component
AP1509-5.0M
Public Made by Adomby adom
HGSEMI DC-DC Converters, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownAP1509-5.0M
HGSEMI · DC-DC Converters · SOP-8
AP1509-5.0M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Supply voltage input operating from 4.5V to 42V DC; bypass Vin to GND with a suitably large capacitor to eliminate input noise. |
| 2 | OUTPUT | output | Power switch output (SW) node, the switch node that supplies power to the output. |
| 3 | FEEDBACK | input | Feedback input (FB) senses the output voltage through an external resistor divider and regulates it to a 1.23V feedback threshold. |
| 4 | ON/OFF | input | Enable pin: drive low to turn the device on and high to turn it off; floating defaults low. |
| 5 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |
| 6 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |
| 7 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |
| 8 | GND | power_in | Ground pin; layout must place it outside the Schottky diode to output capacitor ground path so switching current spikes do not induce voltage noise into the IC. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
AP1509-5.0M - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
ap1509-5-0m-etched.step/ap1509-5-0m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ap1509-5-0m.step/ap1509-5-0m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (13 pp, sha256
8479d2479ebaa956, retrieved 2026-10-10, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).