
22 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
23 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
24 i.c. passive Internally connected; the datasheet requires this pin to be connected to GND.
25 n.c. unconnected Not connected internally; can be left floating or connected to any voltage level.
26 SDI input SPI data input from the external microcontroller.
27 SCLK input SPI clock input from the external microcontroller.
28 CSB input SPI chip select input (active low) from the external microcontroller.
29 EN input Enable input; the device is in reset mode when EN is LOW.
30 VCC power_in External 5 V supply input.
31 SDO output SPI data output to the external microcontroller.
32 GND power_in Chip ground; also the exposed center pad, which should be soldered to board ground.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package HVQFN-32(5x5)
Category Nixie Tube Driver/LED Driver
Pins 33

CAD (KiCad official)

  • Symbol: ASL2507SHNY
  • Footprint: Package_DFN_QFN:HVQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm
  • 3D model: HVQFN-32(5x5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.85 mm tall, datasheet A, nominal). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: asl2507shny-etched.step / asl2507shny-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); asl2507shny.step / asl2507shny.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (56 pp, sha256 76615a7763e70f5e, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF