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AP7365-25EG-13

Diodes Incorporated · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-223

AP7365-25EG-13 from Diodes Incorporated, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated voltage output pin, to be bypassed to ground through a 1µF MLCC capacitor.
2 GND power_in Ground pin, also connected to the package tab (GND (TAB)).
3 IN power_in Voltage input pin (2V to 6V recommended), to be bypassed to ground through at least a 1µF MLCC capacitor.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-223
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage Accuracy VOUT -2 2 % TA = -40°C to +85°C, IOUT = 10% of IOUT-Max 3
Load Regulation VOUT/VOUT -1 1 % VIN = (VOUT +1V) to VIN-Max, IOUT = 1mA to 600mA 3
Line Regulation VOUT/VIN/V 0.02 0.2 %/V VIN = (VOUT +1V) to VIN-Max, VEN = VIN, IOUT = 1mA 3
Dropout Voltage VDROPOUT 300 400 mV VOUT ≥ 2.5V, IOUT = 600mA 3
Input Quiescent Current IQ 35 80 µA VEN = VIN, IOUT = 0mA 3
Input Shutdown Current ISHDN 0.1 1 µA VEN = 0V, IOUT = 0mA 3
Input Leakage Current ILEAK 0.1 1 µA VEN = 0V, OUT grounded 3
Current Limit ILIMIT 0.8 1.4 A VIN = VIN-Min to VIN-Max, VOUT/ROUT = 2.5A 3
EN Input Logic Low Voltage VIL 0.4 V VIN = VIN-Min to VIN-Max 3
EN Input Logic High Voltage VIH 1.4 V VIN = VIN-Min to VIN-Max 3
EN Input Current IEN -1 1 µA VIN = 0V or VIN-Max 3
Input Voltage (recommended operating) VIN 2 6 V 3
Output Current (recommended operating) IOUT 0 600 mA Note 4: stable regulated output without load current 3
Operating Ambient Temperature TA -40 85 °C 3
ESD Protection, Human Body Model ESD HBM 2000 V 3
ESD Protection, Machine Model ESD MM 200 V 3
Input Voltage (absolute maximum) VIN 6.5 V 3
Storage Temperature Range TST -65 150 °C 3
Maximum Junction Temperature TJ 150 °C 3
Thermal Resistance Junction-to-Ambient, SOT223 θJA 142 °C/W Note 7: FR-4 PCB, 1oz copper, minimum recommended pad layout 4
Thermal Resistance Junction-to-Case, SOT223 θJC 39 °C/W Note 7: FR-4 PCB, 1oz copper, minimum recommended pad layout 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper reduce noise. For PCB layout, a wide copper trace is required for both IN and GND pins. A lower ESR capacitor type allows the use of less 8

CAD (KiCad official)

  • Symbol: AP7365-25EG-13
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ap7365-25eg-13-etched.step / ap7365-25eg-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap7365-25eg-13.step / ap7365-25eg-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (18 pp, sha256 7ec2b65a0dbeaec0, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF