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AP9567GH

APEC Advanced Power Elec · MOSFETs · TO-252

AP9567GH from APEC Advanced Power Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the P-channel MOSFET; gate-source voltage rating is ±25V with threshold VGS(th) of -1 to -3V.
2 D passive Drain of the P-channel MOSFET; VDS rated -40V and continuous drain current -22A at TC=25°C.
3 S passive Source of the P-channel MOSFET; body diode forward voltage max -1.2V at IS=-15A.

Key specifications

Parameter Value
Manufacturer APEC Advanced Power Elec
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -40 V VGS=0V, ID=-250uA 2
Static Drain-Source On-Resistance (VGS=-10V) RDS(ON) 50 mΩ VGS=-10V, ID=-15A 2
Static Drain-Source On-Resistance (VGS=-4.5V) RDS(ON) 70 mΩ VGS=-4.5V, ID=-8A 2
Gate Threshold Voltage VGS(th) -1 -3 V VDS=VGS, ID=-250uA 2
Drain-Source Leakage Current IDSS -1 uA VDS=-40V, VGS=0V 2
Drain-Source Leakage Current (Tj=125℃) IDSS -250 uA VDS=-32V, VGS=0V 2
Gate-Source Leakage IGSS 100 nA VGS=+25V, VDS=0V 2
Total Gate Charge Qg 12 19 nC ID=-15A 2
Input Capacitance Ciss 880 1400 pF VGS=0V 2
Gate Resistance Rg 5 8 Ω f=1.0MHz 2
Forward On Voltage (source-drain diode) VSD -1.2 V IS=-15A, VGS=0V 2
Drain-Source Voltage VDS -40 V @Tj=25℃ unless otherwise specified 1
Gate-Source Voltage VGS 25 V @Tj=25℃ unless otherwise specified 1
Drain Current, VGS @ 10V (TC=25℃) ID@TC=25℃ -22 A VGS @ 10V 1
Drain Current, VGS @ 10V (TC=100℃) ID@TC=100℃ -14 A VGS @ 10V 1
Pulsed Drain Current IDM -50 A Pulse width limited by max. junction temperature 1
Total Power Dissipation PD@TC=25℃ 34.7 W TC=25℃ 1
Linear Derating Factor 0.28 W/℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Maximum Thermal Resistance, Junction-case Rthj-c 3.6 ℃/W 1
Maximum Thermal Resistance, Junction-ambient (PCB mount) Rthj-a 62.5 ℃/W PCB mount, surface mounted on 1 in2 copper pad of FR4 board 1
Maximum Thermal Resistance, Junction-ambient Rthj-a 110 ℃/W 1

CAD (KiCad official)

  • Symbol: AP9567GH
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: ap9567gh-etched.step / ap9567gh-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap9567gh.step / ap9567gh.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: APEC Advanced Power Elec datasheet (7 pp, sha256 e5c1079e6ebb3131, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF