component
AP2007SPER
Public Made by Adomby adom
Wuxi Chipown Micro electronics DC-DC Converters, ESOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAP2007SPER
Wuxi Chipown Micro electronics · DC-DC Converters · ESOP-8
AP2007SPER from Wuxi Chipown Micro electronics, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LX | passive | Inductor switching node. Connects to one end of the boost inductor (3.3µH typical); tied together with pin 2 internally. Absolute maximum rating -0.3V to +6V. Switches at 1MHz with typical RDS(on) of 52mΩ (NMOS) / 49mΩ (PMOS) and 5A peak current limit. |
| 2 | LX | passive | Inductor switching node (paralleled with pin 1). Connects to one end of the boost inductor. Absolute maximum rating -0.3V to +6V. |
| 3 | VIN | power_in | IC power supply input. Operating input voltage range 2.5V to 5V; absolute maximum -0.3V to +6V. Bypass with ~22µF ceramic capacitor close to the pin. |
| 4 | EN | input | Enable input for the IC. Drive high (VIH ≥ 1.5V) to enable, low (VIL ≤ 0.5V) to disable. Internal pull-down resistor typ 250kΩ (200-300kΩ) to GND. Absolute maximum -0.3V to +6V. Shutdown current <1µA when EN=0. |
| 5 | GND | power_in | IC analog ground. Must be tied to the exposed pad at a single star-ground point. |
| 6 | FB | input | Converter feedback input. Regulated to VFB = 1.227V typ (1.208-1.246V). Input bias current 100nA max. Output voltage set by external divider: R1 = R2 × (VOUT/VFB − 1). Absolute maximum -0.3V to +6V. |
| 7 | VOUT | power_out | Converter output. Regulated boost output (5V typical, adjustable via FB divider). Paralleled with pin 8; bypass with ~22µF×3 ceramic capacitors. Absolute maximum -0.3V to +6V. Leakage <5µA in shutdown. |
| 8 | VOUT | power_out | Converter output (paralleled with pin 7). Absolute maximum -0.3V to +6V. |
| EP | EP | power_in | Exposed pad on package underside. Internally connected to GND. Must be soldered to the ground plane at a single star-ground point to optimize thermal performance (θJA = 50°C/W, θJC = 10°C/W). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Wuxi Chipown Micro electronics |
| Package | ESOP-8 |
| Category | PMIC |
| Pins | 9 |
Ordering variants
AP2007SPER
CAD (KiCad official)
- Symbol:
AP2007SPER - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
ap2007sper-etched.step/ap2007sper-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap2007sper.step/ap2007sper.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Wuxi Chipown Micro electronics datasheet (7 pp, sha256
6ccd9a511d12a106, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).