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ADS125H02IRHBT

Texas Instruments · Analog To Digital Converters (ADCs) · VQFN-32-EP(5x5)

ADS125H02IRHBT from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 REFP0 input Reference input 0 positive.
2 CAPP output PGA output P; connect a 1-nF C0G dielectric capacitor from CAPP to CAPN.
3 CAPN output PGA output N; connect a 1-nF C0G dielectric capacitor from CAPP to CAPN.
4 AVDD power_in Low-voltage analog power supply (5 V); recommended range is 4.75 V to 5.25 V.
5 AGND power_in Analog ground; connect to the ADC ground plane.
6 REFOUT output 2.5-V reference output; connect a 10-µF capacitor to AGND.
7 RESET input Reset; active low.
8 START input Conversion start, active high.
9 CS2 input Serial interface chip select 2 to select the PGA for communication.
10 CS1 input Serial interface chip select 1 to select the ADC for communication.
11 SCLK input Serial interface shift clock.
12 DIN input Serial interface data input.
13 DRDY output Data-ready indicator; active low.
14 DOUT/DRDY output Serial interface data output and data-ready indicator (active low).
15 BYPASS output 2-V subregulator output; connect a 1-µF capacitor to DGND.
16 DGND power_in Digital ground; connect to the ADC ground plane.
17 DVDD power_in Digital power supply (3 V to 5 V as printed in the pin table; Recommended Operating Conditions list 2.7 V to 5.25 V).
18 CLKIN input External clock input; connect to DGND for internal oscillator operation.
19 HV_AVSS power_in High-voltage negative analog power supply.
20 HV_AVDD power_in High-voltage positive analog power supply.
21 NC unconnected No connection; electrically float or tie to AGND.
22 NC unconnected No connection; electrically float or tie to AGND.
23 IDAC2 output Current source 2 output.
24 IDAC1 output Current source 1 output.
25 AINCOM input Analog input common (single-ended common input).
26 AIN0 input Analog input 0.
27 AIN1 input Analog input 1.
28 GPIO3 bidirectional General-purpose input/output 3.
29 GPIO2 bidirectional General-purpose input/output 2.
30 REFN1/GPIO1 bidirectional Reference input 1 negative and general-purpose input/output 1.
31 REFP1/GPIO0 bidirectional Reference input 1 positive and general-purpose input/output 0.
32 REFN0 input Reference input 0 negative.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category ADC/DAC/Data Conversion
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Absolute maximum: HV_AVDD to HV_AVSS -0.3 38 V 5
Absolute maximum: HV_AVSS to AGND -19 0.3 V 5
Absolute maximum: AVDD to AGND -0.3 6 V 5
Absolute maximum: DVDD to DGND -0.3 6 V 5
Absolute maximum: AGND to DGND -0.1 0.1 V 5
Absolute maximum: continuous input current -10 10 mA Continuous 5
Absolute maximum: junction temperature TJ 150 °C 5
Absolute maximum: storage temperature Tstg -60 150 °C 5
HV_AVDD to HV_AVSS supply 10 36 V 6
HV_AVSS to AGND supply -18 0 V 6
HV_AVDD to AGND supply 5 36 V 6
Low-voltage analog power supply AVDD to AGND 4.75 5 5.25 V 6
Digital power supply DVDD to DGND 2.7 5.25 V 6
Differential input voltage range VIN -20 20 V VIN = VAINP, VAINN 6
Reference voltage input VREF 0.9 V VREF = V(REFPx), V(REFNx) 6
External clock frequency, data rate < 40000 SPS f(CLK) 1 7.3728 8 MHz Data rate < 40000 SPS 6
External clock frequency, data rate = 40000 SPS f(CLK) 1 10.24 10.75 MHz Data rate = 40000 SPS 6
External clock duty cycle 40 60 % 6
Operating ambient temperature TA -45 125 °C 6
Absolute input current -15 0.5 15 nA V(AINx) = 0 V, TA ≤ 105°C 7
Differential input current -0.1 0.1 nA VIN = 2.5 V 7
Differential input current, auto-zero mode -2 2 nA/V VIN = 2.5 V, auto-zero mode 7
Differential input impedance 1 20 GΩ 7
Data rate 2.5 40000 SPS 7
Integral nonlinearity, gain 0.125 to 32 INL 2 10 ppmFSR Gain = 0.125 to 32 7
Integral nonlinearity, gain 64 and 128 INL 4 12 ppmFSR Gain = 64, 128 7
Offset voltage drift, gain 16 to 128 10 50 nV/°C Gain = 16 to 128 7
Gain error GE -0.7 0.1 0.7 % TA = 25°C, all gains 7
Gain drift 1 4 ppm/°C All gains 7
Absolute input current, voltage reference inputs -250 250 nA 7
Initial error of internal voltage reference -0.2 0.1 0.2 % TA = 25°C 8
Temperature drift of internal voltage reference 3 10 ppm/°C TA = 0°C to 85°C 8
Temperature drift of internal voltage reference 7 20 ppm/°C TA = -40°C to 125°C 8
IDAC output current -10 10 mA 8
IDAC absolute error -6 0.7 6 % All currents 8
IDAC relative error -1.5 0.1 1.5 % Equal values 8
IDAC relative error -1 1 % Unequal values 8
IDAC temperature drift, equal values 5 25 ppm/°C Equal values, I ≤ 750 µA 8
Reference monitor low voltage threshold 0.4 0.6 V 8
Internal oscillator accuracy, data rate < 40000 SPS -2.5 0.5 2.5 % Data rate < 40000 SPS 8
Internal oscillator accuracy, data rate = 40000 SPS -3.5 0.5 3.5 % Data rate = 40000 SPS 8
Digital input leakage -10 10 µA 9
HV_AVDD, HV_AVSS supply current IHV_AVDD, IHV_AVSS 1.1 1.8 mA 9
AVDD supply current IAVDD 2.8 4.6 mA 9
DVDD supply current, internal oscillator active IDVDD 0.5 0.7 mA Internal oscillator active 9
DVDD supply current, data rate = 40000 SPS IDVDD 0.7 1 mA Data rate = 40000 SPS 9
Power dissipation PD 49 79 mW 9
Delay time, first SCLK rising edge after CS falling edge td(CSSC) 50 ns 9
Setup time, DIN valid before SCLK falling edge tsu(DI) 25 ns 9
Hold time, DIN valid after SCLK falling edge th(DI) 25 ns 9
SCLK period tc(SC) 97 ns 9
Pulse duration, SCLK high or low tw(SCH), tw(SCL) 40 ns 9
Pulse duration, RESET low tw(RSTL) 4 1/fCLK 9
Pulse duration, START high tw(STH) 4 1/fCLK 9
Pulse duration, START low tw(STL) 4 1/fCLK 9
Setup time, START low or STOP before DRDY falling edge tsu(STDR) 100 1/fCLK Continuous mode 9
Hold time, START low or STOP after DRDY falling edge th(DRSP) 150 1/fCLK Continuous mode 9
Junction-to-ambient thermal resistance RθJA 35.2 °C/W 6
Junction-to-case (top) thermal resistance RθJC(top) 19 °C/W 6
Junction-to-board thermal resistance RθJB 15.8 °C/W 6
Junction-to-case (bottom) thermal resistance RθJC(bot) 8 °C/W 6

CAD (KiCad official)

  • Symbol: ADS125H02IRHBT
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: ads125h02irhbt-etched.step / ads125h02irhbt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ads125h02irhbt.step / ads125h02irhbt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (88 pp, sha256 a7b83e6da70041ca, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF