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Contents

README

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AMC3302DWER

Texas Instruments · Isolation Amplifiers · SOIC-16

AMC3302DWER from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 DCDC_OUT power_out High-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin.
2 DCDC_HGND power_in High-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin.
3 HLDO_IN power_in Input of the high-side LDO; connect this pin to the DCDC_OUT pin.
4 NC unconnected No internal connection; connect this pin to HGND or leave this pin unconnected.
5 HLDO_OUT power_out Output of the high-side LDO.
6 INP input Noninverting analog input; either INP or INN must have a DC current path to HGND to define the common-mode input voltage.
7 INN input Inverting analog input; either INP or INN must have a DC current path to HGND to define the common-mode input voltage.
8 HGND power_in High-side analog ground; connect this pin to the DCDC_HGND pin.
9 GND power_in Low-side analog ground; connect this pin to the DCDC_GND pin.
10 OUTN output Inverting analog output.
11 OUTP output Noninverting analog output.
12 VDD power_in Low-side power supply.
13 LDO_OUT power_out Output of the low-side LDO; connect this pin to the DCDC_IN pin; the output of the LDO must not be loaded by external circuitry.
14 DIAG tri_state Active-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used.
15 DCDC_GND power_in Low-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin.
16 DCDC_IN power_in Low-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: AMC3302DWER
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: amc3302dwer-etched.step / amc3302dwer-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc3302dwer.step / amc3302dwer.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (40 pp, sha256 c147a34e582b3034, retrieved 2026-09-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF