component
ADS1191IRSMR
Public Made by Adomby adom
Texas Instruments Analog Front End (AFEs), VQFN-32-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ADS1191IRSMR
Texas Instruments · Analog Front End (AFEs) · VQFN-32-EP(4x4)
ADS1191IRSMR from Texas Instruments, in a VQFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGA1N | output | Differential analog negative output of PGA channel 1. |
| 2 | PGA1P | output | Differential analog positive output of PGA channel 1. |
| 3 | IN1N | input | Differential analog negative input 1; excludes effects of noise, linearity, offset, and gain error. |
| 4 | IN1P | input | Differential analog positive input 1; excludes effects of noise, linearity, offset, and gain error. |
| 5 | IN2N | input | Differential analog negative input 2; excludes effects of noise, linearity, offset, and gain error. |
| 6 | IN2P | input | Differential analog positive input 2; excludes effects of noise, linearity, offset, and gain error. |
| 7 | PGA2N | output | Differential analog negative output of PGA channel 2. |
| 8 | PGA2P | output | Differential analog positive output of PGA channel 2. |
| 9 | VREFP | bidirectional | Positive reference voltage; analog input/output pin. |
| 10 | VREFN | input | Negative reference voltage. |
| 11 | VCAP1 | passive | Analog bypass capacitor connection. |
| 12 | AVDD | power_in | Analog supply; AVDD to AVSS is specified from -0.3 V to +7 V absolute maximum. |
| 13 | AVSS | power_in | Analog ground. |
| 14 | CLKSEL | input | Digital input that selects the master clock source. |
| 15 | PWDN/RESET | input | Power-down and system reset input; active low. |
| 16 | START | input | Digital input to start conversions. |
| 17 | CLK | input | Master clock input. |
| 18 | CS | input | SPI chip select digital input. |
| 19 | DIN | input | SPI serial data input. |
| 20 | SCLK | input | SPI serial clock digital input. |
| 21 | DOUT | output | SPI serial data output. |
| 22 | DRDY | output | Data ready digital output; active low. |
| 23 | DVDD | power_in | Digital power supply; DVDD to DGND is specified from -0.3 V to +7 V absolute maximum. |
| 24 | DGND | power_in | Digital ground. |
| 25 | GPIO2/RCLK2 | bidirectional | General-purpose digital input/output GPIO2. |
| 26 | GPIO1/RCLK1 | bidirectional | General-purpose digital input/output GPIO1. |
| 27 | VCAP2 | passive | Analog bypass capacitor connection. |
| 28 | RLDINV | input | Right leg drive inverting input. |
| 29 | RLDIN/RLDREF | input | Right leg drive input to the MUX and RLD reference. |
| 30 | RLDOUT | input | Right leg drive output pin, listed as an analog input in the datasheet table. |
| 31 | IN3P | bidirectional | Differential analog positive input 3; analog input/output pin. |
| 32 | IN3N | bidirectional | Differential analog negative input 3; analog input/output pin. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32-EP(4x4) |
| Category | ADC/DAC/Data Conversion |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| AVDD to AVSS | -0.3 | 7 | V | Over operating free-air temperature range | 2 | ||
| DVDD to DGND | -0.3 | 7 | V | Over operating free-air temperature range | 2 | ||
| AVSS to DGND | -3 | 0.2 | V | Over operating free-air temperature range | 2 | ||
| Input current to any pin except supply pins | -10 | 10 | mA | 2 | |||
| Input current momentary | -100 | 100 | mA | Momentary | 2 | ||
| Input current continuous | -10 | 10 | mA | Continuous | 2 | ||
| Operating temperature range | -40 | 85 | °C | Industrial-grade devices only | 2 | ||
| Storage temperature range | -60 | 150 | °C | 2 | |||
| Maximum junction temperature | TJ | 150 | °C | 2 | |||
| Electrostatic discharge HBM | -1000 | 1000 | V | JEDEC standard 22, test method A114-C.01, all pins | 2 | ||
| Electrostatic discharge CDM | -500 | 500 | V | JEDEC standard 22, test method C101, all pins | 2 | ||
| Input bias current | -1 | 1 | nA | Input = 1.5 V | 3 | ||
| Input bias current | -2 | 2 | nA | Input = 1.5 V, TA = -40°C to +85°C | 3 | ||
| Data rate | DR | 125 | 8000 | SPS | 3 | ||
| Input-referred noise | 24.6 | 25 | μVPP | Gain = 6, 256 points, 0.5 seconds of data | 3 | ||
| Integral nonlinearity | INL | -1 | 1 | LSB | Full-scale with gain = 6, best fit | 3 | |
| Input-referred offset error | -100 | 100 | μV | 3 | |||
| Gain error | -0.5 | 0.5 | % of FS | Excluding voltage reference error | 3 | ||
| Reference input voltage, AVDD = 3 V | VREF | 2 | 2.5 | V | AVDD = 3 V, VREF = (VREFP, VREFN) | 4 | |
| Reference input voltage, AVDD = 5 V | VREF | 2 | 4 | V | AVDD = 5 V, VREF = (VREFP, VREFN) | 4 | |
| Current accuracy (lead-off) | -20 | 20 | % | 4 | |||
| Comparator threshold accuracy | -30 | 30 | mV | 4 | |||
| VREF accuracy | -0.5 | 0.5 | % | 4 | |||
| Test signal voltage | -1 | 1 | mV | See Register Map section for settings | 5 | ||
| Test signal accuracy | -2 | 2 | % | 5 | |||
| Internal oscillator clock frequency accuracy | -0.5 | 0.5 | % | TA = +25°C | 5 | ||
| Internal oscillator clock frequency accuracy | -1.5 | 1.5 | % | -40°C ≤ TA ≤ +85°C | 5 | ||
| External clock input frequency | fCLK | 485 | 512 | 562.5 | kHz | CLKSEL pin = 0, CLK_DIV = 0 | 5 |
| External clock input frequency | fCLK | 1.94 | 2.048 | 2.25 | MHz | CLKSEL pin = 0, CLK_DIV = 1 | 5 |
| Input current | IIN | -10 | 10 | μA | 0 V < VDigitalInput < DVDD | 5 | |
| Analog supply | AVDD | 2.7 | 3 | 5.25 | V | AVDD, AVSS | 5 |
| Digital supply | DVDD | 1.7 | 1.8 | 3.6 | V | 5 | |
| AVDD, DVDD | -2.1 | 3.6 | V | 5 | |||
| Quiescent power dissipation, normal mode | 450 | 495 | μW | Analog Supply = 3 V, RLD Turned Off | 6 | ||
| Specified temperature range | -40 | 85 | °C | 6 | |||
| Junction-to-ambient thermal resistance θJA | θJA | 33.7 | °C/W | RSM (QFN) 32-pin package | 6 | ||
| Junction-to-case (top) thermal resistance | θJCtop | 36.4 | °C/W | RSM (QFN) 32-pin package | 6 | ||
| Junction-to-board thermal resistance | θJB | 25.2 | °C/W | RSM (QFN) 32-pin package | 6 | ||
| Junction-to-top characterization parameter | ψJT | 0.2 | °C/W | RSM (QFN) 32-pin package | 6 | ||
| Junction-to-board characterization parameter | ψJB | 7.4 | °C/W | RSM (QFN) 32-pin package | 6 | ||
| Junction-to-case (bottom) thermal resistance | θJCbot | 2.2 | °C/W | RSM (QFN) 32-pin package | 6 |
CAD (KiCad official)
- Symbol:
ADS1191IRSMR - Footprint:
Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm - 3D model: VQFN-32-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
ads1191irsmr-etched.step/ads1191irsmr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ads1191irsmr.step/ads1191irsmr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (70 pp, sha256
358207ed2a44fab8, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ADS1191IRSMR
**Texas Instruments** · Analog Front End (AFEs) · VQFN-32-EP(4x4)
ADS1191IRSMR from Texas Instruments, in a VQFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGA1N | output | Differential analog negative output of PGA channel 1. |
| 2 | PGA1P | output | Differential analog positive output of PGA channel 1. |
| 3 | IN1N | input | Differential analog negative input 1; excludes effects of noise, linearity, offset, and gain error. |
| 4 | IN1P | input | Differential analog positive input 1; excludes effects of noise, linearity, offset, and gain error. |
| 5 | IN2N | input | Differential analog negative input 2; excludes effects of noise, linearity, offset, and gain error. |
| 6 | IN2P | input | Differential analog positive input 2; excludes effects of noise, linearity, offset, and gain error. |
| 7 | PGA2N | output | Differential analog negative output of PGA channel 2. |
| 8 | PGA2P | output | Differential analog positive output of PGA channel 2. |
| 9 | VREFP | bidirectional | Positive reference voltage; analog input/output pin. |
| 10 | VREFN | input | Negative reference voltage. |
| 11 | VCAP1 | passive | Analog bypass capacitor connection. |
| 12 | AVDD | power_in | Analog supply; AVDD to AVSS is specified from -0.3 V to +7 V absolute maximum. |
| 13 | AVSS | power_in | Analog ground. |
| 14 | CLKSEL | input | Digital input that selects the master clock source. |
| 15 | PWDN/RESET | input | Power-down and system reset input; active low. |
| 16 | START | input | Digital input to start conversions. |
| 17 | CLK | input | Master clock input. |
| 18 | CS | input | SPI chip select digital input. |
| 19 | DIN | input | SPI serial data input. |
| 20 | SCLK | input | SPI serial clock digital input. |
| 21 | DOUT | output | SPI serial data output. |
| 22 | DRDY | output | Data ready digital output; active low. |
| 23 | DVDD | power_in | Digital power supply; DVDD to DGND is specified from -0.3 V to +7 V absolute maximum. |
| 24 | DGND | power_in | Digital ground. |
| 25 | GPIO2/RCLK2 | bidirectional | General-purpose digital input/output GPIO2. |
| 26 | GPIO1/RCLK1 | bidirectional | General-purpose digital input/output GPIO1. |
| 27 | VCAP2 | passive | Analog bypass capacitor connection. |
| 28 | RLDINV | input | Right leg drive inverting input. |
| 29 | RLDIN/RLDREF | input | Right leg drive input to the MUX and RLD reference. |
| 30 | RLDOUT | input | Right leg drive output pin, listed as an analog input in the datasheet table. |
| 31 | IN3P | bidirectional | Differential analog positive input 3; analog input/output pin. |
| 32 | IN3N | bidirectional | Differential analog negative input 3; analog input/output pin. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32-EP(4x4) |
| Category | ADC/DAC/Data Conversion |
| Pins | 33 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| AVDD to AVSS | | -0.3 | | 7 | V | Over operating free-air temperature range | 2 |
| DVDD to DGND | | -0.3 | | 7 | V | Over operating free-air temperature range | 2 |
| AVSS to DGND | | -3 | | 0.2 | V | Over operating free-air temperature range | 2 |
| Input current to any pin except supply pins | | -10 | | 10 | mA | | 2 |
| Input current momentary | | -100 | | 100 | mA | Momentary | 2 |
| Input current continuous | | -10 | | 10 | mA | Continuous | 2 |
| Operating temperature range | | -40 | | 85 | °C | Industrial-grade devices only | 2 |
| Storage temperature range | | -60 | | 150 | °C | | 2 |
| Maximum junction temperature | TJ | | | 150 | °C | | 2 |
| Electrostatic discharge HBM | | -1000 | | 1000 | V | JEDEC standard 22, test method A114-C.01, all pins | 2 |
| Electrostatic discharge CDM | | -500 | | 500 | V | JEDEC standard 22, test method C101, all pins | 2 |
| Input bias current | | -1 | | 1 | nA | Input = 1.5 V | 3 |
| Input bias current | | -2 | | 2 | nA | Input = 1.5 V, TA = -40°C to +85°C | 3 |
| Data rate | DR | 125 | | 8000 | SPS | | 3 |
| Input-referred noise | | | 24.6 | 25 | μVPP | Gain = 6, 256 points, 0.5 seconds of data | 3 |
| Integral nonlinearity | INL | -1 | | 1 | LSB | Full-scale with gain = 6, best fit | 3 |
| Input-referred offset error | | -100 | | 100 | μV | | 3 |
| Gain error | | -0.5 | | 0.5 | % of FS | Excluding voltage reference error | 3 |
| Reference input voltage, AVDD = 3 V | VREF | 2 | 2.5 | | V | AVDD = 3 V, VREF = (VREFP, VREFN) | 4 |
| Reference input voltage, AVDD = 5 V | VREF | 2 | 4 | | V | AVDD = 5 V, VREF = (VREFP, VREFN) | 4 |
| Current accuracy (lead-off) | | -20 | | 20 | % | | 4 |
| Comparator threshold accuracy | | -30 | | 30 | mV | | 4 |
| VREF accuracy | | -0.5 | | 0.5 | % | | 4 |
| Test signal voltage | | -1 | | 1 | mV | See Register Map section for settings | 5 |
| Test signal accuracy | | -2 | | 2 | % | | 5 |
| Internal oscillator clock frequency accuracy | | -0.5 | | 0.5 | % | TA = +25°C | 5 |
| Internal oscillator clock frequency accuracy | | -1.5 | | 1.5 | % | -40°C ≤ TA ≤ +85°C | 5 |
| External clock input frequency | fCLK | 485 | 512 | 562.5 | kHz | CLKSEL pin = 0, CLK_DIV = 0 | 5 |
| External clock input frequency | fCLK | 1.94 | 2.048 | 2.25 | MHz | CLKSEL pin = 0, CLK_DIV = 1 | 5 |
| Input current | IIN | -10 | | 10 | μA | 0 V < VDigitalInput < DVDD | 5 |
| Analog supply | AVDD | 2.7 | 3 | 5.25 | V | AVDD, AVSS | 5 |
| Digital supply | DVDD | 1.7 | 1.8 | 3.6 | V | | 5 |
| AVDD, DVDD | | -2.1 | | 3.6 | V | | 5 |
| Quiescent power dissipation, normal mode | | | 450 | 495 | μW | Analog Supply = 3 V, RLD Turned Off | 6 |
| Specified temperature range | | -40 | | 85 | °C | | 6 |
| Junction-to-ambient thermal resistance θJA | θJA | | 33.7 | | °C/W | RSM (QFN) 32-pin package | 6 |
| Junction-to-case (top) thermal resistance | θJCtop | | 36.4 | | °C/W | RSM (QFN) 32-pin package | 6 |
| Junction-to-board thermal resistance | θJB | | 25.2 | | °C/W | RSM (QFN) 32-pin package | 6 |
| Junction-to-top characterization parameter | ψJT | | 0.2 | | °C/W | RSM (QFN) 32-pin package | 6 |
| Junction-to-board characterization parameter | ψJB | | 7.4 | | °C/W | RSM (QFN) 32-pin package | 6 |
| Junction-to-case (bottom) thermal resistance | θJCbot | | 2.2 | | °C/W | RSM (QFN) 32-pin package | 6 |
## CAD (KiCad official)
- Symbol: `ADS1191IRSMR`
- Footprint: `Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm`
- 3D model: VQFN-32-EP(4x4) (KiCad packages3D, STEP)
- 3D model files: `ads1191irsmr-etched.step` / `ads1191irsmr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ads1191irsmr.step` / `ads1191irsmr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/ads1191.pdf) (70 pp, sha256 `358207ed2a44fab8`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ads1191irsmr-datasheet.pdf)