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AP2511M8-13

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Diodes Incorporated Power Distribution Switches, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AP2511M8-13

Diodes Incorporated · Power Distribution Switches · MSOP-8

AP2511M8-13 from Diodes Incorporated, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin; all device voltages are referred to this pin.
2 IN power_in Voltage input pin; connect a 0.1µF or larger ceramic capacitor from IN to GND as close as possible, and tie all IN pins together externally. Input voltage range is 2.7V to 5.5V.
3 IN power_in Voltage input pin; connect a 0.1µF or larger ceramic capacitor from IN to GND as close as possible, and tie all IN pins together externally. Input voltage range is 2.7V to 5.5V.
4 EN input Enable input, active high on the AP2511; logic high requires at least 2.0V and logic low must be 0.8V or below.
5 FLG output Active-low open-drain output that reports over-temperature and over-current faults after a 7ms deglitch, and is disabled for 7ms after turn-on.
6 OUT power_out Voltage output pin; tie all OUT pins together externally. Maximum recommended continuous output current is 2.5A.
7 OUT power_out Voltage output pin; tie all OUT pins together externally. Maximum recommended continuous output current is 2.5A.
8 NC unconnected No internal connection; the datasheet recommends tying this pin to the OUT pins.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package MSOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input UVLO VUVLO 1.6 2 2.4 V VIN Rising 4
Input Shutdown Current ISHDN 0.1 1 µA Disabled, OUT = Open 4
Input Quiescent Current IQ 60 100 µA Enabled, OUT = Open 4
Input Leakage Current ILEAK 0.1 1 µA Disabled, OUT Grounded 4
Reverse Leakage Current IREV 0.01 1 µA Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 4
Switch On-resistance RDS(ON) 70 78 mΩ VIN = 5V, IOUT = 1A, TA = +25°C 4
Switch On-resistance RDS(ON) 105 mΩ VIN = 5V, IOUT = 1A, -40°C ≤ TA ≤ +85°C 4
Switch On-resistance RDS(ON) 90 108 mΩ VIN = 3.3V, IOUT = 1A, TA = +25°C 4
Switch On-resistance RDS(ON) 135 mΩ VIN = 3.3V, IOUT = 1A, -40°C ≤ TA ≤ +85°C 4
Over-Load Current Limit ILIMIT 2.8 3.7 4.6 A VIN = 5V, VOUT = 4.5V, -40°C ≤ TA ≤ +85°C 4
EN Input Logic Low Voltage VIL 0.8 V VIN = 2.7V to 5.5V 4
EN Input Logic High Voltage VIH 2 V VIN = 2.7V to 5.5V 4
EN Input Leakage ILEAK-EN 0.01 1 µA VIN = 5V, VEN = 0V and 5.5V 4
Output Leakage Current ILEAK-O 0.5 1 µA Disabled, VOUT = 0V 4
Output Turn-on Rise Time tR 0.6 1.5 ms CL = 1µF, RLOAD = 5Ω 4
Output Turn-off Fall Time tF 0.05 0.1 ms CL = 1µF, RLOAD = 5Ω 4
FLG Output FET On-resistance RFLG 20 40 Ω IFLG = 10mA 4
FLG Off Current IFOH 0.01 1 µA VFLG = 5V 4
FLG Blanking Time tBLANK 4 7 15 ms Assertion or deassertion due to overcurrent and over-temperature condition 4
Input Voltage VIN 2.7 5.5 V 3
Output Current IOUT 0 2.5 A 3
High-Level Input Voltage on EN VIH 2 V Maximum printed as VIN 3
Low-Level Input Voltage on EN VIL 0 0.8 V 3
Operating Ambient Temperature TA -40 85 °C Note 6: TA(MAX) = +70°C if VIN ≤ 4.1V and IOUT = 2.5A 3
ESD HBM Human Body Model ESD Protection ESD HBM 2 kV Human Body Model 3
ESD MM Machine Model ESD Protection ESD MM 200 V Machine Model 3
Input Voltage VIN -0.3 6.5 V Voltages referred to GND pin (Note 4) 3
Output Voltage VOUT -0.3 6.5 V Note 4: maximum is the lower of VIN + 0.3 and 6.5V 3
Enable Voltage / Flag Voltage VEN, VFLG -0.3 6.5 V Note 4: maximum is the lower of VIN + 0.3 and 6.5V 3
Maximum Junction Temperature TJMAX 150 °C 3
Storage Temperature Range TST -65 150 °C Note 5: UL recognized rating from -30°C to +70°C; Diodes qualified from -65°C to +150°C 3
Thermal Resistance Junction-to-Ambient, MSOP-8 θJA 130 C/W MSOP-8 (Note 9): 2in x 2in FR-4, 2oz copper, minimum recommended pad layout 4

CAD (KiCad official)

  • Symbol: AP2511M8-13
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: ap2511m8-13-etched.step / ap2511m8-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ap2511m8-13.step / ap2511m8-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (18 pp, sha256 548c38359ee0df24, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF