# AP2172SG-13

**Diodes Incorporated** · AC-DC Controllers and Regulators · SOIC-8

AP2172SG-13 from Diodes Incorporated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Device ground reference. |
| 2 | IN | power_in | Voltage input pin. Supplies both switch channels; operating range 2.7 V to 5.5 V (abs max 6.5 V). Bypass with 0.1 µF and bulk 10 µF near pin. |
| 3 | EN1 | input | Switch 1 enable input. Active high on AP2172 (this variant). VIL ≤ 0.8 V, VIH ≥ 2 V. Input leakage ≤ 1 µA. |
| 4 | EN2 | input | Switch 2 enable input. Active high on AP2172 (this variant). VIL ≤ 0.8 V, VIH ≥ 2 V. Input leakage ≤ 1 µA. |
| 5 | FLG2 | output | Switch 2 over-current and over-temperature fault report. Open-drain output, active low when triggered. Requires external pull-up (typ. 10 kΩ). 7 ms typical blanking time. IFLG = 10 mA max, RFLG ≈ 30 Ω typ. |
| 6 | OUT2 | power_out | Switch 2 voltage output. Delivers up to 1.0 A continuous (1.5 A typ current limit). Bypass with 0.1 µF plus bulk 68 µF at load per USB requirements. |
| 7 | OUT1 | power_out | Switch 1 voltage output. Delivers up to 1.0 A continuous (1.5 A typ current limit). Bypass with 0.1 µF plus bulk 68 µF at load per USB requirements. |
| 8 | FLG1 | output | Switch 1 over-current and over-temperature fault report. Open-drain output, active low when triggered. Requires external pull-up (typ. 10 kΩ). 7 ms typical blanking time. IFLG = 10 mA max, RFLG ≈ 30 Ω typ. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOIC-8 |
| Category | PMIC |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `AP2172SG-13`
- `AP2172SG-13MP`

## CAD (KiCad official)

- Symbol: `AP2172SG-13`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `ap2172sg-13-etched.step` / `ap2172sg-13-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ap2172sg-13.step` / `ap2172sg-13.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Diodes Incorporated datasheet](https://www.diodes.com/assets/Datasheets/AP2172SG-13.pdf) (17 pp, sha256 `e60b7568035123ef`, retrieved 2026-08-17, tier: manufacturer)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ap2172sg-13-datasheet.pdf)