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Ray Publish 0.1.0 f076908 6d ago

AF1206F15.0TM

AEM · Disposable Fuses · 1206

AF1206F15.0TM from AEM, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Fuse terminal 1 (copper termination, nickel and tin plated); non-polarized, rated 15.0 A, 32 VDC, 50A@32VDC interrupting rating, nominal DCR 0.0035 ohm.
2 2 passive Fuse terminal 2 (copper termination, nickel and tin plated); non-polarized and interchangeable with terminal 1, nominal I2t 24.5 A2s.

Key specifications

Parameter Value
Manufacturer AEM
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Clearing time at 100% of current rating, 25°C 4 hour 100% of current rating, 25°C 1
Clearing time at 250% of current rating, 25°C 5 seconds 250% of current rating, 25°C 1
Operating temperature range -55 125 °C With derating 1
Voltage rating 32 VDC As printed for the 5.00 A row onward; applied to 15.0 A part (see review) 2
Interrupting rating 50 A 50A@32VDC 2
Current rating 15 A Marking Y 2
Nominal DCR DCR 0.0035 Ω Measured at ≤10% of rated current and 25°C ambient 2
Nominal I2t I2t 24.5 A2s Calculated at 0.001 second pre-arcing time 2
Life: voltage drop change -20 20 % 25°C, 2000 hours, 80% rated current (75% for <1 A) 6
Reflow & Bend: DCR change 20 % 3 reflows at 245°C followed by 2 mm bend; 10% max for ≤1 A 6
Soldering heat resistance: DCR change 20 % 260°C, 10 seconds; 10% max for ≤1 A 6
Thermal shock: DCR change 10 % -65°C to +125°C, 100 cycles 6
Mechanical vibration: DCR change 10 % 5-3000 Hz, 0.4 inch double amplitude or 30 G peak 6
Mechanical shock: DCR change 10 % 1500 G, 0.5 milliseconds, half-sine shocks 6
Salt spray: DCR change 10 % 5% salt solution, 48 hour exposure 6
Moisture resistance: DCR change 15 % 10 cycles 6
Solderability: new solder coverage 90 % 245°C, 5 seconds 6
Storage ambient temperature 35 °C Packaging storage; higher storage temperatures could deform packaging 5
Storage relative humidity 75 % Recommended maximum for storage 5
Preheat/soak temperature Tsmin to Tsmax 150 200 °C Pb-free assembly 7
Preheat/soak time ts 60 120 seconds Tsmin to Tsmax 7
Ramp-up rate (TL to Tp) 3 °C/second Maximum 7
Ramp-down rate (Tp to TL) 6 °C/second Maximum 7
Time 25°C to peak temperature 8 minutes Maximum 7
Liquidous temperature TL 217 °C Reflow profile 7
Time maintained above TL tL 60 150 seconds Above TL 7
Peak package body temperature Tp 260 °C Pb-free reflow profile 7
Time within 5°C of classification temperature tp 30 seconds Within 5°C of Tc; supplier minimum / user maximum tolerance on Tp 7

CAD (KiCad official)

  • Symbol: AF1206F15.0TM
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: af1206f15-0tm-etched.step / af1206f15-0tm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); af1206f15-0tm.step / af1206f15-0tm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AEM datasheet (8 pp, sha256 d0607b60fdbd0072, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF