component
AMC0311SDWVR
Public Made by Adomby adom
Texas Instruments , SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AMC0311SDWVR
Texas Instruments · IC · SOIC-8
AMC0311SDWVR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | High-side power supply, operating range 3V to 5.5V relative to GND1 (absolute max 6.5V); see Power Supply Recommendations for decoupling. |
| 2 | INP | input | Analog input of the amplifier; linear input range VINP - VSNSN of 0V to 2.25V. |
| 3 | SNSN | input | GND1 sense pin and inverting analog input to the amplifier; connect to GND1. |
| 4 | GND1 | power_in | High-side analog ground. |
| 5 | GND2 | power_in | Low-side analog ground. |
| 6 | REFIN | input | Reference input whose voltage is added as an offset to the output voltage; connect to a low-impedance source (0V to VDD2) or to GND2 if not used. |
| 7 | OUT | output | Single-ended analog output with fixed gain of 1V/V, supports up to 500pF capacitive load and a resistive load of at least 10kΩ to GND2. |
| 8 | VDD2 | power_in | Low-side power supply, operating range 3V to 5.5V relative to GND2 (absolute max 6.5V); see Power Supply Recommendations for decoupling. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side power supply | VDD1 | 3 | 5 | 5.5 | V | VDD1 to GND1 | 4 |
| Low-side power supply | VDD2 | 3 | 3.3 | 5.5 | V | VDD2 to GND2 | 4 |
| Specified linear input voltage | VFSR | 0 | 2.25 | V | VIN = VINP, VSNSN | 4 | |
| Reference input voltage | VREFIN | 0 | V | REFIN to GND2 | 4 | ||
| Capacitive load | CLOAD | 500 | pF | OUT to GND2 | 4 | ||
| Specified ambient temperature | TA | -40 | 125 | °C | 4 | ||
| High-side power supply voltage | VDD1 | -0.3 | 6.5 | V | VDD1 to GND1 | 4 | |
| Low-side power supply voltage | VDD2 | -0.3 | 6.5 | V | VDD2 to GND2 | 4 | |
| Input current | -10 | 10 | mA | Continuous, any pin except power-supply pins | 4 | ||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | -2000 | 2000 | V | Human-body model per ANSI/ESDA/JEDEC JS-001 | 4 | |
| ESD CDM | V(ESD) | -1000 | 1000 | V | Charged-device model per ANSI/ESDA/JEDEC JS-002 | 4 | |
| Input impedance | RINP | 0.05 | 2.4 | GΩ | INP pin to GND1 | 13 | |
| Input bias current | IIB, INP | -10 | 3 | 10 | nA | INP pin, INP = GND1 | 13 |
| Common-mode transient immunity | CMTI | 150 | V/ns | 13 | |||
| REFIN DC current out of pin | IREFIN | 3.7 | 4.45 | 5.2 | µA | VREFIN = 300mV, TA = 25℃ | 13 |
| REFIN DC current out of pin | IREFIN | 3.2 | 3.85 | 4.5 | µA | VREFIN = 450mV, TA = 25℃ | 13 |
| Input offset voltage | VOS | -1 | 0.15 | 1 | mV | VOS = (VOUT, VREFIN), INP = SNSN = GND1, VREFIN = 250mV, TA = 25°C | 13 |
| Input offset thermal drift | TCVOS | -30 | 3 | 30 | µV/°C | 13 | |
| Gain error | EG | -0.25 | 0.04 | 0.25 | % | TA = 25℃ | 13 |
| Gain error drift | TCEG | -50 | 5 | 50 | ppm/°C | 13 | |
| Nonlinearity | -0.08 | 0.002 | 0.08 | % | 13 | ||
| Output bandwidth | BW | 120 | 145 | kHz | 13 | ||
| Total harmonic distortion | THD | -83 | -73 | dB | VINP = 2VPP, VINP > 0V, fIN = 10kHz | 13 | |
| Signal-to-noise ratio | SNR | 75 | 80 | dB | VINP = 2.25VPP, fINP = 1kHz, BW = 10kHz | 13 | |
| High-side supply current | IDD1 | 4.4 | 5.6 | mA | 13 | ||
| Low-side supply current | IDD2 | 4.8 | 7.4 | mA | 13 | ||
| High-side undervoltage threshold rising | VDD1UV | 2.4 | 2.6 | 2.8 | V | VDD1 rising | 13 |
| High-side undervoltage threshold falling | VDD1UV | 1.9 | 2.05 | 2.2 | V | VDD1 falling | 13 |
| Low-side undervoltage threshold rising | VDD2UV | 2.3 | 2.5 | 2.7 | V | VDD2 rising | 14 |
| Low-side undervoltage threshold falling | VDD2UV | 1.9 | 2.05 | 2.2 | V | VDD2 falling | 14 |
| VINP to VOUT signal delay (50%, 50%) | 2.9 | 3.2 | µs | Unfiltered output | 14 | ||
| Analog settling time | tAS | 20 | 100 | µs | VDD1 step to 3.0V with VDD2 ≥ 3.0V to VOUT valid, 0.1% settling | 14 | |
| Output saturation voltage | VOUT, SAT | 150 | mV | INP = GND1, VREFIN = 3.3V, IOUT = -1mA (sinking) | 13 | ||
| Input capacitance | CIN | 2 | pF | 13 | |||
| Output resistance | ROUT | 0.2 | Ω | 13 | |||
| Output short-circuit current | 11 | mA | INP = GND1, output shorted to either GND2 or VDD2 | 13 | |||
| Output noise | 180 | µVRMS | INP = GND1, BW = 50kHz | 13 | |||
| Input impedance thermal drift | TCIREFIN | 235 | ppm/℃ | 13 | |||
| Output rise time | tr | 2.6 | µs | 10% to 90%, unfiltered output | 14 | ||
| Output fall time | tf | 2.6 | µs | 10% to 90%, unfiltered output | 14 | ||
| Junction-to-ambient thermal resistance | RθJA | 102.8 | °C/W | DWV (SOIC) 8 pins | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 45.1 | °C/W | DWV (SOIC) 8 pins | 6 | ||
| Junction-to-board thermal resistance | RθJB | 63 | °C/W | DWV (SOIC) 8 pins | 6 | ||
| Maximum power dissipation (both sides) | PD | 72 | mW | VDD1 = VDD2 = 5.5V | 6 |
CAD (KiCad official)
- Symbol:
AMC0311SDWVR - Footprint:
Package_SO:SOIC-8_7.5x5.85mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
amc0311sdwvr-etched.step/amc0311sdwvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);amc0311sdwvr.step/amc0311sdwvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (39 pp, sha256
bf0e850ae5ce0d4f, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AMC0311SDWVR
**Texas Instruments** · IC · SOIC-8
AMC0311SDWVR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | High-side power supply, operating range 3V to 5.5V relative to GND1 (absolute max 6.5V); see Power Supply Recommendations for decoupling. |
| 2 | INP | input | Analog input of the amplifier; linear input range VINP - VSNSN of 0V to 2.25V. |
| 3 | SNSN | input | GND1 sense pin and inverting analog input to the amplifier; connect to GND1. |
| 4 | GND1 | power_in | High-side analog ground. |
| 5 | GND2 | power_in | Low-side analog ground. |
| 6 | REFIN | input | Reference input whose voltage is added as an offset to the output voltage; connect to a low-impedance source (0V to VDD2) or to GND2 if not used. |
| 7 | OUT | output | Single-ended analog output with fixed gain of 1V/V, supports up to 500pF capacitive load and a resistive load of at least 10kΩ to GND2. |
| 8 | VDD2 | power_in | Low-side power supply, operating range 3V to 5.5V relative to GND2 (absolute max 6.5V); see Power Supply Recommendations for decoupling. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side power supply | VDD1 | 3 | 5 | 5.5 | V | VDD1 to GND1 | 4 |
| Low-side power supply | VDD2 | 3 | 3.3 | 5.5 | V | VDD2 to GND2 | 4 |
| Specified linear input voltage | VFSR | 0 | | 2.25 | V | VIN = VINP, VSNSN | 4 |
| Reference input voltage | VREFIN | 0 | | | V | REFIN to GND2 | 4 |
| Capacitive load | CLOAD | | | 500 | pF | OUT to GND2 | 4 |
| Specified ambient temperature | TA | -40 | | 125 | °C | | 4 |
| High-side power supply voltage | VDD1 | -0.3 | | 6.5 | V | VDD1 to GND1 | 4 |
| Low-side power supply voltage | VDD2 | -0.3 | | 6.5 | V | VDD2 to GND2 | 4 |
| Input current | | -10 | | 10 | mA | Continuous, any pin except power-supply pins | 4 |
| Junction temperature | TJ | | | 150 | °C | | 4 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 4 |
| ESD HBM | V(ESD) | -2000 | | 2000 | V | Human-body model per ANSI/ESDA/JEDEC JS-001 | 4 |
| ESD CDM | V(ESD) | -1000 | | 1000 | V | Charged-device model per ANSI/ESDA/JEDEC JS-002 | 4 |
| Input impedance | RINP | 0.05 | 2.4 | | GΩ | INP pin to GND1 | 13 |
| Input bias current | IIB, INP | -10 | 3 | 10 | nA | INP pin, INP = GND1 | 13 |
| Common-mode transient immunity | CMTI | 150 | | | V/ns | | 13 |
| REFIN DC current out of pin | IREFIN | 3.7 | 4.45 | 5.2 | µA | VREFIN = 300mV, TA = 25℃ | 13 |
| REFIN DC current out of pin | IREFIN | 3.2 | 3.85 | 4.5 | µA | VREFIN = 450mV, TA = 25℃ | 13 |
| Input offset voltage | VOS | -1 | 0.15 | 1 | mV | VOS = (VOUT, VREFIN), INP = SNSN = GND1, VREFIN = 250mV, TA = 25°C | 13 |
| Input offset thermal drift | TCVOS | -30 | 3 | 30 | µV/°C | | 13 |
| Gain error | EG | -0.25 | 0.04 | 0.25 | % | TA = 25℃ | 13 |
| Gain error drift | TCEG | -50 | 5 | 50 | ppm/°C | | 13 |
| Nonlinearity | | -0.08 | 0.002 | 0.08 | % | | 13 |
| Output bandwidth | BW | 120 | 145 | | kHz | | 13 |
| Total harmonic distortion | THD | | -83 | -73 | dB | VINP = 2VPP, VINP > 0V, fIN = 10kHz | 13 |
| Signal-to-noise ratio | SNR | 75 | 80 | | dB | VINP = 2.25VPP, fINP = 1kHz, BW = 10kHz | 13 |
| High-side supply current | IDD1 | | 4.4 | 5.6 | mA | | 13 |
| Low-side supply current | IDD2 | | 4.8 | 7.4 | mA | | 13 |
| High-side undervoltage threshold rising | VDD1UV | 2.4 | 2.6 | 2.8 | V | VDD1 rising | 13 |
| High-side undervoltage threshold falling | VDD1UV | 1.9 | 2.05 | 2.2 | V | VDD1 falling | 13 |
| Low-side undervoltage threshold rising | VDD2UV | 2.3 | 2.5 | 2.7 | V | VDD2 rising | 14 |
| Low-side undervoltage threshold falling | VDD2UV | 1.9 | 2.05 | 2.2 | V | VDD2 falling | 14 |
| VINP to VOUT signal delay (50%, 50%) | | | 2.9 | 3.2 | µs | Unfiltered output | 14 |
| Analog settling time | tAS | | 20 | 100 | µs | VDD1 step to 3.0V with VDD2 ≥ 3.0V to VOUT valid, 0.1% settling | 14 |
| Output saturation voltage | VOUT, SAT | | 150 | | mV | INP = GND1, VREFIN = 3.3V, IOUT = -1mA (sinking) | 13 |
| Input capacitance | CIN | | 2 | | pF | | 13 |
| Output resistance | ROUT | | | 0.2 | Ω | | 13 |
| Output short-circuit current | | | 11 | | mA | INP = GND1, output shorted to either GND2 or VDD2 | 13 |
| Output noise | | | 180 | | µVRMS | INP = GND1, BW = 50kHz | 13 |
| Input impedance thermal drift | TCIREFIN | | 235 | | ppm/℃ | | 13 |
| Output rise time | tr | | 2.6 | | µs | 10% to 90%, unfiltered output | 14 |
| Output fall time | tf | | 2.6 | | µs | 10% to 90%, unfiltered output | 14 |
| Junction-to-ambient thermal resistance | RθJA | | 102.8 | | °C/W | DWV (SOIC) 8 pins | 6 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 45.1 | | °C/W | DWV (SOIC) 8 pins | 6 |
| Junction-to-board thermal resistance | RθJB | | 63 | | °C/W | DWV (SOIC) 8 pins | 6 |
| Maximum power dissipation (both sides) | PD | | | 72 | mW | VDD1 = VDD2 = 5.5V | 6 |
## CAD (KiCad official)
- Symbol: `AMC0311SDWVR`
- Footprint: `Package_SO:SOIC-8_7.5x5.85mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `amc0311sdwvr-etched.step` / `amc0311sdwvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `amc0311sdwvr.step` / `amc0311sdwvr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/amc0311s.pdf) (39 pp, sha256 `bf0e850ae5ce0d4f`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/amc0311sdwvr-datasheet.pdf)