component
AFE4490RHAT
Public Made by Adomby adom
Texas Instruments Analog Front End (AFEs), VQFN-40-EP(6x6). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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AFE4490RHAT
Texas Instruments · Analog Front End (AFEs) · VQFN-40-EP(6x6)
AFE4490RHAT from Texas Instruments, in a VQFN-40-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | INN | input | Receiver input pin that connects to the photodiode anode. |
| 2 | INP | input | Receiver input pin that connects to the photodiode cathode. |
| 3 | RX_ANA_GND | power_in | Rx analog ground pin that connects to common board ground. |
| 4 | VCM | passive | Input common-mode voltage output, expected at 0.9 V, with a 1 kΩ series resistor and 10 nF decoupling capacitor to ground. |
| 5 | DNC | unconnected | Do not connect; leave as open circuit. |
| 6 | DNC | unconnected | Do not connect; leave as open circuit. |
| 7 | BG | passive | Decoupling capacitor for the internal band-gap voltage, requiring a 2.2 µF capacitor to ground with an expected voltage of 1.0 V. |
| 8 | VSS | power_in | Substrate ground pin that connects to common board ground. |
| 9 | TX_REF | passive | Transmitter reference voltage, 0.75 V by default after reset, requiring a 2.2 µF decoupling capacitor to ground. |
| 10 | DNC | unconnected | Do not connect; leave as open circuit. |
| 11 | TX_CTRL_SUP | power_in | Transmit control supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 12 | LED_DRV_GND | power_in | LED driver ground pin for the H-bridge that connects to common board ground. |
| 13 | LED_DRV_GND | power_in | LED driver ground pin for the H-bridge that connects to common board ground. |
| 14 | TXN | output | LED driver H-bridge output B that connects to the LED. |
| 15 | TXP | output | LED driver H-bridge output B that connects to the LED. |
| 16 | LED_DRV_GND | power_in | LED driver ground pin for the H-bridge that connects to common board ground. |
| 17 | LED_DRV_SUP | power_in | LED driver supply pin for the H-bridge that must be fed by a supply capable of delivering the large LED current. |
| 18 | LED_DRV_SUP | power_in | LED driver supply pin for the H-bridge that must be fed by a supply capable of delivering the large LED current. |
| 19 | RX_DIG_GND | power_in | Rx digital ground pin that connects to common board ground. |
| 20 | AFE_PDN | input | AFE-only power-down input that is active low. |
| 21 | DIAG_END | output | Output signal that indicates completion of diagnostics and can connect to a microcontroller port pin. |
| 22 | LED_ALM | output | Output signal that indicates an LED cable fault and can connect to a microcontroller port pin. |
| 23 | PD_ALM/ADC Reset | output | Output signal that indicates a photodiode sensor or cable fault, and in ADC bypass mode carries the ADC reset signal. |
| 24 | SCLK | input | SPI clock pin. |
| 25 | SPISOMI | output | SPI serial out, master in pin. |
| 26 | SPISIMO | input | SPI serial in, master out pin. |
| 27 | SPISTE | input | SPI serial interface enable pin. |
| 28 | ADC_RDY | output | Output signal that indicates ADC conversion completion and can connect to a microcontroller interrupt input. |
| 29 | RESET | input | AFE-only reset input that is active low. |
| 30 | CLKOUT | output | Buffered 4-MHz clock output that can connect to a microcontroller clock input. |
| 31 | RX_DIG_SUP | power_in | Rx digital supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 32 | RX_DIG_GND | power_in | Rx digital ground pin that connects to common board ground. |
| 33 | RX_ANA_SUP | power_in | Rx analog supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 34 | RXOUTN | input | External ADC negative input used in ADC bypass mode. |
| 35 | RXOUTP | input | External ADC positive input used in ADC bypass mode. |
| 36 | RX_ANA_GND | power_in | Rx analog ground pin that connects to common board ground. |
| 37 | XOUT | passive | Crystal oscillator pin; connect an external 8 MHz crystal between XIN and XOUT with the vendor-specified load capacitors to ground. |
| 38 | XIN | passive | Crystal oscillator pin; connect an external 8 MHz crystal between XIN and XOUT with the vendor-specified load capacitors to ground. |
| 39 | RX_ANA_SUP | power_in | Rx analog supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 40 | RX_ANA_GND | power_in | Rx analog ground pin that connects to common board ground. |
| 41 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-40-EP(6x6) |
| Category | ADC/DAC/Data Conversion |
| Pins | 41 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| RX_ANA_SUP, RX_DIG_SUP to RX_ANA_GND, RX_DIG_GND | -0.3 | 4 | V | 8 | |||
| TX_CTRL_SUP, LED_DRV_SUP to LED_DRV_GND | -0.3 | 6 | V | 8 | |||
| RX_ANA_GND, RX_DIG_GND to LED_DRV_GND | -0.3 | 0.3 | V | 8 | |||
| TXP, TXN pins voltage | -0.3 | V | Maximum is the minimum of 6 V and (LED_DRV_SUP + 0.3) V | 8 | |||
| Input current to any pin except supply pins | -7 | 7 | mA | 8 | |||
| Input current momentary | -50 | 50 | mA | Momentary | 8 | ||
| Input current continuous | -7 | 7 | mA | Continuous | 8 | ||
| Operating temperature range | -40 | 85 | °C | 8 | |||
| Maximum junction temperature | TJ | 125 | °C | 8 | |||
| Storage temperature range | Tstg | -60 | 150 | °C | 8 | ||
| Electrostatic discharge, human body model | V(ESD) | -1000 | 1000 | V | HBM, per ANSI/ESDA/JEDEC JS-001, all pins | 8 | |
| Electrostatic discharge, charged device model | V(ESD) | -250 | 250 | V | CDM, per JEDEC JESD22-C101, all pins | 8 | |
| RX_ANA_SUP AFE analog supply | RX_ANA_SUP | 2 | 3.6 | V | 9 | ||
| RX_DIG_SUP AFE digital supply | RX_DIG_SUP | 2 | 3.6 | V | 9 | ||
| TX_CTRL_SUP Transmit controller supply | TX_CTRL_SUP | 3 | 5.25 | V | 9 | ||
| LED_DRV_SUP Transmit LED driver supply | LED_DRV_SUP | 3 | 5.25 | V | H-bridge or common anode; minimum is 3.0 or (VHR + VLED + VCABLE), whichever is greater | 9 | |
| Difference between LED_DRV_SUP and TX_CTRL_SUP | -0.3 | 0.3 | V | 9 | |||
| Specified temperature range | -40 | 85 | °C | 9 | |||
| Junction-to-ambient thermal resistance RθJA | RθJA | 35 | °C/W | RHA (VQFN) 40 pins | 9 | ||
| Junction-to-case (top) thermal resistance RθJC(top) | RθJC(top) | 31 | °C/W | RHA (VQFN) 40 pins | 9 | ||
| Junction-to-board thermal resistance RθJB | RθJB | 26 | °C/W | RHA (VQFN) 40 pins | 9 | ||
| Junction-to-top characterization parameter ψJT | ψJT | 0.1 | °C/W | RHA (VQFN) 40 pins | 9 | ||
| Gain accuracy | -7 | 7 | % | I-V transimpedance amplifier gain | 11 | ||
| Feedback resistor tolerance | RF | -7 | 7 | % | 11 | ||
| Feedback capacitor tolerance | CF | -20 | 20 | % | 11 | ||
| External differential input capacitance | 10 | 1000 | pF | Includes equivalent capacitance of photodiode, cables, EMI filter, and so forth | 11 | ||
| Shield output voltage | VO(shield) | 0.8 | 0.9 | 1 | V | With a 1-kΩ series resistor and a 10-nF decoupling capacitor to ground, when loaded with a small current (for example, of a few µA or less) | 11 |
| Current DAC range | 0 | 10 | µA | Ambient cancellation stage | 11 | ||
| Current DAC step size | 1 | µA | Ambient cancellation stage | 11 | |||
| ADC full-scale voltage | -1.2 | 1.2 | V | ADC full-scale voltage ±1.2 V | 11 | ||
| Pulse repetition frequency | PRF | 62.5 | 5000 | SPS | 10 | ||
| Common-mode rejection ratio, LED1 and LED2 | CMRR | 75 | dB | fCM = 50 Hz and 60 Hz, LED1 and LED2 with RSERIES = 500 kΩ, RF = 500 kΩ | 10 | ||
| Common-mode rejection ratio, LED1-AMB and LED2-AMB | CMRR | 95 | dB | fCM = 50 Hz and 60 Hz, LED1-AMB and LED2-AMB with RSERIES = 500 kΩ, RF = 500 kΩ | 10 | ||
| Power-supply rejection ratio | PSRR | 100 | dB | fPS = 50 Hz, 60 Hz at PRF = 200 Hz | 10 | ||
| Power-supply rejection ratio | PSRR | 106 | dB | fCM = 50 Hz, 60 Hz at PRF = 600 Hz | 10 | ||
| PSRR, transmit LED driver | PSRRLED | 75 | dB | With respect to ripple on LED_DRV_SUP | 10 | ||
| PSRR, transmit control | PSRRTx | 60 | dB | With respect to ripple on TX_CTRL_SUP | 10 | ||
| PSRR, receiver | PSRRRx | 60 | dB | With respect to ripple on RX_ANA_SUP and RX_DIG_SUP | 10 | ||
| Transmitter noise dynamic range at 25 mA | 110 | dB | 0.1-Hz to 20-Hz bandwidth, at 25-mA output current | 11 | |||
| Transmitter noise dynamic range at 100 mA | 110 | dB | 0.1-Hz to 20-Hz bandwidth, at 100-mA output current | 11 | |||
| Minimum sample time of LED1 and LED2 pulses | 50 | µs | 11 | ||||
| LED current DAC error | -5 | 5 | % | 11 | |||
| LED current DAC leakage current | 1 | µA | LED_ON = 0 | 11 | |||
| LED current DAC leakage current | 50 | µA | LED_ON = 1 | 11 | |||
| LED current DAC linearity | 0.5 | % | Percent of full-scale current | 11 | |||
| Output current settling time | 7 | µs | From zero current to 150 mA (with resistive load) | 11 | |||
| Duration of diagnostics state machine, slow diagnostics off | 8 | ms | EN_SLOW_DIAG = 0; start of diagnostics after the DIAG_EN register bit is set, end indicated by DIAG_END going high | 12 | |||
| Duration of diagnostics state machine, slow diagnostics on | 16 | ms | EN_SLOW_DIAG = 1; start of diagnostics after the DIAG_EN register bit is set, end indicated by DIAG_END going high | 12 | |||
| Open fault resistance | 100 | kΩ | Diagnostics open fault detection threshold | 12 | |||
| Short fault resistance | 10 | kΩ | Diagnostics short fault detection threshold | 12 | |||
| Diagnostics current | 100 | µA | During diagnostics mode | 12 | |||
| Maximum allowable external clock jitter | 50 | ps | 12 | ||||
| External clock input frequency tolerance | -10 | 10 | % | External clock input frequency 8 MHz | 12 | ||
| External clock input current | 1 | µA | 12 | ||||
| Logic input current | IIN | 0.1 | µA | Digital inputs at VIH or VIL | 12 | ||
| Logic low output voltage | VOL | 0.1 | V | DIAG_END, LED_ALM, PD_ALM, SPI SOMI, ADC_RDY, CLKOUT | 12 | ||
| Pin leakage current | 1 | nA | To GND and supply | 12 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pet | counter (running off of the 4-MHz clock) to set the time-base. All timing signals are set with reference to the pulse repetition period (PRP). Therefore, a dedicated compare | 33 |
CAD (KiCad official)
- Symbol:
AFE4490RHAT - Footprint:
Package_DFN_QFN:QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm - 3D model: VQFN-40-EP(6x6) (KiCad packages3D, STEP)
- 3D model files:
afe4490rhat-etched.step/afe4490rhat-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);afe4490rhat.step/afe4490rhat.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (102 pp, sha256
24df2fc56cacfa70, retrieved 2026-11-02, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# AFE4490RHAT
**Texas Instruments** · Analog Front End (AFEs) · VQFN-40-EP(6x6)
AFE4490RHAT from Texas Instruments, in a VQFN-40-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | INN | input | Receiver input pin that connects to the photodiode anode. |
| 2 | INP | input | Receiver input pin that connects to the photodiode cathode. |
| 3 | RX_ANA_GND | power_in | Rx analog ground pin that connects to common board ground. |
| 4 | VCM | passive | Input common-mode voltage output, expected at 0.9 V, with a 1 kΩ series resistor and 10 nF decoupling capacitor to ground. |
| 5 | DNC | unconnected | Do not connect; leave as open circuit. |
| 6 | DNC | unconnected | Do not connect; leave as open circuit. |
| 7 | BG | passive | Decoupling capacitor for the internal band-gap voltage, requiring a 2.2 µF capacitor to ground with an expected voltage of 1.0 V. |
| 8 | VSS | power_in | Substrate ground pin that connects to common board ground. |
| 9 | TX_REF | passive | Transmitter reference voltage, 0.75 V by default after reset, requiring a 2.2 µF decoupling capacitor to ground. |
| 10 | DNC | unconnected | Do not connect; leave as open circuit. |
| 11 | TX_CTRL_SUP | power_in | Transmit control supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 12 | LED_DRV_GND | power_in | LED driver ground pin for the H-bridge that connects to common board ground. |
| 13 | LED_DRV_GND | power_in | LED driver ground pin for the H-bridge that connects to common board ground. |
| 14 | TXN | output | LED driver H-bridge output B that connects to the LED. |
| 15 | TXP | output | LED driver H-bridge output B that connects to the LED. |
| 16 | LED_DRV_GND | power_in | LED driver ground pin for the H-bridge that connects to common board ground. |
| 17 | LED_DRV_SUP | power_in | LED driver supply pin for the H-bridge that must be fed by a supply capable of delivering the large LED current. |
| 18 | LED_DRV_SUP | power_in | LED driver supply pin for the H-bridge that must be fed by a supply capable of delivering the large LED current. |
| 19 | RX_DIG_GND | power_in | Rx digital ground pin that connects to common board ground. |
| 20 | AFE_PDN | input | AFE-only power-down input that is active low. |
| 21 | DIAG_END | output | Output signal that indicates completion of diagnostics and can connect to a microcontroller port pin. |
| 22 | LED_ALM | output | Output signal that indicates an LED cable fault and can connect to a microcontroller port pin. |
| 23 | PD_ALM/ADC Reset | output | Output signal that indicates a photodiode sensor or cable fault, and in ADC bypass mode carries the ADC reset signal. |
| 24 | SCLK | input | SPI clock pin. |
| 25 | SPISOMI | output | SPI serial out, master in pin. |
| 26 | SPISIMO | input | SPI serial in, master out pin. |
| 27 | SPISTE | input | SPI serial interface enable pin. |
| 28 | ADC_RDY | output | Output signal that indicates ADC conversion completion and can connect to a microcontroller interrupt input. |
| 29 | RESET | input | AFE-only reset input that is active low. |
| 30 | CLKOUT | output | Buffered 4-MHz clock output that can connect to a microcontroller clock input. |
| 31 | RX_DIG_SUP | power_in | Rx digital supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 32 | RX_DIG_GND | power_in | Rx digital ground pin that connects to common board ground. |
| 33 | RX_ANA_SUP | power_in | Rx analog supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 34 | RXOUTN | input | External ADC negative input used in ADC bypass mode. |
| 35 | RXOUTP | input | External ADC positive input used in ADC bypass mode. |
| 36 | RX_ANA_GND | power_in | Rx analog ground pin that connects to common board ground. |
| 37 | XOUT | passive | Crystal oscillator pin; connect an external 8 MHz crystal between XIN and XOUT with the vendor-specified load capacitors to ground. |
| 38 | XIN | passive | Crystal oscillator pin; connect an external 8 MHz crystal between XIN and XOUT with the vendor-specified load capacitors to ground. |
| 39 | RX_ANA_SUP | power_in | Rx analog supply pin that requires a 0.1 µF decoupling capacitor to ground. |
| 40 | RX_ANA_GND | power_in | Rx analog ground pin that connects to common board ground. |
| 41 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-40-EP(6x6) |
| Category | ADC/DAC/Data Conversion |
| Pins | 41 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| RX_ANA_SUP, RX_DIG_SUP to RX_ANA_GND, RX_DIG_GND | | -0.3 | | 4 | V | | 8 |
| TX_CTRL_SUP, LED_DRV_SUP to LED_DRV_GND | | -0.3 | | 6 | V | | 8 |
| RX_ANA_GND, RX_DIG_GND to LED_DRV_GND | | -0.3 | | 0.3 | V | | 8 |
| TXP, TXN pins voltage | | -0.3 | | | V | Maximum is the minimum of 6 V and (LED_DRV_SUP + 0.3) V | 8 |
| Input current to any pin except supply pins | | -7 | | 7 | mA | | 8 |
| Input current momentary | | -50 | | 50 | mA | Momentary | 8 |
| Input current continuous | | -7 | | 7 | mA | Continuous | 8 |
| Operating temperature range | | -40 | | 85 | °C | | 8 |
| Maximum junction temperature | TJ | | | 125 | °C | | 8 |
| Storage temperature range | Tstg | -60 | | 150 | °C | | 8 |
| Electrostatic discharge, human body model | V(ESD) | -1000 | | 1000 | V | HBM, per ANSI/ESDA/JEDEC JS-001, all pins | 8 |
| Electrostatic discharge, charged device model | V(ESD) | -250 | | 250 | V | CDM, per JEDEC JESD22-C101, all pins | 8 |
| RX_ANA_SUP AFE analog supply | RX_ANA_SUP | 2 | | 3.6 | V | | 9 |
| RX_DIG_SUP AFE digital supply | RX_DIG_SUP | 2 | | 3.6 | V | | 9 |
| TX_CTRL_SUP Transmit controller supply | TX_CTRL_SUP | 3 | | 5.25 | V | | 9 |
| LED_DRV_SUP Transmit LED driver supply | LED_DRV_SUP | 3 | | 5.25 | V | H-bridge or common anode; minimum is 3.0 or (VHR + VLED + VCABLE), whichever is greater | 9 |
| Difference between LED_DRV_SUP and TX_CTRL_SUP | | -0.3 | | 0.3 | V | | 9 |
| Specified temperature range | | -40 | | 85 | °C | | 9 |
| Junction-to-ambient thermal resistance RθJA | RθJA | | 35 | | °C/W | RHA (VQFN) 40 pins | 9 |
| Junction-to-case (top) thermal resistance RθJC(top) | RθJC(top) | | 31 | | °C/W | RHA (VQFN) 40 pins | 9 |
| Junction-to-board thermal resistance RθJB | RθJB | | 26 | | °C/W | RHA (VQFN) 40 pins | 9 |
| Junction-to-top characterization parameter ψJT | ψJT | | 0.1 | | °C/W | RHA (VQFN) 40 pins | 9 |
| Gain accuracy | | -7 | | 7 | % | I-V transimpedance amplifier gain | 11 |
| Feedback resistor tolerance | RF | -7 | | 7 | % | | 11 |
| Feedback capacitor tolerance | CF | -20 | | 20 | % | | 11 |
| External differential input capacitance | | 10 | | 1000 | pF | Includes equivalent capacitance of photodiode, cables, EMI filter, and so forth | 11 |
| Shield output voltage | VO(shield) | 0.8 | 0.9 | 1 | V | With a 1-kΩ series resistor and a 10-nF decoupling capacitor to ground, when loaded with a small current (for example, of a few µA or less) | 11 |
| Current DAC range | | 0 | | 10 | µA | Ambient cancellation stage | 11 |
| Current DAC step size | | | 1 | | µA | Ambient cancellation stage | 11 |
| ADC full-scale voltage | | -1.2 | | 1.2 | V | ADC full-scale voltage ±1.2 V | 11 |
| Pulse repetition frequency | PRF | 62.5 | | 5000 | SPS | | 10 |
| Common-mode rejection ratio, LED1 and LED2 | CMRR | 75 | | | dB | fCM = 50 Hz and 60 Hz, LED1 and LED2 with RSERIES = 500 kΩ, RF = 500 kΩ | 10 |
| Common-mode rejection ratio, LED1-AMB and LED2-AMB | CMRR | 95 | | | dB | fCM = 50 Hz and 60 Hz, LED1-AMB and LED2-AMB with RSERIES = 500 kΩ, RF = 500 kΩ | 10 |
| Power-supply rejection ratio | PSRR | 100 | | | dB | fPS = 50 Hz, 60 Hz at PRF = 200 Hz | 10 |
| Power-supply rejection ratio | PSRR | 106 | | | dB | fCM = 50 Hz, 60 Hz at PRF = 600 Hz | 10 |
| PSRR, transmit LED driver | PSRRLED | 75 | | | dB | With respect to ripple on LED_DRV_SUP | 10 |
| PSRR, transmit control | PSRRTx | 60 | | | dB | With respect to ripple on TX_CTRL_SUP | 10 |
| PSRR, receiver | PSRRRx | 60 | | | dB | With respect to ripple on RX_ANA_SUP and RX_DIG_SUP | 10 |
| Transmitter noise dynamic range at 25 mA | | 110 | | | dB | 0.1-Hz to 20-Hz bandwidth, at 25-mA output current | 11 |
| Transmitter noise dynamic range at 100 mA | | 110 | | | dB | 0.1-Hz to 20-Hz bandwidth, at 100-mA output current | 11 |
| Minimum sample time of LED1 and LED2 pulses | | 50 | | | µs | | 11 |
| LED current DAC error | | -5 | | 5 | % | | 11 |
| LED current DAC leakage current | | | | 1 | µA | LED_ON = 0 | 11 |
| LED current DAC leakage current | | | | 50 | µA | LED_ON = 1 | 11 |
| LED current DAC linearity | | | | 0.5 | % | Percent of full-scale current | 11 |
| Output current settling time | | | | 7 | µs | From zero current to 150 mA (with resistive load) | 11 |
| Duration of diagnostics state machine, slow diagnostics off | | | | 8 | ms | EN_SLOW_DIAG = 0; start of diagnostics after the DIAG_EN register bit is set, end indicated by DIAG_END going high | 12 |
| Duration of diagnostics state machine, slow diagnostics on | | | | 16 | ms | EN_SLOW_DIAG = 1; start of diagnostics after the DIAG_EN register bit is set, end indicated by DIAG_END going high | 12 |
| Open fault resistance | | 100 | | | kΩ | Diagnostics open fault detection threshold | 12 |
| Short fault resistance | | | | 10 | kΩ | Diagnostics short fault detection threshold | 12 |
| Diagnostics current | | | | 100 | µA | During diagnostics mode | 12 |
| Maximum allowable external clock jitter | | | | 50 | ps | | 12 |
| External clock input frequency tolerance | | -10 | | 10 | % | External clock input frequency 8 MHz | 12 |
| External clock input current | | | | 1 | µA | | 12 |
| Logic input current | IIN | | | 0.1 | µA | Digital inputs at VIH or VIL | 12 |
| Logic low output voltage | VOL | | | 0.1 | V | DIAG_END, LED_ALM, PD_ALM, SPI SOMI, ADC_RDY, CLKOUT | 12 |
| Pin leakage current | | | | 1 | nA | To GND and supply | 12 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pet | | counter (running off of the 4-MHz clock) to set the time-base. All timing signals are set with reference to the pulse repetition period (PRP). Therefore, a dedicated compare | 33 |
## CAD (KiCad official)
- Symbol: `AFE4490RHAT`
- Footprint: `Package_DFN_QFN:QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm`
- 3D model: VQFN-40-EP(6x6) (KiCad packages3D, STEP)
- 3D model files: `afe4490rhat-etched.step` / `afe4490rhat-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `afe4490rhat.step` / `afe4490rhat.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/afe4490rhat.pdf) (102 pp, sha256 `24df2fc56cacfa70`, retrieved 2026-11-02, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/afe4490rhat-datasheet.pdf)