# ASDM540G-R

**Ascend** · MOSFETs · TO-263

ASDM540G-R from Ascend, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate control input with a maximum gate-source voltage of ±20 V and a threshold of 1 V min to 2.4 V max at 250 µA. |
| 2 | D | passive | Drain terminal rated for 100 V drain-source voltage and 33 A continuous drain current. |
| 3 | S | passive | Source terminal, the return path for the 33 A continuous drain current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Ascend |
| Package | TO-263 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 100 |  |  | V | VGS=0V ID=250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | μA | VDS=100V,VGS=0V | 2 |
| Gate-Body Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | 1 | 1.6 | 2.4 | V | VDS=VGS,ID=250μA | 2 |
| Drain-Source On-State Resistance | RDS(ON) |  | 31 | 35 | mΩ | VGS=10V, ID=12A | 2 |
| Drain-Source On-State Resistance | RDS(ON) |  | 33 | 45 | mΩ | VGS=4.5V, ID=12A | 2 |
| Diode Forward Voltage | VSD |  |  | 1.2 | V | VGS=0V,IS=20A | 2 |
| Drain-Source Voltage | VDS |  |  | 100 | V |  | 1 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V |  | 1 |
| Drain Current-Continuous | ID |  |  | 33 | A |  | 1 |
| Drain Current-Pulsed | IDM |  |  | 132 | A | Note 1 | 1 |
| Maximum Power Dissipation | PD |  |  | 70 | W | Tc=25℃ | 1 |
| Single pulse avalanche energy | EAS |  |  | 96 | mJ | Note 2 | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 |  | 175 | ℃ |  | 1 |
| Thermal Resistance, Junction-to-Case | RθJC |  | 1.15 |  | ℃/W |  | 1 |
| Thermal Resistance, Junction-to-Ambient | RθJA |  | 40 |  | ℃/W | PCB mount | 1 |

## CAD (KiCad official)

- Symbol: `ASDM540G-R`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `asdm540g-r-etched.step` / `asdm540g-r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `asdm540g-r.step` / `asdm540g-r.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Ascend datasheet](docs/asdm540g-r-datasheet.pdf) (8 pp, sha256 `d05a020b6ff69724`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/asdm540g-r-datasheet.pdf)