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AMC1300BDWVR

TEXAS INSTRUMENTS · Global Sourcing Parts · SOIC-8-300mil

AMC1300BDWVR from TEXAS INSTRUMENTS, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD1	power_in	High-side power supply; see the Power Supply Recommendations section for decoupling.
2	INP	input	Noninverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.
3	INN	input	Inverting analog input; either INP or INN must have a DC current path to GND1 to define the common-mode input voltage.
4	GND1	power_in	High-side analog ground.
5	GND2	power_in	Low-side analog ground.
6	OUTN	output	Inverting analog output.
7	OUTP	output	Noninverting analog output.
8	VDD2	power_in	Low-side power supply; see the Power Supply Recommendations section for decoupling.

Key specifications

Parameter	Value
Manufacturer	TEXAS INSTRUMENTS
Package	SOIC-8-300mil
Category	Global Sourcing Parts
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
High-side power-supply voltage VDD1 to GND1	VDD1	-0.3		6.5	V		6
Low-side power-supply voltage VDD2 to GND2	VDD2	-0.3		6.5	V		6
Analog input voltage INP, INN	VINP, VINN	-6			V	Referenced to GND1; maximum printed as VDD1 + 0.5 V	6
Output voltage OUTP, OUTN	VOUTP, VOUTN	-0.5			V	Referenced to GND2; maximum printed as VDD2 + 0.5 V	6
Input current, continuous, any pin except power-supply pins	II	-10		10	mA	Continuous	6
Junction temperature	TJ			150	°C		6
Storage temperature	Tstg	-65		150	°C		6
High-side power supply VDD1 to GND1 (AMC1300B)	VDD1	3	5	5.5	V	AMC1300B; NOM column 5 V	6
Low-side power supply VDD2 to GND2	VDD2	3	3.3	5.5	V	NOM column 3.3 V	6
Differential input voltage before clipping	VClipping	-320		320	mV	VIN = VINP - VINN	6
Specified linear differential full-scale voltage	VFSR	-250		250	mV	VIN = VINP - VINN	6
Absolute common-mode input voltage	(VINP+VINN)/2	-2			V	(VINP+VINN)/2 to GND1; maximum printed as VDD1	6
Operating common-mode input voltage	VCM	-0.16			V	(VINP+VINN)/2 to GND1; maximum printed as VDD1, 2.1 V	6
Specified ambient temperature (AMC1300B)	TA	-55		125	°C	AMC1300B	6
Input offset voltage, initial	VOS	-0.2	0.01	0.2	mV	AMC1300B, initial, TA = 25°C, VINP = VINN = GND1, 4.5 V ≤ VDD1 ≤ 5.5 V	10
Input offset drift	TCVOS	-0.9	0.1	0.9	uV/°C	AMC1300B	10
Input bias current	IIB	-41	-30	-24	uA	INP = INN = GND1; IIB = (IIBP+IIBN) / 2	10
Input offset current	IIO	-5		5	nA	IIO = IIBP - IIBN	10
Gain error, initial	EG	-0.3	0.05	0.3	%	AMC1300B, initial, at TA = 25°C	10
Gain error drift	TCEG	-30	5	30	ppm/°C	AMC1300B	10
Nonlinearity	NL	-0.03	0.01	0.03	%		10
Signal-to-noise ratio	SNR	81.5	85		dB	fIN = 1 kHz, BW = 10 kHz	10
Common-mode output voltage	VCMout	1.39	1.44	1.49	V		10
Clipping differential output voltage	VCLIPout	-2.52	2.49	2.52	V	VOUT = (VOUTP, VOUTN); /VIN/ = /VINP, VINN/ > /VClipping/	10
Failsafe differential output voltage	VFAILSAFE	-2.63	-2.57	-2.53	V	VCM ≥ VCMov, or VDD1 missing	10
Output resistance	ROUT			0.2	Ω	On OUTP or OUTN	11
Common-mode transient immunity (AMC1300B)	CMTI	100	150		kV/µs	/GND1, GND2/ = 1 kV, AMC1300B	11
VDD1 undervoltage detection threshold voltage	VDD1UV	2.4	2.6	2.8	V	VDD1 falling	11
High-side supply current (AMC1300B)	IDD1		6.3	8.5	mA	AMC1300B only, 3.0 V ≤ VDD1 ≤ 3.6 V	11
High-side supply current	IDD1		7.2	9.8	mA	4.5 V ≤ VDD1 ≤ 5.5 V	11
Low-side supply current	IDD2		5.3	7.2	mA	3.0 V ≤ VDD2 ≤ 3.6 V	11
Low-side supply current	IDD2		5.9	8.1	mA	4.5 V ≤ VDD2 ≤ 5.5 V	11
Junction-to-ambient thermal resistance	RθJA		85.4		°C/W		7
Junction-to-case (top) thermal resistance	RθJC(top)		26.8		°C/W		7
Junction-to-board thermal resistance	RθJB		43.5		°C/W		7
Junction-to-top characterization parameter	ψJT		4.8		°C/W		7
Junction-to-board characterization parameter	ψJB		41.2		°C/W		7

CAD (KiCad official)

Symbol: AMC1300BDWVR
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8-300mil (KiCad packages3D, STEP)
3D model files: amc1300bdwvr-etched.step / amc1300bdwvr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); amc1300bdwvr.step / amc1300bdwvr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: TEXAS INSTRUMENTS datasheet (39 pp, sha256 62a3f250106ff0f2, retrieved 2026-10-17, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF