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John Lauer adom-fields 0.9.0: cable CM emissions, cross-section impedance solver, limit sets, board checks af6e56e

adom-fields 0.9.0

The first release of the PCB-analysis roadmap: the checks other PCB review tools make by rule of thumb, done here on the solved copper wherever a field exists, plus three new solvers.

  • Common-mode cable emissions (review.cableEmissions, cable-emissions). This is the usual reason a board fails the chamber.
    • The model: the switching loop's harmonic current flows across the ground copper's inductance between the loop and each connector's ground pin. That inductance is μ0·h × the squares of ground, taken from the solved DC ground field. The voltage it raises drives the connector's cable (spec cables, 1 m by default) as a monopole, checked against the chosen limit at 3 m.
    • Status: an upper bound with no ferrite.
    • Example: on the TPS54202 buck with 1 m cables, it lands 2–7 dB over FCC class B at 63 MHz, where the loop's own differential-mode estimate is 55 dB under.
  • Trace impedance by a 2-D field solve (review.impedance, impedance, diff-impedance).
    • The solve: every signal net's cross-section on its own layer, microstrip or stripline, with solder mask, on a non-uniform grid. It is solved in the dielectric and in air.
    • Results: Z0, εeff, ps/mm, pF/m and nH/m; Zodd, Zeven and Zdiff for pairs found by name.
    • Targets: from spec impedance, or by protocol (USB 90 Ω, PCIe 85 Ω, Ethernet/LVDS/HDMI/MIPI 100 Ω differential).
    • Accuracy: within 1 % of Hammerstad-Jensen (microstrip) and Wadell (stripline). Delays may read about 3 % fast.
  • Emission limit sets. Spec emcLimit picks the set the issues use: fcc-b (default), fcc-a, cispr32-b, cispr32-a, or a custom line from spec emcLimits (CISPR 25, MIL-STD-461 RE102, a customer's). Every emission estimate also reports its margin against every set.
  • Board checks (review.checks):
    • Ampacity: each loaded net's narrowest neck against IPC-2221's 10 °C rating, beside the solved rise there.
    • Junction temperature: ambient + the solved rise (+ θjc × W) against each hot part's tjMaxC.
    • Capacitor temperature: against each part's rating read from its value or part number. Electrolytic life uses the 10 °C rule. Ceramics with an assumed rating are grouped into one finding.
    • EMC layout rules: clocks on outer layers or near connectors, signals along the board edge, unfiltered connector I/O, and a converter's input filter against fsw/10.
    • Stackup: detects which layers are planes; flags signal layers far from a plane and adjacent signal layers; gives plane-pair capacitance.
    • Via stubs: quarter-wave resonance against the net's clock.
    • Length groups: delay skew against maxSkewPs, maxSkewMm or a protocol limit.
  • The app opens the right view for each new finding (current, temperature, EMC, signals or noise).