Adom Fields

0.10.8: a ceramic capacitor's dielectric is read from the vendor's code in its MPN field (Samsung CL05B is X7R, Murata GRM155R7 is X7R, KEMET, Walsin, TDK and Yageo too), so X7R parts aren't flagged against an assumed 85 °C rating, and the finding says why a rating was assumed (issue 31); Murata C0G parts above 1 nF are seen as C0G in the PDN model.

0.10.7: the board's ground is the net named GND (or spec ground, else the ground with the most pads), not the first ground name in the alphabet, and a rail decoupled to another ground gets a PDN verdict (issue 25); coincident lands of one pad number are one terminal named by at (issue 26); verify's stitching vias keep their copper 0.5 mm from the board edge.

0.10.6: the grid covers the whole board and a pad centred on its edge is modelled (issue 27); one board thickness, a body under the board couples at it, and a new solid-uncoupled issue says when a body is left out (issue 28); a decoupling capacitor counts when it returns to any ground the chip has a pin on, so VCC2 to PGND is no false finding (issue 29).

0.10.5: converter ground is the switch legs' return (PGND, not AGND), with spec converter.ground and the pick recorded; resistor Values with a rating or size (3m 1W, 0R003 1%) read as their resistance, spec converter.series (issue 24).

0.10.4: 4-switch buck-boost converters (inductor through a current shunt, buck and boost modes, unsupported instead of null; issue 24); impedance reference found under each trace, reported per section, mixed or missing references not given an impedance (issue 23).

0.10.3: KiCad 8 boards: numbered track and via nets resolve through the net table (issue 21); same-net copper closer than a solve cell is no longer joined by the grid, and the spots are reported (issue 22).

0.10.2: in --with pdn, each decoupling capacitor's loop inductance is solved from the copper (PEEC) where the stackup allows, with the estimate and the reason kept beside it.

0.10.1: the skill's topics install as sub-skills (adom-fields-review, -spec, -emc, -pdn, -si, -noise-rf, -verify, -views); 0.10.0: lean by default with optional modules the output says when to turn on.

0.10.0: lean by default: the core always runs, six optional modules (emc, esd, pdn, si, noise, rf) run with --with and the output says when each matters on this board; grouped findings, a lean fields.json with detail.json for the app, faster heat passes, and the skill split into a short core plus topic files.

0.9.8: a hot part is read at its exposed pad (hot..tabPad, else the largest tab-net pad), and its thermal vias include the footprint's own (issue 20).

0.9.7: skill cleanup: shorter skill description, and the two SKILL.md copies are the same again.