# AMC3302DWER

**Texas Instruments** · Isolation Amplifiers · SOIC-16

AMC3302DWER from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DCDC_OUT | power_out | High-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin. |
| 2 | DCDC_HGND | power_in | High-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin. |
| 3 | HLDO_IN | power_in | Input of the high-side LDO; connect this pin to the DCDC_OUT pin. |
| 4 | NC | unconnected | No internal connection; connect this pin to HGND or leave this pin unconnected. |
| 5 | HLDO_OUT | power_out | Output of the high-side LDO. |
| 6 | INP | input | Noninverting analog input; either INP or INN must have a DC current path to HGND to define the common-mode input voltage. |
| 7 | INN | input | Inverting analog input; either INP or INN must have a DC current path to HGND to define the common-mode input voltage. |
| 8 | HGND | power_in | High-side analog ground; connect this pin to the DCDC_HGND pin. |
| 9 | GND | power_in | Low-side analog ground; connect this pin to the DCDC_GND pin. |
| 10 | OUTN | output | Inverting analog output. |
| 11 | OUTP | output | Noninverting analog output. |
| 12 | VDD | power_in | Low-side power supply. |
| 13 | LDO_OUT | power_out | Output of the low-side LDO; connect this pin to the DCDC_IN pin; the output of the LDO must not be loaded by external circuitry. |
| 14 | DIAG | tri_state | Active-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used. |
| 15 | DCDC_GND | power_in | Low-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin. |
| 16 | DCDC_IN | power_in | Low-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-16 |
| Category | Signal Isolation Devices |
| Pins | 16 |

## CAD (KiCad official)

- Symbol: `AMC3302DWER`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files: `amc3302dwer-etched.step` / `amc3302dwer-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `amc3302dwer.step` / `amc3302dwer.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/amc3302) (40 pp, sha256 `c147a34e582b3034`, retrieved 2026-09-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-4-6` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/amc3302dwer-datasheet.pdf)