component
AOD444-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, TO-252. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 1mo ago |
| aod444-vb-etched.fit.json | 1mo ago |
| aod444-vb-etched.glb | 17d ago |
| aod444-vb-etched.step | 17d ago |
| aod444-vb.glb | 1mo ago |
| aod444-vb.kicad_mod | 1mo ago |
| aod444-vb.kicad_sym | 1mo ago |
| aod444-vb.lbr | 1mo ago |
| aod444-vb.step | 1mo ago |
| package.json | 1mo ago |
| page.json | 17d ago |
| README.md | 18d ago |
AOD444-VB
VBsemi Elec · MOSFETs · TO-252
AOD444-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET. Controls channel conduction between Drain and Source. VGS(th) = 1.0 V to 3.0 V; VGS absolute maximum = ± 20 V. |
| 2 | D | passive | Drain terminal of the N-channel MOSFET. Electrically connected to the exposed metal tab of the TO-252 package. VDS max = 60 V; continuous ID = 18 A at TC = 25 °C. |
| 3 | S | passive | Source terminal of the N-channel MOSFET. Reference for VGS and VDS. Body diode anode is internally tied to Source (VSD = 0.8 V typ. at IF = 5.2 A). |
| 4 | D | passive | Drain tab (exposed thermal pad on TO-252). Electrically the Drain node - same net as pin 2. Serves as the primary thermal path (RthJC = 3 °C/W) and must be soldered to a copper pour for rated dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 4 |
Ordering variants
Same part, different packaging or reel option.
AOD444-VB
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 60 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 18 | A | TC = 25 °C | 1 | ||
| Pulsed Drain Current | IDM | 25 | A | t = 300 µs | 1 | ||
| Avalanche Current | IAS | 15 | A | 1 | |||
| Single Avalanche Energy | EAS | 11.25 | mJ | L = 0.1 mH | 1 | ||
| Maximum Power Dissipation | PD | 41.7 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 2.1 | W | TA = 25 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Junction-to-Ambient (PCB Mount) | RthJA | 60 | °C/W | PCB mount, 1" square FR-4 PCB | 1 | ||
| Junction-to-Case (Drain) | RthJC | 3 | °C/W | 1 | |||
| Drain-Source Breakdown Voltage | VDS | 60 | V | VGS = 0 V, ID = 250 µA | 2 | ||
| Gate Threshold Voltage | VGS(th) | 1 | 3 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Body Leakage | IGSS | -250 | 250 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 50 | µA | VDS = 60 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 250 | µA | VDS = 60 V, VGS = 0 V, TJ = 150 °C | 2 | ||
| On-State Drain Current | ID(on) | 20 | A | VDS ≥ 10 V, VGS = 10 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.073 | Ω | VGS = 10 V, ID = 6.6 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.085 | Ω | VGS = 4.5 V, ID = 6 A | 2 | ||
| Gate Resistance | Rg | 0.4 | 2 | 4 | Ω | f = 1 MHz | 2 |
| Total Gate Charge | Qg | 19.8 | 30 | nC | VDS = 30 V, VGS = 10 V, ID = 6.6 A | 2 | |
| Turn-On Delay Time | td(on) | 8 | 16 | ns | VDD = 30 V, RL = 9.6, ID ≅ 5.2 A, VGEN = 10 V, Rg = 1 | 2 | |
| Rise Time | tr | 11 | 20 | ns | VDD = 30 V, RL = 9.6, ID ≅ 5.2 A, VGEN = 10 V, Rg = 1 | 2 | |
| Turn-Off Delay Time | td(off) | 18 | 27 | ns | VDD = 30 V, RL = 9.6, ID ≅ 5.2 A, VGEN = 10 V, Rg = 1 | 2 | |
| Fall Time | tf | 5 | 10 | ns | VDD = 30 V, RL = 9.6, ID ≅ 5.2 A, VGEN = 10 V, Rg = 1 | 2 | |
| Turn-On Delay Time | td(on) | 38 | 57 | ns | VDD = 30 V, RL = 9.6, ID ≅ 5.2 A, VGEN = 4.5 V, Rg = 1 | 2 | |
| Rise Time | tr | 58 | 87 | ns | VDD = 30 V, RL = 9.6, ID ≅ 5.2 A, VGEN = 4.5 V, Rg = 1 | 2 | |
| Fall Time | tf | 8 | 16 | ns | VDD = 30 V, RL = 9.6, ID ≅ 5.2 A, VGEN = 4.5 V, Rg = 1 | 2 | |
| Forward Voltage | VSD | 0.8 | 1.5 | V | IF = 5.2 A, VGS = 0 V | 2 | |
| Reverse Recovery Time | trr | 34 | 51 | ns | IF = 5.2 A, dI/dt = 100 A/µs | 2 | |
| Reverse Recovery Charge | Qrr | 50 | 75 | nC | IF = 5.2 A, dI/dt = 100 A/µs | 2 |
CAD (KiCad official)
- Symbol:
AOD444-VB - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
aod444-vb-etched.step/aod444-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);aod444-vb.step/aod444-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
2ae704b0d25461f2, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).