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AFE4490RHAT

Texas Instruments · Analog Front End (AFEs) · VQFN-40-EP(6x6)

AFE4490RHAT from Texas Instruments, in a VQFN-40-EP(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 INN input Receiver input pin that connects to the photodiode anode.
2 INP input Receiver input pin that connects to the photodiode cathode.
3 RX_ANA_GND power_in Rx analog ground pin that connects to common board ground.
4 VCM passive Input common-mode voltage output, expected at 0.9 V, with a 1 kΩ series resistor and 10 nF decoupling capacitor to ground.
5 DNC unconnected Do not connect; leave as open circuit.
6 DNC unconnected Do not connect; leave as open circuit.
7 BG passive Decoupling capacitor for the internal band-gap voltage, requiring a 2.2 µF capacitor to ground with an expected voltage of 1.0 V.
8 VSS power_in Substrate ground pin that connects to common board ground.
9 TX_REF passive Transmitter reference voltage, 0.75 V by default after reset, requiring a 2.2 µF decoupling capacitor to ground.
10 DNC unconnected Do not connect; leave as open circuit.
11 TX_CTRL_SUP power_in Transmit control supply pin that requires a 0.1 µF decoupling capacitor to ground.
12 LED_DRV_GND power_in LED driver ground pin for the H-bridge that connects to common board ground.
13 LED_DRV_GND power_in LED driver ground pin for the H-bridge that connects to common board ground.
14 TXN output LED driver H-bridge output B that connects to the LED.
15 TXP output LED driver H-bridge output B that connects to the LED.
16 LED_DRV_GND power_in LED driver ground pin for the H-bridge that connects to common board ground.
17 LED_DRV_SUP power_in LED driver supply pin for the H-bridge that must be fed by a supply capable of delivering the large LED current.
18 LED_DRV_SUP power_in LED driver supply pin for the H-bridge that must be fed by a supply capable of delivering the large LED current.
19 RX_DIG_GND power_in Rx digital ground pin that connects to common board ground.
20 AFE_PDN input AFE-only power-down input that is active low.
21 DIAG_END output Output signal that indicates completion of diagnostics and can connect to a microcontroller port pin.
22 LED_ALM output Output signal that indicates an LED cable fault and can connect to a microcontroller port pin.
23 PD_ALM/ADC Reset output Output signal that indicates a photodiode sensor or cable fault, and in ADC bypass mode carries the ADC reset signal.
24 SCLK input SPI clock pin.
25 SPISOMI output SPI serial out, master in pin.
26 SPISIMO input SPI serial in, master out pin.
27 SPISTE input SPI serial interface enable pin.
28 ADC_RDY output Output signal that indicates ADC conversion completion and can connect to a microcontroller interrupt input.
29 RESET input AFE-only reset input that is active low.
30 CLKOUT output Buffered 4-MHz clock output that can connect to a microcontroller clock input.
31 RX_DIG_SUP power_in Rx digital supply pin that requires a 0.1 µF decoupling capacitor to ground.
32 RX_DIG_GND power_in Rx digital ground pin that connects to common board ground.
33 RX_ANA_SUP power_in Rx analog supply pin that requires a 0.1 µF decoupling capacitor to ground.
34 RXOUTN input External ADC negative input used in ADC bypass mode.
35 RXOUTP input External ADC positive input used in ADC bypass mode.
36 RX_ANA_GND power_in Rx analog ground pin that connects to common board ground.
37 XOUT passive Crystal oscillator pin; connect an external 8 MHz crystal between XIN and XOUT with the vendor-specified load capacitors to ground.
38 XIN passive Crystal oscillator pin; connect an external 8 MHz crystal between XIN and XOUT with the vendor-specified load capacitors to ground.
39 RX_ANA_SUP power_in Rx analog supply pin that requires a 0.1 µF decoupling capacitor to ground.
40 RX_ANA_GND power_in Rx analog ground pin that connects to common board ground.
41 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-40-EP(6x6)
Category ADC/DAC/Data Conversion
Pins 41

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
RX_ANA_SUP, RX_DIG_SUP to RX_ANA_GND, RX_DIG_GND -0.3 4 V 8
TX_CTRL_SUP, LED_DRV_SUP to LED_DRV_GND -0.3 6 V 8
RX_ANA_GND, RX_DIG_GND to LED_DRV_GND -0.3 0.3 V 8
TXP, TXN pins voltage -0.3 V Maximum is the minimum of 6 V and (LED_DRV_SUP + 0.3) V 8
Input current to any pin except supply pins -7 7 mA 8
Input current momentary -50 50 mA Momentary 8
Input current continuous -7 7 mA Continuous 8
Operating temperature range -40 85 °C 8
Maximum junction temperature TJ 125 °C 8
Storage temperature range Tstg -60 150 °C 8
Electrostatic discharge, human body model V(ESD) -1000 1000 V HBM, per ANSI/ESDA/JEDEC JS-001, all pins 8
Electrostatic discharge, charged device model V(ESD) -250 250 V CDM, per JEDEC JESD22-C101, all pins 8
RX_ANA_SUP AFE analog supply RX_ANA_SUP 2 3.6 V 9
RX_DIG_SUP AFE digital supply RX_DIG_SUP 2 3.6 V 9
TX_CTRL_SUP Transmit controller supply TX_CTRL_SUP 3 5.25 V 9
LED_DRV_SUP Transmit LED driver supply LED_DRV_SUP 3 5.25 V H-bridge or common anode; minimum is 3.0 or (VHR + VLED + VCABLE), whichever is greater 9
Difference between LED_DRV_SUP and TX_CTRL_SUP -0.3 0.3 V 9
Specified temperature range -40 85 °C 9
Junction-to-ambient thermal resistance RθJA RθJA 35 °C/W RHA (VQFN) 40 pins 9
Junction-to-case (top) thermal resistance RθJC(top) RθJC(top) 31 °C/W RHA (VQFN) 40 pins 9
Junction-to-board thermal resistance RθJB RθJB 26 °C/W RHA (VQFN) 40 pins 9
Junction-to-top characterization parameter ψJT ψJT 0.1 °C/W RHA (VQFN) 40 pins 9
Gain accuracy -7 7 % I-V transimpedance amplifier gain 11
Feedback resistor tolerance RF -7 7 % 11
Feedback capacitor tolerance CF -20 20 % 11
External differential input capacitance 10 1000 pF Includes equivalent capacitance of photodiode, cables, EMI filter, and so forth 11
Shield output voltage VO(shield) 0.8 0.9 1 V With a 1-kΩ series resistor and a 10-nF decoupling capacitor to ground, when loaded with a small current (for example, of a few µA or less) 11
Current DAC range 0 10 µA Ambient cancellation stage 11
Current DAC step size 1 µA Ambient cancellation stage 11
ADC full-scale voltage -1.2 1.2 V ADC full-scale voltage ±1.2 V 11
Pulse repetition frequency PRF 62.5 5000 SPS 10
Common-mode rejection ratio, LED1 and LED2 CMRR 75 dB fCM = 50 Hz and 60 Hz, LED1 and LED2 with RSERIES = 500 kΩ, RF = 500 kΩ 10
Common-mode rejection ratio, LED1-AMB and LED2-AMB CMRR 95 dB fCM = 50 Hz and 60 Hz, LED1-AMB and LED2-AMB with RSERIES = 500 kΩ, RF = 500 kΩ 10
Power-supply rejection ratio PSRR 100 dB fPS = 50 Hz, 60 Hz at PRF = 200 Hz 10
Power-supply rejection ratio PSRR 106 dB fCM = 50 Hz, 60 Hz at PRF = 600 Hz 10
PSRR, transmit LED driver PSRRLED 75 dB With respect to ripple on LED_DRV_SUP 10
PSRR, transmit control PSRRTx 60 dB With respect to ripple on TX_CTRL_SUP 10
PSRR, receiver PSRRRx 60 dB With respect to ripple on RX_ANA_SUP and RX_DIG_SUP 10
Transmitter noise dynamic range at 25 mA 110 dB 0.1-Hz to 20-Hz bandwidth, at 25-mA output current 11
Transmitter noise dynamic range at 100 mA 110 dB 0.1-Hz to 20-Hz bandwidth, at 100-mA output current 11
Minimum sample time of LED1 and LED2 pulses 50 µs 11
LED current DAC error -5 5 % 11
LED current DAC leakage current 1 µA LED_ON = 0 11
LED current DAC leakage current 50 µA LED_ON = 1 11
LED current DAC linearity 0.5 % Percent of full-scale current 11
Output current settling time 7 µs From zero current to 150 mA (with resistive load) 11
Duration of diagnostics state machine, slow diagnostics off 8 ms EN_SLOW_DIAG = 0; start of diagnostics after the DIAG_EN register bit is set, end indicated by DIAG_END going high 12
Duration of diagnostics state machine, slow diagnostics on 16 ms EN_SLOW_DIAG = 1; start of diagnostics after the DIAG_EN register bit is set, end indicated by DIAG_END going high 12
Open fault resistance 100 kΩ Diagnostics open fault detection threshold 12
Short fault resistance 10 kΩ Diagnostics short fault detection threshold 12
Diagnostics current 100 µA During diagnostics mode 12
Maximum allowable external clock jitter 50 ps 12
External clock input frequency tolerance -10 10 % External clock input frequency 8 MHz 12
External clock input current 1 µA 12
Logic input current IIN 0.1 µA Digital inputs at VIH or VIL 12
Logic low output voltage VOL 0.1 V DIAG_END, LED_ALM, PD_ALM, SPI SOMI, ADC_RDY, CLKOUT 12
Pin leakage current 1 nA To GND and supply 12

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pet counter (running off of the 4-MHz clock) to set the time-base. All timing signals are set with reference to the pulse repetition period (PRP). Therefore, a dedicated compare 33

CAD (KiCad official)

  • Symbol: AFE4490RHAT
  • Footprint: Package_DFN_QFN:QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm
  • 3D model: VQFN-40-EP(6x6) (KiCad packages3D, STEP)
  • 3D model files: afe4490rhat-etched.step / afe4490rhat-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); afe4490rhat.step / afe4490rhat.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (102 pp, sha256 24df2fc56cacfa70, retrieved 2026-11-02, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF