# AMC1300BDWVR

**TEXAS INSTRUMENTS** · Global Sourcing Parts · SOIC-8-300mil

AMC1300BDWVR from TEXAS INSTRUMENTS, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | High-side power supply; see the Power Supply Recommendations section for decoupling. |
| 2 | INP | input | Noninverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage. |
| 3 | INN | input | Inverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage. |
| 4 | GND1 | power_in | High-side analog ground. |
| 5 | GND2 | power_in | Low-side analog ground. |
| 6 | OUTN | output | Inverting analog output. |
| 7 | OUTP | output | Noninverting analog output. |
| 8 | VDD2 | power_in | Low-side power supply; see the Power Supply Recommendations section for decoupling. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | SOIC-8-300mil |
| Category | Global Sourcing Parts |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side power-supply voltage VDD1 to GND1 | VDD1 | -0.3 |  | 6.5 | V |  | 6 |
| Low-side power-supply voltage VDD2 to GND2 | VDD2 | -0.3 |  | 6.5 | V |  | 6 |
| Analog input voltage INP, INN | VINP, VINN | -6 |  |  | V | Referenced to GND1; maximum printed as VDD1 + 0.5 V | 6 |
| Output voltage OUTP, OUTN | VOUTP, VOUTN | -0.5 |  |  | V | Referenced to GND2; maximum printed as VDD2 + 0.5 V | 6 |
| Input current, continuous, any pin except power-supply pins | II | -10 |  | 10 | mA | Continuous | 6 |
| Junction temperature | TJ |  |  | 150 | °C |  | 6 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 6 |
| High-side power supply VDD1 to GND1 (AMC1300B) | VDD1 | 3 | 5 | 5.5 | V | AMC1300B; NOM column 5 V | 6 |
| Low-side power supply VDD2 to GND2 | VDD2 | 3 | 3.3 | 5.5 | V | NOM column 3.3 V | 6 |
| Differential input voltage before clipping | VClipping | -320 |  | 320 | mV | VIN = VINP - VINN | 6 |
| Specified linear differential full-scale voltage | VFSR | -250 |  | 250 | mV | VIN = VINP - VINN | 6 |
| Absolute common-mode input voltage | (VINP+VINN)/2 | -2 |  |  | V | (VINP+VINN)/2 to GND1; maximum printed as VDD1 | 6 |
| Operating common-mode input voltage | VCM | -0.16 |  |  | V | (VINP+VINN)/2 to GND1; maximum printed as VDD1, 2.1 V | 6 |
| Specified ambient temperature (AMC1300B) | TA | -55 |  | 125 | °C | AMC1300B | 6 |
| Input offset voltage, initial | VOS | -0.2 | 0.01 | 0.2 | mV | AMC1300B, initial, TA = 25°C, VINP = VINN = GND1, 4.5 V ≤ VDD1 ≤ 5.5 V | 10 |
| Input offset drift | TCVOS | -0.9 | 0.1 | 0.9 | uV/°C | AMC1300B | 10 |
| Input bias current | IIB | -41 | -30 | -24 | uA | INP = INN = GND1; IIB = (IIBP+IIBN) / 2 | 10 |
| Input offset current | IIO | -5 |  | 5 | nA | IIO = IIBP - IIBN | 10 |
| Gain error, initial | EG | -0.3 | 0.05 | 0.3 | % | AMC1300B, initial, at TA = 25°C | 10 |
| Gain error drift | TCEG | -30 | 5 | 30 | ppm/°C | AMC1300B | 10 |
| Nonlinearity | NL | -0.03 | 0.01 | 0.03 | % |  | 10 |
| Signal-to-noise ratio | SNR | 81.5 | 85 |  | dB | fIN = 1 kHz, BW = 10 kHz | 10 |
| Common-mode output voltage | VCMout | 1.39 | 1.44 | 1.49 | V |  | 10 |
| Clipping differential output voltage | VCLIPout | -2.52 | 2.49 | 2.52 | V | VOUT = (VOUTP, VOUTN); /VIN/ = /VINP, VINN/ > /VClipping/ | 10 |
| Failsafe differential output voltage | VFAILSAFE | -2.63 | -2.57 | -2.53 | V | VCM ≥ VCMov, or VDD1 missing | 10 |
| Output resistance | ROUT |  |  | 0.2 | Ω | On OUTP or OUTN | 11 |
| Common-mode transient immunity (AMC1300B) | CMTI | 100 | 150 |  | kV/µs | /GND1, GND2/ = 1 kV, AMC1300B | 11 |
| VDD1 undervoltage detection threshold voltage | VDD1UV | 2.4 | 2.6 | 2.8 | V | VDD1 falling | 11 |
| High-side supply current (AMC1300B) | IDD1 |  | 6.3 | 8.5 | mA | AMC1300B only, 3.0 V ≤ VDD1 ≤ 3.6 V | 11 |
| High-side supply current | IDD1 |  | 7.2 | 9.8 | mA | 4.5 V ≤ VDD1 ≤ 5.5 V | 11 |
| Low-side supply current | IDD2 |  | 5.3 | 7.2 | mA | 3.0 V ≤ VDD2 ≤ 3.6 V | 11 |
| Low-side supply current | IDD2 |  | 5.9 | 8.1 | mA | 4.5 V ≤ VDD2 ≤ 5.5 V | 11 |
| Junction-to-ambient thermal resistance | RθJA |  | 85.4 |  | °C/W |  | 7 |
| Junction-to-case (top) thermal resistance | RθJC(top) |  | 26.8 |  | °C/W |  | 7 |
| Junction-to-board thermal resistance | RθJB |  | 43.5 |  | °C/W |  | 7 |
| Junction-to-top characterization parameter | ψJT |  | 4.8 |  | °C/W |  | 7 |
| Junction-to-board characterization parameter | ψJB |  | 41.2 |  | °C/W |  | 7 |

## CAD (KiCad official)

- Symbol: `AMC1300BDWVR`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
- 3D model files: `amc1300bdwvr-etched.step` / `amc1300bdwvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `amc1300bdwvr.step` / `amc1300bdwvr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TEXAS INSTRUMENTS datasheet](https://www.ti.com/cn/lit/gpn/amc1300) (39 pp, sha256 `62a3f250106ff0f2`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/amc1300bdwvr-datasheet.pdf)