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Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
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verification.json Verified: Published by the parts factory: tier lcsc, 3 pins · Ray

ASDM540G-R

Ascend · MOSFETs · TO-263

ASDM540G-R from Ascend, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate control input with a maximum gate-source voltage of ±20 V and a threshold of 1 V min to 2.4 V max at 250 µA.
2 D passive Drain terminal rated for 100 V drain-source voltage and 33 A continuous drain current.
3 S passive Source terminal, the return path for the 33 A continuous drain current.

Key specifications

Parameter Value
Manufacturer Ascend
Package TO-263
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=100V,VGS=0V 2
Gate-Body Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Gate Threshold Voltage VGS(th) 1 1.6 2.4 V VDS=VGS,ID=250μA 2
Drain-Source On-State Resistance RDS(ON) 31 35 mΩ VGS=10V, ID=12A 2
Drain-Source On-State Resistance RDS(ON) 33 45 mΩ VGS=4.5V, ID=12A 2
Diode Forward Voltage VSD 1.2 V VGS=0V,IS=20A 2
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 33 A 1
Drain Current-Pulsed IDM 132 A Note 1 1
Maximum Power Dissipation PD 70 W Tc=25℃ 1
Single pulse avalanche energy EAS 96 mJ Note 2 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 175 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 1.15 ℃/W 1
Thermal Resistance, Junction-to-Ambient RθJA 40 ℃/W PCB mount 1

CAD (KiCad official)

  • Symbol: ASDM540G-R
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: asdm540g-r-etched.step / asdm540g-r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); asdm540g-r.step / asdm540g-r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Ascend datasheet (8 pp, sha256 d05a020b6ff69724, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF