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AIP74HC125TA14.TR

Wuxi I core Elec · Buffers, Drivers, Receivers, Transceivers · TSSOP-14

AIP74HC125TA14.TR from Wuxi I core Elec, in a TSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Active-LOW output enable input for gate 1; a HIGH level forces output 1Y into the high-impedance OFF-state.
2 1A input Data input for buffer gate 1; the CMOS level input (HC version) or TTL level input (HCT version) is specified in the features list.
3 1Y tri_state 3-state data output for gate 1, which goes high-impedance when 1OE is HIGH.
4 2OE input Active-LOW output enable input for gate 2; a HIGH level forces output 2Y into the high-impedance OFF-state.
5 2A input Data input for buffer gate 2; input clamp diodes allow current-limited interfacing to voltages above VCC.
6 2Y tri_state 3-state data output for gate 2, which goes high-impedance when 2OE is HIGH.
7 GND power_in Ground (0 V) reference for all voltages in the datasheet.
8 3Y tri_state 3-state data output for gate 3, which goes high-impedance when 3OE is HIGH.
9 3A input Data input for buffer gate 3; input clamp diodes allow current-limited interfacing to voltages above VCC.
10 3OE input Active-LOW output enable input for gate 3; a HIGH level forces output 3Y into the high-impedance OFF-state.
11 4Y tri_state 3-state data output for gate 4, which goes high-impedance when 4OE is HIGH.
12 4A input Data input for buffer gate 4; input clamp diodes allow current-limited interfacing to voltages above VCC.
13 4OE input Active-LOW output enable input for gate 4; a HIGH level forces output 4Y into the high-impedance OFF-state.
14 VCC power_in Supply voltage; the recommended range for the AiP74HC125 is 2.0 V to 6.0 V (5.0 V typical) with respect to GND.

Key specifications

Parameter Value
Manufacturer Wuxi I core Elec
Package TSSOP-14
Category Logic
Pins 14

CAD (KiCad official)

  • Symbol: AIP74HC125TA14.TR
  • Footprint: Package_SO:TSSOP-14_4.4x5mm_P0.65mm
  • 3D model: TSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: aip74hc125ta14-tr-etched.step / aip74hc125ta14-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); aip74hc125ta14-tr.step / aip74hc125ta14-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi I core Elec datasheet (17 pp, sha256 97e55e85e53263e9, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF