ap22653aw6-7: one-pass backfill (re-etched)
ap22653aw6-7: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
ap22653aw6-7: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
ap22653aw6-7: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
ap22653aw6-7: hero re-rendered with iso-front (part number upright)
ap22653aw6-7: laser-etched CAD + chip hero (factory 2.0.0 backfill)
ap22653aw6-7: backfill missing artifacts (etch)
fix ordering variants: suffix was duplicated into the MPN
ap22653aw6-7: factory component page (tier=lcsc)
ap22653aw6-7: factory component page (tier=lcsc)
Initial commit: component/ap22653aw6-7