component

AL8863SP-13

Public Made by Adom

by adom

Diodes Incorporated LED Drivers, ESOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentled driversal8863sp-13factory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity

3D Model

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

Datasheet

Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

AL8863SP-13

Diodes Incorporated · LED Drivers · ESOP-8

AL8863SP-13 from Diodes Incorporated, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OSP input Output shorted protection input, used with CSN to detect an LED string short; if CSN-OSP stays below 1V for 23ms, FAULT goes low.
2 DIM input Multi-function on/off and brightness control: below 0.3V turns off output current, above 2.6V gives 100% of IOUT_NOM, and a PWM signal (low <0.3V, high >2.6V, transition time under 1µs) sets the output current up to 100%; a capacitor to ground increases soft-start time.
3 NTC input Connect an NTC resistor to GND to set the thermal fold-back break point, with fold-back starting when the NTC pin falls to 1.3V and a 100µA internal bias current.
4 GND power_in Ground reference for the device.
5 DRV output Gate driver output for the external switch Q1, with an absolute maximum pin voltage of -0.3V to +20V and a clamp voltage of 15V maximum.
6 VIN power_in Input voltage from 4.5V to 60V; decouple to ground with 10µF or higher X7R ceramic capacitor placed close to the device.
7 FAULT output Active-low, open-drain fault report pin that is asserted low for LED open circuit, LED short circuit or over-temperature and requires an external pull-up resistor (VFAULT_LOW maximum 700mV at 1mA).
8 CSN input Current sense negative input; the current sense resistor is connected between VIN and CSN for high-side sensing, with CSN input current of 16µA typical.
9 EP passive Exposed pad that must be connected to GND and thermal mass for enhanced thermal impedance, and should not be used as an electrical ground conduction path.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package ESOP-8
Category LED Drivers
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 4.5 60 V 3
Operating Frequency fSW 50 1000 kHz 3
Operating Ambient Temperature TA -40 125 °C 3
Input Voltage VIN -0.3 65 V 3
CSN, FAULT, OSP Pin Voltage VCSN, VFAULT, VOSP -0.3 65 V 3
DRV Pin Voltage VDRV -0.3 20 V 3
DIM, NTC Pin Voltage VDIM, VNTC -0.3 5.5 V 3
Operating Junction Temperature TJ -40 150 °C 3
Storage Temperature Range TSTG -65 165 °C 3
ESD Human-Body Model (HBM) VESD 2000 V 3
ESD Charged-Device Model (CDM) VESD 750 V 3
Input Voltage VIN 4.5 60 V 4
Mean Current Sense Threshold Voltage VSENSE 95 100 105 mV Measured on CSN Pin with Respect to VIN 4
Gate Driver Output Voltage High VGATE_HIGH 9 V VIN = 12V, Sourcing 20mA 4
Gate Driver Output Voltage Low VGATE_LOW 0.5 V VIN = 12V, Sinking 20mA 4
Gate Driver Clamp Voltage VGATE_CLAMP 15 V VIN = 18V, Sourcing 20mA 4
Recommended PWM Dimming Frequency fPWM 0.1 20 kHz 4
DIM Logic High Level VDIM_HIGH 2.6 5.5 V 4
DIM Logic Low Level VDIM_LOW 0.3 V 4
Recommended Maximum Switching Frequency fSW_MAX 1 MHz 4
FAULT Output Low Voltage VFAULT_LOW 700 mV IFAULT = 1mA 4
NTC Internal Bias Current IBIAS 95 100 105 µA 4
Quiescent Current IQ 600 µA DIM pin floating 4
VIN UVLO Rising Threshold UVLO 4.3 V 4
VIN UVLO Hysteresis UVLO_HYS 150 mV 4
Sense Threshold Hysteresis VSENSE_HYS 13 mV 4
CSN Pin Input Current ICSN 16 µA VCSN = VIN - 0.1 4
Gate Driver Rising Time tRISE 100 ns VIN = 13V, C = 10nF 4
Gate Driver Falling Time tFALL 60 ns VIN = 13V, C = 10nF 4
Gate Driver High Side Resistance RGH 5.7 Ω IDRV = -20mA 4
Gate Driver Low Side Resistance RGL 2.2 Ω IDRV = 20mA 4
Recommended Minimum Switch ON Time For 4% Accuracy tON_REC 500 ns 4
Internal Comparator Propagation Delay tPD 100 ns 4
Output Short Threshold Voltage V(CSN-OSP) 1 V 4
Delay Time for Fault Detection tD 23 ms 4
NTC Upper Threshold Voltage VNTC_HIGH 1.3 V Thermal fold-back starts 4
NTC Lower Threshold Voltage VNTC_LOWER 1 V Thermal fold-back stops 4
Thermal Shutdown Threshold TTSD 165 °C 4
Thermal Shutdown Hysteresis TTSD_HYS 30 °C 4
Junction-to-Ambient Thermal Resistance θJA 56 °C/W Note 5: 2"*2" FR-4 PCB, 2oz copper, minimum top-layer pad with thermal vias 4
Junction-to-Case (Top) Thermal Resistance θJC 6 °C/W 4

CAD (KiCad official)

  • Symbol: AL8863SP-13
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: al8863sp-13-etched.step / al8863sp-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); al8863sp-13.step / al8863sp-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (13 pp, sha256 8cb2b6e6c79f8a82, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF