# AGM412S

**AGM-Semi** · MOSFETs · SOP-8

AGM412S from AGM-Semi, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source terminal of the N-channel MOSFET (pin 1, marked by the dot); tie together with pins 2 and 3. |
| 2 | S | passive | Source terminal of the N-channel MOSFET; tie together with pins 1 and 3. |
| 3 | S | passive | Source terminal of the N-channel MOSFET; tie together with pins 1 and 2. |
| 4 | G | input | Gate terminal; VGS rated ±20 V maximum, threshold 1.2 V min to 2.2 V max at ID=250μA. |
| 5 | D | passive | Drain terminal; VDS rated 40 V maximum, continuous ID 13 A at TA=25℃; tie together with pins 6-8. |
| 6 | D | passive | Drain terminal; VDS rated 40 V maximum; tie together with pins 5, 7 and 8. |
| 7 | D | passive | Drain terminal; VDS rated 40 V maximum; tie together with pins 5, 6 and 8. |
| 8 | D | passive | Drain terminal; VDS rated 40 V maximum; tie together with pins 5, 6 and 7. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | AGM-Semi |
| Package | SOP-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS |  |  | 40 | V | VGS=0V | 1 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V | VDS=0V | 1 |
| Drain Current-Continuous | ID |  |  | 13 | A | TA=25℃ | 1 |
| Drain Current-Continuous | ID |  |  | 8.5 | A | TA=100℃ | 1 |
| Drain Current-Pulsed | IDM |  |  | 52 | A |  | 1 |
| Maximum Power Dissipation | PD |  |  | 2.5 | w | TA=25℃ | 1 |
| Maximum Power Dissipation | PD |  |  | 1 | w | TA=100℃ | 1 |
| Avalanche energy | EAS |  |  | 90 | mJ |  | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 |  | 150 | ℃ |  | 1 |
| Thermal Resistance Junction-ambient | RθJA |  |  | 50 | ℃/W | Steady State | 1 |
| Drain-Source Breakdown Voltage | BVDSS | 40 |  |  | V | VGS=0V ID=250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | μA | VDS=40V,VGS=0V | 2 |
| Gate-Body Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | 1.2 | 1.4 | 2.2 | V | VDS=VGS,ID=250μA | 2 |
| Forward Transconductance | gFS |  | 10 |  | S | VDS=5V,ID=5A | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 11 | 14 | mΩ | VGS=10V, ID=8A | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 13.5 | 22 | mΩ | VGS=4.5V, ID=5A | 2 |
| Input Capacitance | Ciss |  | 1125 |  | pF | VGS=0V, VDS=20V,F=1MHZ | 2 |
| Output Capacitance | Coss |  | 103 |  | pF | VGS=0V, VDS=20V,F=1MHZ | 2 |
| Reverse Transfer Capacitance | Crss |  | 77 |  | pF | VGS=0V, VDS=20V,F=1MHZ | 2 |
| Turn-on Delay Time | td(on) |  | 9 |  | nS | VGS=10V,VDS=20V, ID=8A,RL=1Ω,RGEN=3Ω | 2 |
| Turn-on Rise Time | tr |  | 8 |  | nS | VGS=10V,VDS=20V, ID=8A,RL=1Ω,RGEN=3Ω | 2 |
| Turn-Off Delay Time | td(off) |  | 29 |  | nS | VGS=10V,VDS=20V, ID=8A,RL=1Ω,RGEN=3Ω | 2 |
| Turn-Off Fall Time | tf |  | 14 |  | nS | VGS=10V,VDS=20V, ID=8A,RL=1Ω,RGEN=3Ω | 2 |
| Total Gate Charge | Qg |  | 18 |  | nC | VGS=10V, VDS=20V, ID=8A | 2 |
| Gate-Source Charge | Qgs |  | 3.2 |  | nC | VGS=10V, VDS=20V, ID=8A | 2 |
| Gate-Drain Charge | Qgd |  | 3.8 |  | nC | VGS=10V, VDS=20V, ID=8A | 2 |
| Source-Drain Current (Body Diode) | ISD |  |  | 13 | A |  | 2 |
| Forward on Voltage | VSD |  |  | 1.2 | V | VGS=0V,IS=8A | 2 |
| Reverse Recovery Time | trr |  | 20 |  | ns | IF=8A , dI/dt=100A/µs , TJ=25℃ | 2 |
| Reverse Recovery Charge | Qrr |  | 10 |  | nc | IF=8A , dI/dt=100A/µs , TJ=25℃ | 2 |

## CAD (KiCad official)

- Symbol: `AGM412S`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `agm412s-etched.step` / `agm412s-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `agm412s.step` / `agm412s.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [AGM-Semi datasheet](docs/agm412s-datasheet.pdf) (9 pp, sha256 `07c88647dad2a1d6`, retrieved 2026-10-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/agm412s-datasheet.pdf)