# AP2511M8-13

**Diodes Incorporated** · Power Distribution Switches · MSOP-8

AP2511M8-13 from Diodes Incorporated, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference pin; all device voltages are referred to this pin. |
| 2 | IN | power_in | Voltage input pin; connect a 0.1µF or larger ceramic capacitor from IN to GND as close as possible, and tie all IN pins together externally. Input voltage range is 2.7V to 5.5V. |
| 3 | IN | power_in | Voltage input pin; connect a 0.1µF or larger ceramic capacitor from IN to GND as close as possible, and tie all IN pins together externally. Input voltage range is 2.7V to 5.5V. |
| 4 | EN | input | Enable input, active high on the AP2511; logic high requires at least 2.0V and logic low must be 0.8V or below. |
| 5 | FLG | output | Active-low open-drain output that reports over-temperature and over-current faults after a 7ms deglitch, and is disabled for 7ms after turn-on. |
| 6 | OUT | power_out | Voltage output pin; tie all OUT pins together externally. Maximum recommended continuous output current is 2.5A. |
| 7 | OUT | power_out | Voltage output pin; tie all OUT pins together externally. Maximum recommended continuous output current is 2.5A. |
| 8 | NC | unconnected | No internal connection; the datasheet recommends tying this pin to the OUT pins. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | MSOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input UVLO | VUVLO | 1.6 | 2 | 2.4 | V | VIN Rising | 4 |
| Input Shutdown Current | ISHDN |  | 0.1 | 1 | µA | Disabled, OUT = Open | 4 |
| Input Quiescent Current | IQ |  | 60 | 100 | µA | Enabled, OUT = Open | 4 |
| Input Leakage Current | ILEAK |  | 0.1 | 1 | µA | Disabled, OUT Grounded | 4 |
| Reverse Leakage Current | IREV |  | 0.01 | 1 | µA | Disabled, VIN = 0V, VOUT = 5V, IREV at VIN | 4 |
| Switch On-resistance | RDS(ON) |  | 70 | 78 | mΩ | VIN = 5V, IOUT = 1A, TA = +25°C | 4 |
| Switch On-resistance | RDS(ON) |  |  | 105 | mΩ | VIN = 5V, IOUT = 1A, -40°C ≤ TA ≤ +85°C | 4 |
| Switch On-resistance | RDS(ON) |  | 90 | 108 | mΩ | VIN = 3.3V, IOUT = 1A, TA = +25°C | 4 |
| Switch On-resistance | RDS(ON) |  |  | 135 | mΩ | VIN = 3.3V, IOUT = 1A, -40°C ≤ TA ≤ +85°C | 4 |
| Over-Load Current Limit | ILIMIT | 2.8 | 3.7 | 4.6 | A | VIN = 5V, VOUT = 4.5V, -40°C ≤ TA ≤ +85°C | 4 |
| EN Input Logic Low Voltage | VIL |  |  | 0.8 | V | VIN = 2.7V to 5.5V | 4 |
| EN Input Logic High Voltage | VIH | 2 |  |  | V | VIN = 2.7V to 5.5V | 4 |
| EN Input Leakage | ILEAK-EN |  | 0.01 | 1 | µA | VIN = 5V, VEN = 0V and 5.5V | 4 |
| Output Leakage Current | ILEAK-O |  | 0.5 | 1 | µA | Disabled, VOUT = 0V | 4 |
| Output Turn-on Rise Time | tR |  | 0.6 | 1.5 | ms | CL = 1µF, RLOAD = 5Ω | 4 |
| Output Turn-off Fall Time | tF |  | 0.05 | 0.1 | ms | CL = 1µF, RLOAD = 5Ω | 4 |
| FLG Output FET On-resistance | RFLG |  | 20 | 40 | Ω | IFLG = 10mA | 4 |
| FLG Off Current | IFOH |  | 0.01 | 1 | µA | VFLG = 5V | 4 |
| FLG Blanking Time | tBLANK | 4 | 7 | 15 | ms | Assertion or deassertion due to overcurrent and over-temperature condition | 4 |
| Input Voltage | VIN | 2.7 |  | 5.5 | V |  | 3 |
| Output Current | IOUT | 0 |  | 2.5 | A |  | 3 |
| High-Level Input Voltage on EN | VIH | 2 |  |  | V | Maximum printed as VIN | 3 |
| Low-Level Input Voltage on EN | VIL | 0 |  | 0.8 | V |  | 3 |
| Operating Ambient Temperature | TA | -40 |  | 85 | °C | Note 6: TA(MAX) = +70°C if VIN ≤ 4.1V and IOUT = 2.5A | 3 |
| ESD HBM Human Body Model ESD Protection | ESD HBM |  |  | 2 | kV | Human Body Model | 3 |
| ESD MM Machine Model ESD Protection | ESD MM |  |  | 200 | V | Machine Model | 3 |
| Input Voltage | VIN | -0.3 |  | 6.5 | V | Voltages referred to GND pin (Note 4) | 3 |
| Output Voltage | VOUT | -0.3 |  | 6.5 | V | Note 4: maximum is the lower of VIN + 0.3 and 6.5V | 3 |
| Enable Voltage / Flag Voltage | VEN, VFLG | -0.3 |  | 6.5 | V | Note 4: maximum is the lower of VIN + 0.3 and 6.5V | 3 |
| Maximum Junction Temperature | TJMAX |  |  | 150 | °C |  | 3 |
| Storage Temperature Range | TST | -65 |  | 150 | °C | Note 5: UL recognized rating from -30°C to +70°C; Diodes qualified from -65°C to +150°C | 3 |
| Thermal Resistance Junction-to-Ambient, MSOP-8 | θJA |  | 130 |  | C/W | MSOP-8 (Note 9): 2in x 2in FR-4, 2oz copper, minimum recommended pad layout | 4 |

## CAD (KiCad official)

- Symbol: `AP2511M8-13`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `ap2511m8-13-etched.step` / `ap2511m8-13-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ap2511m8-13.step` / `ap2511m8-13.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8560090682925867008) (18 pp, sha256 `548c38359ee0df24`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ap2511m8-13-datasheet.pdf)