# AGM056N10H

**AGM Semi** · MOSFETs · TO-263

AGM056N10H from AGM Semi, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V (VDS=0V), threshold VGS(th) 2 V min to 4 V max at ID=250µA. |
| 2 | D | passive | Drain (also the exposed tab); drain-source voltage rated 100 V, continuous drain current 140 A at Tc=25℃ (package limited). |
| 3 | S | passive | Source; body-diode source-drain current up to 140 A, with RDS(on) 5.1 mΩ typ and 6.4 mΩ max at VGS=10V, ID=40A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | AGM Semi |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 100 |  |  | V | VGS=0V ID=250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | μA | VDS=100V,VGS=0V | 2 |
| Gate-Body Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Gate Threshold Voltage | VGS(th) | 2 | 2.8 | 4 | V | VDS=VGS,ID=250μA | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 5.1 | 6.4 | mΩ | VGS=10V, ID=40A | 2 |
| Source-Drain Current (Body Diode) | ISD |  |  | 140 | A |  | 2 |
| Forward on Voltage | VSD |  | 0.9 | 1.2 | V | VGS=0V,IS=40A | 2 |
| Drain-Source Voltage | VDS |  |  | 100 | V | VGS=0V | 1 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V | VDS=0V | 1 |
| Drain Current-Continuous | ID |  |  | 140 | A | Tc=25℃ (Note 1) | 1 |
| Drain Current-Continuous | ID |  |  | 95 | A | Tc=100℃ | 1 |
| Drain Current-Pulsed | IDM (pluse) |  |  | 560 | A | Note 2 | 1 |
| Maximum Power Dissipation | PD |  |  | 227 | w | Tc=25℃ | 1 |
| Maximum Power Dissipation | PD |  |  | 91 | w | Tc=100℃ | 1 |
| Avalanche energy | EAS |  |  | 625 | mJ | Note 3 | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 |  | 150 | ℃ |  | 1 |
| Thermal Resistance Junction-ambient (Steady State) | RθJA |  |  | 65 | ℃/W | Steady State | 1 |
| Thermal Resistance Junction-Case | RθJC |  |  | 0.55 | ℃/W |  | 1 |

## CAD (KiCad official)

- Symbol: `AGM056N10H`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `agm056n10h-etched.step` / `agm056n10h-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `agm056n10h.step` / `agm056n10h.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [AGM Semi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602986919378894848) (8 pp, sha256 `f2cd5c4d5a0172f1`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/agm056n10h-datasheet.pdf)