component

AP2900TB-A1

Public Made by Adom

by adom

Wuxi Chipown Micro electronics DC-DC Converters, SOT-23-5L. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

componentpmicap2900tb-a1
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs ap2900tb-a1: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
ap2900tb-a1-etched.fit.json ap2900tb-a1: one-pass backfill (re-etched) · Ray
ap2900tb-a1-etched.glb ap2900tb-a1: one-pass backfill (re-etched) · Ray
ap2900tb-a1-etched.step ap2900tb-a1: one-pass backfill (re-etched) · Ray
ap2900tb-a1-hero.glb Publish 0.2.1 · Ray
ap2900tb-a1-hero.overlay.json Publish 0.2.1 · Ray
ap2900tb-a1.glb Publish 0.1.0 · Ray
ap2900tb-a1.kicad_mod Publish 0.1.0 · Ray
ap2900tb-a1.kicad_sym Publish 0.1.0 · Ray
ap2900tb-a1.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
ap2900tb-a1.step Publish 0.1.0 · Ray
package.json Publish 0.2.1 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json Publish 0.2.1 · Ray
README.md ap2900tb-a1: specified limits as data (metadata.characteristics, 32 rows from the datasheet) · Ray

AP2900TB-A1

Wuxi Chipown Micro electronics · DC-DC Converters · SOT-23-5L

AP2900TB-A1 from Wuxi Chipown Micro electronics, in a SOT-23-5L. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply voltage, 6 V to 40 V operating (42 V absolute max). Requires a low-ESR decoupling capacitor (1 uF X5R/X7R MLCC in parallel with a 100 uF electrolytic recommended) placed as close as possible between VIN and GND to supply AC current to the internal power MOSFETs.
2 GND power_in Ground pin. Common return for internal control circuitry and the low-side synchronous MOSFET source. Recommended to connect to the ground copper plane via vias for good thermal dissipation and noise suppression.
3 EN input Enable input. High level enables the IC, low level disables the IC (shutdown mode). Must not be tied directly to VIN, and must not be connected to VIN through a series resistor. Drive voltage must be kept below 5 V. Internally pulled up by an approximate 50 uA current source to ~4.5 V, so the IC auto-starts if EN is left floating. If an external pull-down resistor is used to disable, it must be < 4.7 kΩ to guarantee a valid low.
4 FB input Feedback input. Connect to the midpoint of the external output feedback divider to program the output voltage (VFB reference 1.2 V typ). Route away from the SW switching node to minimize noise pickup.
5 SW output Switch node. Drain of the internal high-side P-MOSFET and source of the low-side N-MOSFET; connect to the external inductor with a short, wide, thick trace to minimize EMI and switching loss.

Key specifications

Parameter Value
Manufacturer Wuxi Chipown Micro electronics
Package SOT-23-5L
Category PMIC
Pins 5

Ordering variants

  • AP2900TB-A1

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage (VIN) VIN 6 40 V 4
Input UVLO threshold (rising) VUVLO 5.5 5.7 V VIN rising 4
Feedback voltage threshold VFB-TH 1.176 1.2 1.224 V 4
Switching frequency FSW-TYP 80 100 120 kHz ILOAD = 0.5 A 4
EN internal pull-up current IEN 50 70 μA EN = GND 4
Quiescent current (open loop, not switching) IQ 200 420 μA Open loop, switching inactive 4
Absolute max VIN VIN -0.3 42 V Voltage relative to GND pin 4
Absolute max SW SW -0.3 42 V Voltage relative to GND pin; printed as (VIN + 0.2 V) ≤ 42 V 4
Absolute max FB FB -0.3 6 V Voltage relative to GND pin 4
ESD rating (human body model) ESD HBM -2 2 kV Class 3A per ANSI/ESDA/JEDEC JS-001-2017 4
Minimum operating junction temperature TJ -40 °C 4
Storage temperature -55 150 °C 4
Input UVLO threshold hysteresis VUVLO-HYS 0.2 V VIN falling 4
Feedback OVP threshold VFB-OVP 113 % VFB rising 4
Feedback OVP threshold hysteresis VFB-HYS 2 % VFB falling 4
Feedback short-circuit protection threshold VSCP 50 % VFB falling 4
Maximum duty cycle DMAX 100 % 4
Minimum on-time TON-MIN 200 ns 4
EN turn-on threshold VEN-H 1 V VEN rising 4
EN turn-off threshold VEN-L 0.4 V VEN falling 4
High-side MOSFET on-resistance RDS(ON)H 450 mΩ 4
Low-side MOSFET on-resistance RDS(ON)L 270 mΩ 4
High-side MOSFET leakage current ILEAK_H 5 μA VSW = 0 V 4
Low-side MOSFET leakage current ILEAK_L 5 μA VSW = VIN 4
Input current, shutdown ISHD 80 μA EN = GND 4
No-load input current, closed loop IIN 450 μA Closed loop, no load 4
Feedback pin current IFB 1 μA 4
Internal cycle-by-cycle current limit ILIM 1.5 A 5
Soft-start time TSS 3 ms 5
Thermal shutdown threshold TSD 175 °C 5
Thermal shutdown hysteresis TSD_HYS 40 °C 5
Thermal resistance, junction-to-case ӨJC 40 °C/W 4

CAD (KiCad official)

  • Symbol: AP2900TB-A1
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5L (KiCad packages3D, STEP)
  • 3D model files: ap2900tb-a1-etched.step / ap2900tb-a1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2900tb-a1.step / ap2900tb-a1.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
ap2900tb-a1.step 85 KB You want the bare part, or you mark your own boards.
ap2900tb-a1-etched.step 2.0 MB You want the part with AP2900TB-A1 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 491 faces against 102 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi Chipown Micro electronics datasheet (14 pp, sha256 c213c0743d731535, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF