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AM2370N-T1-PF-VB

VBsemi Elec · MOSFETs · SOT-23(TO-236)

AM2370N-T1-PF-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±20 V with a threshold of 1.2 to 2.8 V at ID = 250 µA.
2 S passive Source; continuous source-drain body diode current is 2.1 A at TC = 25 °C.
3 D passive Drain; drain-source voltage is rated 100 V, with continuous drain current of 2 A at TC = 25 °C and pulsed drain current of 7 A.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SOT-23(TO-236)
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 2 A TC = 25 °C (TJ = 150 °C) 1
Continuous Drain Current ID 1.8 A TC = 70 °C (TJ = 150 °C) 1
Continuous Drain Current ID 1.6 A TA = 25 °C (Tb), surface mounted, t = 5 s 1
Continuous Drain Current ID 1.3 A TA = 70 °C (Tb), surface mounted, t = 5 s 1
Pulsed Drain Current IDM 7 A t = 300 µs 1
Single Pulse Avalanche Current IAS 5 A L = 0.1 mH 1
Single Pulse Avalanche Energy EAS 1.25 mJ 1
Continuous Source-Drain Diode Current IS 2.1 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS 1 A TA = 25 °C (Tb), surface mounted 1
Maximum Power Dissipation PD 2.5 W TC = 25 °C 1
Maximum Power Dissipation PD 1.6 W TC = 70 °C 1
Maximum Power Dissipation PD 1.25 W TA = 25 °C (Tb), surface mounted 1
Maximum Power Dissipation PD 0.8 W TA = 70 °C (Tb), surface mounted 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient (t = 5 s) RthJA 75 100 °C/W t = 5 s 1
Maximum Junction-to-Ambient (steady state) RthJA 166 °C/W steady state (from note d) 1
Maximum Junction-to-Foot (Drain), steady state RthJF 40 50 °C/W steady state 1
Drain-Source Breakdown Voltage VDS 100 V VDS = 0 V, ID = 250 µA 2
Gate-Source Threshold Voltage VGS(th) 1.2 2.8 V VDS = VGS, ID = 250 µA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 100 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 10 µA VDS = 100 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) 5 A VDS ≥ 5 V, VGS = 4.5 V 2
Drain-Source On-State Resistance RDS(on) 0.24 Ω VGS = 10 V, ID = 1.5 A 2
Drain-Source On-State Resistance RDS(on) 0.25 Ω VGS = 6 V, ID = 1 A 2
Gate Resistance Rg 0.3 1.4 2.8 Ω f = 1 MHz 2
Total Gate Charge Qg 5.2 10.4 nC VDS = 50 V, VGS = 10 V, ID = 1.6 A 2
Total Gate Charge Qg 2.9 5.8 nC VDS = 50 V, VGS = 4.5 V, ID = 1.6 A 2
Turn-On Delay Time td(on) 30 45 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω 2
Rise Time tr 26 39 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 17 26 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω 2
Fall Time tf 12 20 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω 2
Turn-On Delay Time td(on) 6 12 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω 2
Rise Time tr 10 20 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 10 20 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω 2
Fall Time tf 6 12 ns VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS 2.1 A TC = 25 °C 2
Pulse Diode Forward Current ISM 20 A 2
Body Diode Voltage VSD 0.8 1.2 V IS = 1.3 A 2
Body Diode Reverse Recovery Time trr 22 33 ns IF = 1.3 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 21 32 nC IF = 1.3 A, dI/dt = 100 A/µs, TJ = 25 °C 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: AM2370N-T1-PF-VB
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23(TO-236), generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: am2370n-t1-pf-vb-etched.step / am2370n-t1-pf-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); am2370n-t1-pf-vb.step / am2370n-t1-pf-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 43cbe7d1c87e3aee, retrieved 2026-11-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF