# AP1509-5.0M

**HGSEMI** · DC-DC Converters · SOP-8

AP1509-5.0M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Supply voltage input operating from 4.5V to 42V DC; bypass Vin to GND with a suitably large capacitor to eliminate input noise. |
| 2 | OUTPUT | output | Power switch output (SW) node, the switch node that supplies power to the output. |
| 3 | FEEDBACK | input | Feedback input (FB) senses the output voltage through an external resistor divider and regulates it to a 1.23V feedback threshold. |
| 4 | ON/OFF | input | Enable pin: drive low to turn the device on and high to turn it off; floating defaults low. |
| 5 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |
| 6 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |
| 7 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |
| 8 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `AP1509-5.0M`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `ap1509-5-0m-etched.step` / `ap1509-5-0m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ap1509-5-0m.step` / `ap1509-5-0m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756370613747224576) (13 pp, sha256 `8479d2479ebaa956`, retrieved 2026-10-10, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ap1509-5-0m-datasheet.pdf)