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AMC1350DWVR

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Texas Instruments Isolation Amplifiers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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AMC1350DWVR

Texas Instruments · Isolation Amplifiers · SOIC-8

AMC1350DWVR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in High-side power supply; see the Power Supply Recommendations section for decoupling.
2 INP input Noninverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.
3 INN input Inverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.
4 GND1 power_in High-side analog ground.
5 GND2 power_in Low-side analog ground.
6 OUTN output Inverting analog output.
7 OUTP output Noninverting analog output.
8 VDD2 power_in Low-side power supply; see the Power Supply Recommendations section for decoupling.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Signal Isolation Devices
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Offset voltage VOS -1.5 0.3 1.5 mV TA = 25°C, INN = INP = GND1, 4.5 V ≤ VDD1 ≤ 5.5 V 8
Offset voltage VOS -2.5 -0.8 2.5 mV TA = 25°C, INN = INP = GND1, 3.0 V ≤ VDD1 ≤ 5.5 V 8
Offset voltage thermal drift TCVOS -15 3 15 µV/°C INN = INP = GND1 8
Input resistance, differential RIN 2 2.5 3 MΩ 8
Input resistance, single ended 1 1.25 1.5 MΩ INN = GND1 8
Gain error EG -0.2 0.05 0.2 % TA = 25℃ 8
Gain error thermal drift TCEG -35 10 35 ppm/°C 8
Nonlinearity -0.02 0.003 0.02 % 8
VDD1 undervoltage detection threshold VDD1UV 2.5 2.7 2.9 V VDD1 rising 9
VDD1 undervoltage detection threshold VDD1UV 2.4 2.6 2.8 V VDD1 falling 9
VDD2 undervoltage detection threshold VDD2UV 2.2 2.45 2.65 V VDD2 rising 9
VDD2 undervoltage detection threshold VDD2UV 1.85 2 2.2 V VDD2 falling 9
High-side supply current IDD1 6 8.1 mA 3.0 V < VDD1 < 3.6 V 9
High-side supply current IDD1 7 9.3 mA 4.5 V < VDD1 < 5.5 V 9
Low-side supply current IDD2 5.3 7.2 mA 3.0 V < VDD2 < 3.6 V 9
Low-side supply current IDD2 5.9 8.1 mA 4.5 V < VDD2 < 5.5 V 9
Output common-mode voltage VCMout 1.39 1.44 1.49 V 8
Output resistance ROUT 0.2 Ω On OUTP or OUTN 9
Common-mode transient immunity CMTI 100 150 kV/µs 9
Fail-safe differential output voltage VFail-safe -2.5 V VDD1 undervoltage or VDD1 missing 8
High-side power-supply voltage VDD1 (recommended) VDD1 3 5 5.5 V 4
Low-side power-supply voltage VDD2 (recommended) VDD2 3 3.3 5.5 V 4
Input voltage before clipping output VClipping -6.25 6.25 V VIN = VINP, VINN 4
Specified linear full-scale voltage VFSR -5 5 V VIN = VINP, VINN 4
Operating common-mode input voltage VCM -4 4 V 4
Capacitive load CLOAD 500 pF On OUTP or OUTN to GND2 4
Capacitive load CLOAD 250 pF OUTP to OUTN 4
Operating ambient temperature TA -55 125 °C 4
Specified ambient temperature -40 125 °C 4
High-side power-supply voltage VDD1 to GND1 -0.3 6.5 V 4
Low-side power-supply voltage VDD2 to GND2 -0.3 6.5 V 4
Analog input voltage INP, INN -15 15 V 4
Input current -10 10 mA Continuous, any pin except power-supply pins 4
Junction temperature TJ 150 °C 4
Storage temperature Tstg -65 150 °C 4
Junction-to-ambient thermal resistance RθJA 84.6 °C/W 5
Junction-to-case (top) thermal resistance RθJC(top) 28.3 °C/W 5
Junction-to-board thermal resistance RθJB 41.1 °C/W 5
Junction-to-top characterization parameter ψJT 4.9 °C/W 5
Junction-to-board characterization parameter ψJB 39.1 °C/W 5

CAD (KiCad official)

  • Symbol: AMC1350DWVR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: amc1350dwvr-etched.step / amc1350dwvr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc1350dwvr.step / amc1350dwvr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 4c741fa0d99fe1df, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF