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ADUM3195WBRQZ

Analog Devices · Isolation Amplifiers · QSOP-16

ADUM3195WBRQZ from Analog Devices, in a QSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VDD1	power_in	Side 1 supply voltage, 4.5 V to 5.5 V, to be decoupled with a 0.1 µF and a 1 µF capacitor to GND1.
2	GND1	power_in	Ground reference for side 1.
3	NIC	unconnected	Not internally connected; may be tied to VDD1, GND1, or left floating.
4	VREF1	power_out	Side 1 reference output of 2.5 V; the maximum capacitance on this pin (CREFOUT1) must not exceed 15 pF.
5	NIC	unconnected	Not internally connected; may be tied to VDD1, GND1, or left floating.
6	VOUT1	output	Isolated output voltage that follows the VIN+ input with a typical gain of 1 when the op amp is in buffer configuration.
7	NC	unconnected	No connect; must be connected to GND1 and must not be left floating.
8	GND1	power_in	Ground reference for side 1.
9	GND2	power_in	Ground reference for side 2 (pins 9 to 16 are shorted together as the 2-terminal device).
10	VOUT2	output	Output of the input op amp, used to configure gain or feedback on the input side.
11	VIN−	power_in	Inverting input of the side 2 op amp.
12	VIN+	power_in	Noninverting input of the side 2 op amp; high-impedance input with a common-mode range of 0.25 V to VDD2 − 0.7 V.
13	VREF2	power_out	Side 2 reference output of 2.5 V; the maximum capacitance on this pin (CREFOUT) must not exceed 22 nF.
14	NC	unconnected	No connect; must be connected to GND2 and must not be left floating.
15	GND2	power_in	Ground reference for side 2.
16	VDD2	power_in	Side 2 supply voltage, 4.5 V to 5.5 V, to be decoupled with a 0.1 µF and a 1 µF capacitor to GND2.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	QSOP-16
Category	Signal Isolation Devices
Pins	16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Input Offset Voltage	VOS	-0.5		1.5	mV		3
Input Offset Drift		-11		11	µV/°C		3
Input-Bias Current		-0.2		0.2	nA	TA = 25°C, VIN+ or VIN− = 2.5 V	3
Input-Bias Current Drift		-25		75	pA/°C		3
Output Voltage VREF1, VREF2	VREF1, VREF2	2.49	2.5	2.51	V	0 mA to 1 mA load, TA = 25°C	3
Output Voltage VREF1, VREF2	VREF1, VREF2	2.47	2.5	2.53	V	0 mA to 1 mA load, TA = TMIN to TMAX	3
Reference Temperature Coefficient (Tempco)		-25		25	ppm/°C		3
Output Offset Voltage		-6		6	mV	VOUT1 − VIN+ (op amp in buffer configuration), VIN+ = 2.5 V, TA = 25°C	3
Output Offset Drift			-22		µV/°C	VIN+ = 2.5 V, TA = −40 to 125°C	3
Output Gain Error		-0.5		0.5	%		3
Output Gain Error Drift		-27		27	ppm/°C		3
Common-Mode Transient Immunity (CMTI)	CMTI	100	150		kV/µs	/GND1, GND2/ = 1.5 kV	3
Operating Range, Side 1	VDD1	4.5	5	5.5	V		3
Operating Range, Side 2	VDD2	4.5	5	5.5	V		4
Supply Current, Side 1	IDD1		4.1	4.9	mA		4
Supply Current, Side 2	IDD2		5.9	7.3	mA		4
Operating Temperature	TA	-40		125	°C		5
Supply Voltages	VDD1, VDD2	4.5		5.5	V	Voltages relative to their respective grounds	5
Storage Temperature Range	TST	-65		150	°C		7
Ambient Operating Temperature Range	TA	-40		125	°C		7
Junction Temperature	TJ	-40		150	°C		7
Supply Voltages	VDD1, VDD2	-0.5		7	V	All voltages relative to their respective grounds	7
Output Current per Output Pin		-11		11	mA		7
Common-Mode Transients		-200		200	kV/µs	Refers to common-mode transients across the insulation barrier	7
IC Junction-to-Ambient Thermal Resistance, 16-Lead QSOP	θJA		83		°C/W	Thermocouple located at center of package underside	4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
housing	pC		In accordance with DIN VDE V 0884-11:2017-01, each ADuM3195 is proof tested by applying an insulation test voltage ≥ 1192 V peak for 1 sec (partial discharge detection limit = 5 pC). The * marking bra	5

CAD (KiCad official)

Symbol: ADUM3195WBRQZ
Footprint: Package_SO:QSOP-16_3.9x4.9mm_P0.635mm
3D model: QSOP-16 (KiCad packages3D, STEP)
3D model files: adum3195wbrqz-etched.step / adum3195wbrqz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adum3195wbrqz.step / adum3195wbrqz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (19 pp, sha256 6612457a2cb52c64, retrieved 2026-10-29, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF