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ADP5074ACPZ-R7

Analog Devices · DC-DC Converters · LFCSP-16(3x3)

ADP5074ACPZ-R7 from Analog Devices, in a LFCSP-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Switching node for the inverting regulator, driven by the integrated main switch.
2 SLEW input Driver stage slew rate control: leave open for the fastest slew rate (best efficiency), connect to VREG for a normal slew rate, or connect to GND for the slowest slew rate (best noise performance).
3 PWRGD output Open-drain power-good output that must be pulled up to VREG with a resistor, providing a high output when power is good.
4 SYNC/FREQ input Frequency setting and synchronization input: pull high for 2.4 MHz switching, pull low for 1.2 MHz switching, or connect an external clock to synchronize the switching frequency.
5 SS passive Soft start programming: leave open for the fastest soft start time, or connect a resistor between this pin and GND for a slower soft start time.
6 EN input Inverting regulator precision enable; the EN pin is compared to an internal precision reference to enable the inverting regulator output.
7 COMP passive Error amplifier compensation for the inverting regulator; the compensation network connects between this pin and GND.
8 FB input Feedback input for the inverting regulator; a resistor divider between the negative side of the output capacitor and VREF programs the output voltage.
9 VREF power_in Inverting regulator reference output; connect a 1.0 µF ceramic filter capacitor between VREF and GND.
10 GND power_in Ground reference for the device.
11 VREG power_out Internal regulator output; connect a 1.0 µF ceramic filter capacitor between VREG and GND.
12 PVIN power_in Power input for the inverting regulator.
13 AVIN power_in System power supply input for the ADP5074.
14 NIC unconnected No internal connection; for improved thermal performance, connect to the PCB ground plane.
15 NIC unconnected No internal connection; for improved thermal performance, connect to the PCB ground plane.
16 NIC unconnected No internal connection; for improved thermal performance, connect to the PCB ground plane.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-16(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input supply voltage range VIN 2.85 15 V PVIN, AVIN 3
Operating quiescent current, PVIN, AVIN (total) IQ 1.8 4 mA No switching, EN = high, PVIN = AVIN = 5 V 3
Shutdown current ISHDN 5 10 µA No switching, EN = low, PVIN = AVIN = 5 V, −40°C ≤ TJ ≤ +85°C 3
System UVLO threshold, AVIN rising VUVLO_RISING 2.8 2.85 V 3
System UVLO threshold, AVIN falling VUVLO_FALLING 2.5 2.55 V 3
Switching frequency fSW 1.13 1.2 1.27 MHz SYNC/FREQ = low 3
Switching frequency fSW 2.24 2.4 2.56 MHz SYNC/FREQ = high (connect to VREG) 3
Input clock range fSYNC 1 2.6 MHz 3
Input clock minimum on pulse width tSYNC_MIN_ON 100 ns 3
Input clock minimum off pulse width tSYNC_MIN_OFF 100 ns 3
Input clock high logic VH (SYNC) 1.3 V 3
Input clock low logic VL (SYNC) 0.4 V 3
Precision enable high level threshold VTH_H 1.125 1.15 1.175 V 3
Precision enable low level threshold VTH_L 1.025 1.05 1.075 V 3
Shutdown mode threshold VTH_S 0.4 V Internal circuitry disabled to achieve ISHDN 3
Reference voltage accuracy -0.5 0.5 % TJ = 25°C 3
Reference voltage accuracy -1.5 1.5 % TJ = −40°C to +125°C 3
Feedback voltage accuracy -0.5 0.5 % TJ = 25°C 3
Feedback voltage accuracy -1.5 1.5 % TJ = −40°C to +125°C 3
Power-good FET maximum drain source voltage VDS_PG(MAX) 5.5 V 3
Error amplifier transconductance gM 270 300 330 µA/V 4
Power FET maximum drain source voltage VDS (MAX) 39 V 4
Current-limit threshold ILIM 2.4 2.75 3.2 A 4
Absolute max, PVIN and AVIN voltage PVIN, AVIN -0.3 18 V 5
Absolute max, SW voltage SW -40 0.3 V Relative to PVIN (PVIN − 40 V to PVIN + 0.3 V) 5
Absolute max, GND voltage GND -0.3 0.3 V 5
Absolute max, VREG voltage VREG -0.3 6 V Lower of AVIN + 0.3 V or +6 V 5
Absolute max, EN, FB, SYNC/FREQ, PWRGD voltage -0.3 6 V EN, FB, SYNC/FREQ, PWRGD 5
Absolute max, COMP, SLEW, SS, VREF voltage -0.3 V Maximum is VREG + 0.3 V 5
Operating junction temperature range TJ -40 125 °C 5
Storage temperature range TSTG -65 150 °C 5
Internal regulator output voltage VREG 4.25 V 3
Reference voltage VREF 1.6 V 3
Feedback voltage VREF − VFB 0.8 V 3
Feedback bias current IFB 0.1 µA 3
Overvoltage protection threshold VOV 0.74 V At the FB pin after soft start is complete 3
Power-good threshold (good) VPG (GOOD) 0.7 V VREF − VFB ≥ VPG (GOOD) 3
Power-good threshold (bad) VPG (BAD) 0.68 V VREF − VFB ≤ VPG (BAD) 3
Power-good FET on resistance RDS_PG (ON) 28 Ω 3
Power-good supply voltage VPG(SUPPLY) 1.4 V Voltage required on PVIN pin for power-good FET to pull down 3
Load regulation ∆(VREF − VFB)/∆ILOAD 0.0006 %/A ILOAD = 20 mA to 1500 mA (regulator not in skip mode) 3
Line regulation ∆(VREF − VFB)/∆VVIN 0.02 %/V VVIN = 2.85 V to 14.5 V, ILOAD = 15 mA (regulator not in skip mode) 3
Power FET on resistance RDS (ON) 200 mΩ VIN = 5 V 4
Minimum on time 55 ns 4
Minimum off time 50 ns 4
Soft start timer tSS 4 ms SS = open 4
Soft start timer tSS 32 ms SS resistor = 50 kΩ to GND 4
Thermal shutdown threshold TSHDN 150 °C 4
Thermal shutdown hysteresis THYS 15 °C 4
Precision enable pull-down resistance REN 1.48 MΩ 3
System UVLO hysteresis VHYS 0.25 V 3
Junction-to-ambient thermal resistance, 16-lead LFCSP θJA 75.01 °C/W 4-layer PCB with thermal vias 5
Junction-to-case thermal resistance, 16-lead LFCSP θJC 55.79 °C/W Measured at top of package 5
Junction-to-top characterization parameter, 16-lead LFCSP ΨJT 0.95 °C/W 4-layer PCB with thermal vias 5

CAD (KiCad official)

  • Symbol: ADP5074ACPZ-R7
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: LFCSP-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: adp5074acpz-r7-etched.step / adp5074acpz-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adp5074acpz-r7.step / adp5074acpz-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (17 pp, sha256 93ee2210e32b89a7, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF