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AP61302Z6-7

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Diodes Incorporated DC-DC Converters, SOT-563. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AP61302Z6-7

Diodes Incorporated · DC-DC Converters · SOT-563

AP61302Z6-7 from Diodes Incorporated, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB input Feedback sensing terminal for the output voltage that connects to the output resistive divider, with a 0.6V ±2% reference in CCM.
2 GND power_in Power ground for the device.
3 VIN power_in Power input that supplies the IC and the step-down power MOSFETs, to be driven from 2.4V to 5.5V and bypassed to GND with a suitably large capacitor.
4 SW output Power switching output node that supplies the output through the LC filter, with a DC absolute maximum range of -1.0V to VIN + 0.3V.
5 EN input Enable input that turns the regulator on when driven high (typical rising threshold 0.91V) and off when driven low (typical falling threshold 0.83V), and also programs PFM or PWM operation.
6 PG output Open-drain power-good output that is pulled to GND when the output is outside its regulation limits or during soft-start, with a 40µs rising-edge delay and an internal 5MΩ pullup to VIN, rated -0.3V to +6.0V DC.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-563
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VFB Feedback Voltage VFB 0.588 0.6 0.612 V CCM 5
IPEAK_LIMIT HS Peak Current Limit IPEAK_LIMIT 3.5 5.5 A From Source to Drain 5
VPG_OL Power-Good Output Logic Low VPG_OL 0.4 V AP61302, IPG = -1mA 5
POR VIN Power-On Reset Rising Threshold POR 2.3 2.4 V 5
Shutdown Supply Current ISHDN 0.1 μA VEN = 0V 5
Quiescent Supply Current (PFM) IQ 19 μA PFM, VFB = 0.65V 5
Quiescent Supply Current (PWM) IQ 690 μA PWM, VFB = 0.65V 5
VIN Undervoltage Lockout Falling Threshold UVLO 2.2 V 5
VIN Overvoltage Rising Threshold OVPVIN 6.3 V 5
VIN Overvoltage Hysteresis OVPVIN_HYS 300 mV 5
High-Side Power MOSFET On-Resistance RDS(ON)1 70 mΩ 5
Low-Side Power MOSFET On-Resistance RDS(ON)2 50 mΩ 5
LS Valley Current Limit IVALLEY_LIMIT 3.2 A From Source to Drain 5
Oscillator Frequency fSW 2.2 MHz VOUT = 1.8V, CCM 5
Minimum On-Time tON_MIN 70 ns 5
Minimum Off-Time tOFF_MIN 70 ns 5
EN Logic-High Threshold VEN_H 0.91 V 5
EN Logic-Low Threshold VEN_L 0.83 V 5
Soft-Start Time tSS 0.5 ms 5
Undervoltage Falling Threshold PGUV_FALL 90 % AP61302, Percent of Output Regulation, Fault 5
Undervoltage Rising Threshold PGUV_RISE 95 % AP61302, Percent of Output Regulation, Good 5
Overvoltage Rising Threshold PGOV_RISE 110 % AP61302, Percent of Output Regulation, Fault 5
Overvoltage Falling Threshold PGOV_FALL 105 % AP61302, Percent of Output Regulation, Good 5
Power-Good Rise Delay Time tPG_RD 40 μs AP61302 5
Power-Good Pullup Resistor RPG 5 MΩ AP61302 5
Thermal Shutdown TSD 160 °C 5
Thermal Shutdown Hysteresis THys 30 °C 5
VIN Supply Pin Voltage (DC) VIN -0.3 6.5 V DC 4
VIN Supply Pin Voltage (400ms) VIN -0.3 7 V 400ms 4
Feedback Pin Voltage VFB -0.3 V upper limit printed as VIN + 0.3 4
Switch Pin Voltage (DC) VSW -1 V DC; upper limit printed as VIN + 0.3 4
Switch Pin Voltage (20ns) VSW -2.5 V 20ns; upper limit printed as VIN + 2.0 4
EN Pin Voltage VEN -0.3 V upper limit printed as VIN + 0.3 4
Output Pin Voltage (AP61300) VOUT -0.3 6 V DC 4
Power-Good Pin Voltage (AP61302) VPG -0.3 6 V DC 4
Storage Temperature TST -65 150 °C 4
Junction Temperature TJ 160 °C 4
Lead Temperature TL 260 °C 4
ESD Human Body Model -6000 6000 V HBM 4
ESD Charged Device Model -2000 2000 V CDM 4
Supply Voltage VIN 2.4 5.5 V 4
Output Voltage VOUT 0.6 3.6 V 4
Operating Ambient Temperature TA -40 85 °C 4
Operating Junction Temperature TJ -40 125 °C 4
Junction to Ambient Thermal Resistance (SOT563) θJA 141 °C/W FR-4, two-layer PCB, 2oz copper, minimum recommended pad layout 4
Junction to Case Thermal Resistance (SOT563) θJC 33 °C/W SOT563 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 • Weight: 0.003 grams (Approximate) 20

CAD (KiCad official)

  • Symbol: AP61302Z6-7
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: ap61302z6-7-etched.step / ap61302z6-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap61302z6-7.step / ap61302z6-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (21 pp, sha256 d56a2758b53a63c0, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF