component
AP2007SPER
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Wuxi Chipown Micro electronics DC-DC Converters, ESOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+48@@ -0,0 +1,48 @@+# AP2007SPER++**Wuxi Chipown Micro electronics** · DC-DC Converters · ESOP-8++AP2007SPER from Wuxi Chipown Micro electronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | LX | passive | Inductor switching node. Connects to one end of the boost inductor (3.3µH typical); tied together with pin 2 internally. Absolute maximum rating -0.3V to +6V. Switches at 1MHz with typical RDS(on) of 52mΩ (NMOS) / 49mΩ (PMOS) and 5A peak current limit. |+| 2 | LX | passive | Inductor switching node (paralleled with pin 1). Connects to one end of the boost inductor. Absolute maximum rating -0.3V to +6V. |+| 3 | VIN | power_in | IC power supply input. Operating input voltage range 2.5V to 5V; absolute maximum -0.3V to +6V. Bypass with ~22µF ceramic capacitor close to the pin. |+| 4 | EN | input | Enable input for the IC. Drive high (VIH ≥ 1.5V) to enable, low (VIL ≤ 0.5V) to disable. Internal pull-down resistor typ 250kΩ (200-300kΩ) to GND. Absolute maximum -0.3V to +6V. Shutdown current <1µA when EN=0. |+| 5 | GND | power_in | IC analog ground. Must be tied to the exposed pad at a single star-ground point. |+| 6 | FB | input | Converter feedback input. Regulated to VFB = 1.227V typ (1.208-1.246V). Input bias current 100nA max. Output voltage set by external divider: R1 = R2 × (VOUT/VFB − 1). Absolute maximum -0.3V to +6V. |+| 7 | VOUT | power_out | Converter output. Regulated boost output (5V typical, adjustable via FB divider). Paralleled with pin 8; bypass with ~22µF×3 ceramic capacitors. Absolute maximum -0.3V to +6V. Leakage <5µA in shutdown. |+| 8 | VOUT | power_out | Converter output (paralleled with pin 7). Absolute maximum -0.3V to +6V. |+| EP | EP | power_in | Exposed pad on package underside. Internally connected to GND. Must be soldered to the ground plane at a single star-ground point to optimize thermal performance (θJA = 50°C/W, θJC = 10°C/W). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Wuxi Chipown Micro electronics |+| Package | ESOP-8 |+| Category | PMIC |+| Pins | 9 |++## Ordering variants++- `AP2007SPERSPER`++## CAD (KiCad official)++- Symbol: `AP2007SPER`+- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm`+- 3D model: ESOP-8 (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Wuxi Chipown Micro electronics datasheet](docs/ap2007sper-datasheet.pdf) (7 pp, sha256 `6ccd9a511d12a106`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/ap2007sper-datasheet.pdf)
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