component
ADS802U
Public Made by Adomby adom
Texas Instruments Analog To Digital Converters (ADC), SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads on click. Unloads only if this page sits in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads on click. Unloads only if this page sits in the background.
PCB Footprint
Open full view ↗Loads on click. Unloads only if this page sits in the background.
Datasheet
Open in new tab ↗Loads on click. Unloads only if this page sits in the background.
README
markdownADS802U
Texas Instruments · Analog To Digital Converters (ADC) · SOIC-28-300mil
ADS802U from Texas Instruments, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin; the analog and digital ground pins should be connected directly to the analog ground plane. |
| 2 | B1 | tri_state | Bit 1, the most significant bit (MSB) of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 3 | B2 | tri_state | Bit 2 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 4 | B3 | tri_state | Bit 3 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 5 | B4 | tri_state | Bit 4 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 6 | B5 | tri_state | Bit 5 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 7 | B6 | tri_state | Bit 6 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 8 | B7 | tri_state | Bit 7 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 9 | B8 | tri_state | Bit 8 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 10 | B9 | tri_state | Bit 9 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 11 | B10 | tri_state | Bit 10 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 12 | B11 | tri_state | Bit 11 of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 13 | B12 | tri_state | Bit 12, the least significant bit (LSB) of the 12-bit output data, CMOS logic output with logic LOW 0 to 0.4 V and logic HIGH 2.0 V to +VS, placed in high impedance when OE is HIGH. |
| 14 | GND | power_in | Ground pin; the analog and digital ground pins should be connected directly to the analog ground plane. |
| 15 | +VS | power_in | +5V power supply; operating range +4.75 V to +5.25 V (typical +5.0 V), with power supplies bypassed by 0.1 µF ceramic capacitors as close to the pin as possible. |
| 16 | CLK | input | Convert clock input accepting a CMOS-level clock; duty cycle should be held at 50% with rise and fall times of 2 ns or less. |
| 17 | +VS | power_in | +5V power supply; operating range +4.75 V to +5.25 V (typical +5.0 V), with power supplies bypassed by 0.1 µF ceramic capacitors as close to the pin as possible. |
| 18 | OE | input | Output enable: HIGH puts the digital outputs into a high-impedance state (intended for testability, not for driving buses directly); LOW or floating gives normal operation through an internal pull-down resistor. |
| 19 | MSBI | input | Most significant bit inversion: HIGH inverts the MSB for Binary Two's Complement output; LOW or floating gives Straight Offset Binary output through an internal pull-down resistor. |
| 20 | +VS | power_in | +5V power supply; operating range +4.75 V to +5.25 V (typical +5.0 V), with power supplies bypassed by 0.1 µF ceramic capacitors as close to the pin as possible. |
| 21 | REFB | passive | Bottom reference bypass for the internal +1.25 V reference; an externally applied bottom reference must be no less than +1.1 V. |
| 22 | CM | passive | Common-mode voltage, derived as (REFT + REFB)/2 (+2.25 V nominal); keep the current drawn from this pin below 0.5 µA to avoid nonlinearity in the internal reference ladder. |
| 23 | REFT | passive | Top reference bypass for the internal +3.25 V reference; an externally applied top reference must be no more than +3.4 V. |
| 24 | +VS | power_in | +5V power supply; operating range +4.75 V to +5.25 V (typical +5.0 V), with power supplies bypassed by 0.1 µF ceramic capacitors as close to the pin as possible. |
| 25 | GND | power_in | Ground pin; the analog and digital ground pins should be connected directly to the analog ground plane. |
| 26 | IN | input | Non-inverted analog input; each differential input spans +1.25 V to +3.25 V, centered on the +2.25 V common-mode voltage, and should be bypassed with 22 pF capacitors to minimize track-and-hold glitches. |
| 27 | IN | input | Complementary analog input (180° out of phase with IN); each differential input spans +1.25 V to +3.25 V, centered on the +2.25 V common-mode voltage, and should be bypassed with 22 pF capacitors to minimize track-and-hold glitches. |
| 28 | GND | power_in | Ground pin; the analog and digital ground pins should be connected directly to the analog ground plane. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-28-300mil |
| Category | Data Acquisition |
| Pins | 28 |
CAD (KiCad official)
- Symbol:
ADS802U - Footprint:
Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm - 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
- 3D model files:
ads802u-etched.step/ads802u-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ads802u.step/ads802u.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (19 pp, sha256
cf2e9fff9145f16b, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).